A rework process includes attaching a first bond head to a first semiconductor package. The contact pads of the first semiconductor package are bonded to contact pads of a second semiconductor package by solder joints. The rework process further includes performing a first local heating process to melt the solder joints, removing the first semiconductor package using the first bond head, and removing at least a portion of solder from the contact pads of the second semiconductor package.

A method of cleaning solder from the jaws of a solder ball test device including the steps of heating a gas to a temperature above the melting temperature of the solder and directing the heated has over the jaws of a solder ball test device to remove solder from the jaws, and an apparatus for carrying out the method.

A soldering apparatus comprises a soldering mechanism and a management unit. The management unit converts operation history of the soldering mechanism into a numerical value, compares the numerical value to a predetermined threshold value, and generates a notifying signal if the numerical value exceeds the predetermined threshold value. The notifying signal may result in cessation of operation of the soldering mechanism. The notifying signal may result in a visual and/or audio reminder to the operator to inspect or replace a part of the soldering mechanism. With the management unit, the operator need not guess or rely on personal experience to determine when to perform an inspection or replacement. Reliance on personal experience can be error prone and lead to inefficiency. The management unit may reduce the possibility of soldering with a degraded soldering tip or other part, which may have an adverse effect on soldering quality.

A soldering apparatus is provided with a soldering iron for soldering with a tip, a driving portion for moving the soldering iron, a storage portion that stores position information indicating a soldering position and identification information associated each other, a reading portion that reads target identification information attached to the work target, an acquiring portion that acquires position information in the storage portion matching the target identification information read by the reading portion, and a process control portion for controlling the driving portion and the soldering iron so as to perform soldering at the position indicated by the position information acquired by the acquiring portion.

The present application discloses a soldering apparatus including a soldering iron having an iron tip that melts solder, a driving portion that moves the soldering iron, and an operation portion displaced to instruct the driving portion of a moving direction of the soldering iron. While an operation on the operation portion is performed by a user, the driving portion moves the soldering iron in a direction corresponding to a displacement direction of the operation portion.

A soldering iron including an iron main body and an iron tip includes an iron tip main body having a hollow space inside extending along a longitudinal direction; an insulator tube in the hollow space; a heater wire to heat the iron tip main body, and a temperature sensor to detect a temperature of the leading end side of the iron tip, the heater wire includes: an outward route part extending towards a leading end of the iron tip, and a return route part extending towards a base end of the iron tip, while the heater wire folded back at a vicinity of the leading end of the iron tip being wound around the insulator tube, in the insulator tube, a heater wire hole to accommodate the return route part of the heater wire and a sensor wire hole to accommodate a sensor wire are formed independent of each other.

The present disclosure concerns a device for soldering the interconnections of photovoltaic panels. The device includes: an inductor, which in turn includes a filament, which substantially develops so as to form two parallel branches: a first branch and a second branch, and an insert, which has a longitudinal development, which is at least partly surrounded longitudinally by said filament and is interposed between said two branches.

Semiconductor manufacturing equipment including a main body having a bonding head, a head heater at a bottom of the bonding head, the head heater including a thermal compression surface, negative pressure channels recessed from the thermal compression surface and the negative pressure channels including holes therein, and a bonding tool having a first surface, a second surface, grooves at the first surface, the first surface configured to contact the thermal compression surface, and the second surface opposite to the first surface contacting a semiconductor chip for thermal compression may be provided.

A soldering and de-soldering station and systems including enhanced features for the soldering heating tools, load detection functionality, tip management, automatic tip temperature calibration, cartridge/handle position and movement sensing and interactive capabilities.

A soldering tip for a soldering iron is presented. In one aspect, the soldering tip is used in a hand-held soldering iron for soldering an electrical connection element on an electrically conductive structure on a substrate. The soldering tip includes a substantially hemispherical end portion. Also presented is a method for producing a pane with an electrical connection element using the soldering tip with a hand-held soldering iron.