A method for replacing a capillary of a wire bonding apparatus that includes a holding unit that holds a capillary includes transferring a capillary replacing unit to the wire bonding apparatus by a mobile robot in response to receiving a capillary replacement start signal from the wire bonding apparatus, separating, by the capillary replacing unit, the capillary corresponding to the replacement signal from the wire bonding apparatus, and installing, by the capillary replacing unit, a new capillary in the wire bonding apparatus.

A method for replacing a capillary of a wire bonding apparatus that includes a holding unit that holds a capillary includes transferring a capillary replacing unit to the wire bonding apparatus by a mobile robot in response to receiving a capillary replacement start signal from the wire bonding apparatus, separating, by the capillary replacing unit, the capillary corresponding to the replacement signal from the wire bonding apparatus, and installing, by the capillary replacing unit, a new capillary in the wire bonding apparatus.

A method of producing a vehicle glass assembly, includes (A) providing a connector made of metal plate and comprising a first flat portion, a second flat portion and a bridge portion connecting between the first and the second flat portions, each the flat portion having a respective surface to be soldered, (B) soldering lead-free solder onto the surfaces to form first and second blocks of lead-free solder on the surfaces of the first flat portion and the second flat portion, respectively, (C) providing a glass substrate layer on which an electrically conductive layer comprising a wire pattern and a busbar is formed, and (D) sandwiching the lead-free solder blocks between their respective surfaces and the busbar, and then melting the blocks to form solder connections between the connector and the busbar; wherein the amount of lead-free solder in each of the blocks is between 15 mg and 50 mg.

A method of producing a vehicle glass assembly, includes (A) providing a connector made of metal plate and comprising a first flat portion, a second flat portion and a bridge portion connecting between the first and the second flat portions, each the flat portion having a respective surface to be soldered, (B) soldering lead-free solder onto the surfaces to form first and second blocks of lead-free solder on the surfaces of the first flat portion and the second flat portion, respectively, (C) providing a glass substrate layer on which an electrically conductive layer comprising a wire pattern and a busbar is formed, and (D) sandwiching the lead-free solder blocks between their respective surfaces and the busbar, and then melting the blocks to form solder connections between the connector and the busbar; wherein the amount of lead-free solder in each of the blocks is between 15 mg and 50 mg.

A soldering tool may include a tip portion and a tool body. The tool body may include a handle and the tip portion may be operably coupled to the tool body at a flange that separates the handle from the tip portion. The tip portion may include a tip that is heated to melt solder. The flange may include an end face and a light ring disposed at the end face. The light ring may be configured to direct light toward the tip.

A soldering tool may include a tip portion and a tool body. The tool body may include a handle and the tip portion may be operably coupled to the tool body at a flange that separates the handle from the tip portion. The tip portion may include a tip that is heated to melt solder. The flange may include an end face and a light ring disposed at the end face. The light ring may be configured to direct light toward the tip.

A brazing system has a first gas source, a second gas source, an enclosure, a brazing torch, and a control system configured to control a ratio of the first gas source and the second gas source.

Disclosed are processes and apparatuses for semiconductor die removal and rework, including thin dies. In one aspect the process involves the use of a localized induction heating system to melt targeted solder joints, thereby minimizing the degradation of the thermal performance of the assembly undergoing the rework. Use of a vacuum-based die removal head, optionally in combination with the induction heating system, allows for the removal of thin dies of 150 micrometers thick or less.

The present invention discloses a vacuum reacting force soldering method, comprising the following steps: die-bonding a chip onto a substrate through soldering to form a semi-finished product; placing the semi-finished product into a vacuum eutectic cavity (6) of a vacuum eutectic stove; vacuum-pumping the vacuum eutectic cavity; preheating the vacuum eutectic cavity to slowly increase the temperature; heating the vacuum eutectic cavity quickly to melt the solder; applying an acting force to the vacuum eutectic cavity to accelerate a rise of the vacuum eutectic cavity after the vacuum eutectic cavity descends; performing forced refrigeration to the exterior of the vacuum eutectic cavity, while introducing a protective gas to the interior thereof; releasing the vacuum state of the vacuum eutectic cavity after the solder is solidified. This invention also discloses a soldering device using the vacuum reacting force eutectic soldering method described herein.

The present invention is to provide a mechanism that does not cause a situation such as corrosion of the iron tip with an air nozzle due to blowing off solder from the iron tip of the soldering iron, and a mechanism capable of coping with various shapes of iron tips. In order to achieve the object of the present invention, an iron tip cleaner device for a soldering iron includes a cleaner chamber including a wall surface and an air jetting holes that is provided in the wall surface and jets air for blowing off solder on an iron tip. The solder on the iron tip is blown off by convection air generated when the air jetted from the air jetting holes collides with the wall surface.