The present invention provides a solder paste free of reducing agents and activators, and a method for producing a soldered product in which the solder paste is used to achieve solder bonding. The solder paste for reducing gas of the present invention is a solder paste for reducing gas used together a reducing gas. The solder paste contains a solder powder; a thixotropic agent that is solid at normal temperature; and a solvent, and is free of reducing agents for removal of oxide films and free of activators for improvement of reducibility.

To provide a heating apparatus and a method for producing a plate-like object that can heat a heating target object uniformly. The heating apparatus includes a heater 10 for heating target object W, and a support member 20 disposed on a front face 11f of the heater 10 and for supporting a face Wf of the heating target object W. The support member 20 supports the heating target object W in such a manner that: the support member 20 prevents direct heat transfer between the face Wf and the support member 20; a clearance between the front face 11f and the face Wf is maintained in a predetermined clearance S, wherein the predetermined clearance S allows a fluid to be present in the clearance but does not induce convection of the fluid. The method includes supporting the heating target object W with the support member 20, and heating the heating target object W with the heater 10 to produce the plate-like object.

To provide a heating apparatus and a method for producing a plate-like object that can heat a heating target object uniformly. The heating apparatus includes a heater 10 for heating target object W, and a support member 20 disposed on a front face 11f of the heater 10 and for supporting a face Wf of the heating target object W. The support member 20 supports the heating target object W in such a manner that: the support member 20 prevents direct heat transfer between the face Wf and the support member 20; a clearance between the front face 11f and the face Wf is maintained in a predetermined clearance S, wherein the predetermined clearance S allows a fluid to be present in the clearance but does not induce convection of the fluid. The method includes supporting the heating target object W with the support member 20, and heating the heating target object W with the heater 10 to produce the plate-like object.

The present application provides a reflow oven (100) and a gas recovery method. The reflow oven (100) comprises a reflow oven hearth (101), a separator (105), the separator inlet (110) being connected to the gas outlet (102) of the reflow oven hearth (101) so that the gases in the reflow oven hearth (101) can flow into the separator (105), a zeolite box (107), the zeolite box inlet (112) being connected to the separator outlet (111), and the zeolite box outlet (113) being connected to the gas inlet (103) of the reflow oven hearth (101) so that the gases flowing through the separator (105) can enter the zeolite box (107) and the gases flowing through the zeolite box (107) can flow out of the zeolite box outlet (113), a sensor (106), which is provided in the gas passage between said zeolite box outlet (113) and the gas inlet (103) of the reflow oven hearth (101). The reflow oven (100) in the present application enables the gases flowing through the separator (105) to enter the zeolite box (107). After most of the flux is removed from the gases in the separator (105), the flux is further removed in the zeolite box (107). In addition, polygonal zeolites have certain volumes and are supported in the zeolite box (107) to form clearances, and thus almost no resistance is brought about to the flow of the gases in the zeolite box (107).

A brazing method for brazing metal pieces together via a brazing material includes the step of, in a heating chamber controlled to a preset oxygen concentration or less, sandwiching a workpiece of which the metal plates are stacked via the brazing material between a first heating plate and a second heating plate in such a manner that the first heating plate and the second heating plate cover the workpiece entirely as viewed in a thickness direction of the workpiece, and heating the workpiece to braze the metal plates together via the brazing material.

A brazing method for brazing metal pieces together via a brazing material includes the step of, in a heating chamber controlled to a preset oxygen concentration or less, sandwiching a workpiece of which the metal plates are stacked via the brazing material between a first heating plate and a second heating plate in such a manner that the first heating plate and the second heating plate cover the workpiece entirely as viewed in a thickness direction of the workpiece, and heating the workpiece to braze the metal plates together via the brazing material.

A hot-forming die has a heatable lower die and a heatable upper die. The lower die and the upper die have spacer elements to permit flexing. A plate stack including two plate elements is inside the hot-forming die. The plate stack is on the spacer elements in the lower die. The lower die and the upper die are displaced relative to each other when the hot-forming die is closed. The spacer elements of the upper die come into contact with the plate stack. As the closing movement continues, the spacer elements, are displaced into the lower die and the upper die, respectively, and the plate stack is clamped between the lower die and the upper die. The plate stack is then heated by the lower die and the upper die and an internal pressure is applied to an intermediate space between the plate elements by feeding in an active medium.

A hot-forming die has a heatable lower die and a heatable upper die. The lower die and the upper die have spacer elements to permit flexing. A plate stack including two plate elements is inside the hot-forming die. The plate stack is on the spacer elements in the lower die. The lower die and the upper die are displaced relative to each other when the hot-forming die is closed. The spacer elements of the upper die come into contact with the plate stack. As the closing movement continues, the spacer elements, are displaced into the lower die and the upper die, respectively, and the plate stack is clamped between the lower die and the upper die. The plate stack is then heated by the lower die and the upper die and an internal pressure is applied to an intermediate space between the plate elements by feeding in an active medium.

The present application relates to a reflow soldering oven (1) for soldering an electronic circuit board (300), the oven (1) comprising a gas purification system (11, 21) for purifying gas that contains flux components vaporized from the electronic circuit board (300). The gas purification system further comprises at least one gas purification unit (11, 21) comprising a catalyst unit comprising a catalyst material. The invention further relates to a corresponding reflow soldering method.

The present application relates to a reflow soldering oven (1) for soldering an electronic circuit board (300), the oven (1) comprising a gas purification system (11, 21) for purifying gas that contains flux components vaporized from the electronic circuit board (300). The gas purification system further comprises at least one gas purification unit (11, 21) comprising a catalyst unit comprising a catalyst material. The invention further relates to a corresponding reflow soldering method.