A soldering apparatus and method involves capturing an image of a soldering operation, and storing image data in association with that particular soldering operation. A soldering tool that is used to perform the soldering operation has a position during the soldering operation, and the image data could also be stored in association with data for that particular position. The position data could be for an operation start point and/or an operation endpoint. Associating the image data in this way could help a manufacturer investigate soldering abnormalities that might be reported after a product is shipped to a customer.

A soldering station or a soldering station system including a soldering station and a soldering iron includes a control console and an iron holder operably coupled to the control console for supporting a soldering iron. The iron holder comprises a handle support portion and a base portion operably coupling the handle support portion to the control console. The handle support portion is oriented with respect to the base portion to define an axis. The axis forms an angle of between about 10 degrees to about 40 degrees relative to a horizontal surface supporting the soldering station. The handle support portion is shaped to receive the soldering iron in a tip-up orientation. The soldering iron may include a handle, a transition portion, a shaft portion, a tip, and a longitudinal centerline.

An iron holder includes a stand body, a rest, and a heat shield configured to at least partially surround a soldering iron. The stand body includes a tip support portion, a base portion, an intermediate portion, an accessory holding portion, and a handle support portion. The tip support portion is higher in elevation than the handle support portion, creating a tip-up angle for the soldering iron to rest at. The heat shield is disposed at the tip support portion and comprises one singular piece of metal that is bent into a half-pipe shape and perforated with holes. The handle support portion has a rubberized cover for additional grip and heat insulation. The rest ensures that a tip of the soldering iron does not contact the heat shield. In the tip-up orientation, the soldering iron handle is less likely to increase in temperature from the tip of the soldering iron.

The present invention relates to a soldering tip fastening sleeve (3) comprising a soldering device fastening portion (7) and a soldering tip fastening portion (6). The soldering device fastening portion (7) has an internal measurement (15) and an external measurement. Also the soldering tip fastening portion (6) has an internal measurement (16) and an external measurement (14) as well as a collar holder (10). The soldering tip fastening portion (6) and the soldering device fastening portion (7) are associated with different ends of the soldering tip fastening sleeve (3). The soldering tip fastening sleeve (3) according to the present invention is characterized in that the collar holder (10) is provided on a first subsector (17) of a circumference of the soldering tip fastening sleeve (3). The present invention also relates to a soldering tip (2) comprising a soldering portion (4) and a fastening portion (5). The soldering tip (2) is adapted to be fixed to a soldering device (30) through the fastening portion (5), a maximum external measurement (5a) of said fastening portion (5) being equal to or smaller than a maximum external measurement (4a) of the soldering portion (4), or the soldering portion being angled. The soldering tip (2) according to the present invention is characterized in that the fastening portion (5) comprises a collar (9).

A brazing system has a first gas source, a second gas source, an enclosure, a brazing torch, and a control system configured to control a ratio of the first gas source and the second gas source.

A brazing system has a first gas source, a second gas source, an enclosure, a brazing torch, and a control system configured to control a ratio of the first gas source and the second gas source.

A brazing system has a first gas source, a second gas source, an enclosure, a brazing torch, and a control system configured to control a ratio of the first gas source and the second gas source.

The present invention defines a tool including a heating device including a method and apparatus to allow the user to check whether, or be notified when, the soldered electronic component is completely removed from a substrate after the solder is sufficiently melted.

A bond head assembly for bonding a semiconductor element to a substrate is provided. The bond head assembly includes a base structure, a heater, and a clamping system securing the heater to the base structure. The clamping system includes a plurality of elastic elements constraining the heater along a plurality of axes.

A holding stand for a heating tool such as a soldering or de-soldering device. The holding stand has a rotary member for securing the heating tool and an assembly for moving and positioning the rotary member with the heating tool in any of three axis.