The present application relates to a stencil device (150) for simultaneous stencil printing of brazing material onto elevations, areas surrounding port openings, and a circumferential skirt (210) of a heat exchanger plate (200) wherein the stencil device (150) comprises an upper stencil having openings for applying brazing material to elevations and areas surrounding port openings of the heat exchanger plate (200) and a lower stencil printing stencil (150) having a large opening (190) for receiving the heat exchanger plate (200) and contacting an outer perimeter of the circumferential skirt (210) of the heat exchanger plate (200), wherein an inner surface (195) of the large opening (190) comprises brazing material exits (160) for applying brazing material to the circumferential skirts (195). Disclosed is also a method of such stencil printing and also the use of a stencil device for applying heat exchanger plates (200) with a brazing material.

Selective soldering system for selective wave soldering of circuit boards, including a solder pot, a solder nozzle which can be detachably arranged on the solder pot, wherein the solder nozzle has a nozzle base and a nozzle neck, wherein at the free end of the nozzle neck a nozzle opening is provided, the solder pot being arranged on a moving unit, which can be moved along an x and y axis in a horizontal plane and along a z axis in the vertical direction, and a control unit for controlling the moving unit.

Selective soldering system for selective wave soldering of circuit boards, including a solder pot, a solder nozzle which can be detachably arranged on the solder pot, wherein the solder nozzle has a nozzle base and a nozzle neck, wherein at the free end of the nozzle neck a nozzle opening is provided, the solder pot being arranged on a moving unit, which can be moved along an x and y axis in a horizontal plane and along a z axis in the vertical direction, and a control unit for controlling the moving unit.

The present invention relates to a reel-to-reel layer reflow method, which emits a uniformized laser beam, which can easily adjust the emission area, and which is for the purpose of improving productivity. An embodiment of the present invention provides a reel-to-reel layer reflow method comprising the steps of: a) transferring a substrate, which has been wound in a roll type, to one side while unwinding the same; b) forming a solder portion on the substrate; c) seating an emission target element on the solder portion and seating a non-emission target element on the substrate; d) surface-emitting a laser beam to the solder portion, on which the emission target element is seated, such that the emission target element is attached to the substrate; e) inspecting the substrate structure manufactured through said step d); and f) winding the substrate structure in a roll type.

A solder member mounting method includes providing a substrate having bonding pads formed thereon, detecting a pattern interval of the bonding pads, selecting one of solder member attachers having different pattern intervals from each other, such that the one selected solder member attacher of the solder member attachers has a pattern interval corresponding to the detected pattern interval of the bonding pads, and attaching solder members on the bonding pads of the substrate, respectively, using the one selected solder member attacher.

Systems and methods for applying solder to a pin. The methods comprising: disposing a given amount of solder on a non-wettable surface of a planar substrate; aligning the pin with the solder disposed on the non-wettable surface of the planar substrate; inserting the pin in the solder; and/or performing a reflow process to cause the solder to transfer from the planar substrate to the pin.

A system is provided for wire processing. The wire processing system may include a wire transport, a processing station that may provide wire to the wire transport, a processing station that may move an electrical component threaded onto the wire, and a processing station that may move the electrical component to a position on the wire for further processing.

A stencil printer is configured to print an assembly material on an electronic substrate. The stencil printer includes a frame, a stencil coupled to the frame, a support assembly coupled to the frame, and a print head gantry coupled to the frame. The print head gantry includes an elongate beam that rides along rails provided on the frame and a print head assembly supported by the print head gantry in such a manner that the print head assembly is configured to traverse the stencil during print strokes. The print head assembly includes a print head having a squeegee blade assembly configured to roll solder paste along the stencil. The stencil printer further includes a solder paste bead recovery system configured to remove a bead of solder paste from a top surface of the stencil and to deposit the bead of solder paste onto a new replacement stencil.

A cleaning material, device, and method for predictably cleaning the capillary tube for a wire bonding machine in which the cleaning pad has a predetermined configuration appropriate for the particular wire bonding machine and a substrate having a defined functionalized surface topology and geometry which can be introduced into the wire bonding machine during the normal wire bonding operations. The cleaning material has a predetermined topography with a plurality of functional 3-dimensional (3D) microstructures that provide performance characteristics which are not possible with a non-functionalized and flat surface.

An injection apparatus for injection material is disclosed. The injection apparatus includes a tank for storing material. The injection apparatus further includes a head body that has a surface for contacting a substrate and an opening part opened at the surface for discharging the material in fluid-communication with the tank. The injection apparatus further includes a member connected to the opening part, in which the member allows gas to flow into and flow out from the opening part.