B23K3/06

SOLDERING NOZZLE AND SOLDERING INSTALLATION
20210039183 · 2021-02-11 · ·

The invention relates to a soldering nozzle for the simultaneous selective wave soldering of at least two spaced-apart rows of solder joints in a soldering installation, with a base portion which can be arranged on a nozzle plate, and with a wave portion which forms the solder wave during operation and which has a peripheral wall having a free upper side, and with at least one separating strip which can be inserted into the wave portion and which can be wetted with solder, wherein the at least one separating strip is formed as a frameless separating strip. The invention also relates to a soldering installation having a nozzle plate and having at least one soldering nozzle.

NOZZLE, SYSTEM AND METHOD
20210060678 · 2021-03-04 ·

A nozzle for directing a stream of solder during a soldering operation is disclosed. The nozzle comprising a body portion having an inlet for receiving a supply of solder; an outlet portion having one or more outlets for dispensing solder therefrom; and at least one channel fluidly coupling the inlet to the one or more outlets. Therein the outlet portion is adapted to be arranged above the inlet, such that, in use, solder flows from the inlet to the outlet portion along the at least one channel in a generally upward direction. The outlet portion has first and second over-flow sections, each over-flow section being integral with, or connected to, a peripheral edge of an outlet of the one or more outlets, such that in use, the solder is dispensed from an outlet of the one or more outlets and flows over the first and/or second over-flow section. At least a portion of the first over-flow section has a first width, such that in use, solder flowing over the first over-flow section produces a stream of solder with a width substantially corresponding to the first width. At least a portion of the second over-flow section has a second width, different to the first width, such that in use, solder flowing over the second over-flow section produces a stream of solder with a width substantially corresponding to the second width. A method of manufacturing a nozzle of this type and a method of soldering a component with a nozzle of this type are also disclosed.

Attaching an SMD to an insulating layer with a solder joint in a cavity formed in an insulating layer

The invention relates to a method (S) for attaching an SMD to a printed circuit (10), comprising the following steps: applying an insulating layer (20) (S1) onto the printed circuit (10), forming a cavity (22) in the insulating layer (20) above the conductive layer (12) (S2) of the printed circuit, filling the cavity (22) with a solder paste (3), positioning the SMD over the cavity (22) (S4), and applying a heat treatment (S5) to the printed circuit (10).

SOLDERING ASSEMBLY, METHOD AND USE
20210060676 · 2021-03-04 ·

A soldering assembly and a method of manufacturing a soldering assembly is disclosed. The soldering assembly includes at least one nozzle for directing solder during a soldering operation. The at least one nozzle includes an inlet for receiving a supply of solder; an outlet for dispensing solder therefrom; and at least one channel fluidly coupling the inlet to the outlet. The at least one nozzle comprises a plurality of stacked layers of stainless steel or titanium, provided so as to at least partially define the at least one channel. The at least one nozzle is at least partially diffusion coated with chromium carbide so as to protect the stacked layers from corrosion.

LED package using electroform stencil printing
10916689 · 2021-02-09 · ·

A light emitting device comprises a reflector cup coupled to a base that defines a cavity. The base comprises a plurality of metal pads exposed on a bottom surface of the cavity. The base further comprises a plurality of protrusions arranged around a perimeter of the base and disposed inside one or more side surfaces of the reflector cup. The light emitting device comprises an LED die disposed over the bottom surface of the cavity. The LED die is coupled to the metal pads with gold-tin solder. The LED die has a footprint that is at most 30% smaller than an area of a top opening of the cavity.

Metering apparatus

The invention relates to an apparatus for metering a medium comprising a base element provided for fastening to a robot, a metering valve movably supported at the base element, and at least one piezo actuator by which the metering valve is movable relative to the base element.

Metering apparatus

The invention relates to an apparatus for metering a medium comprising a base element provided for fastening to a robot, a metering valve movably supported at the base element, and at least one piezo actuator by which the metering valve is movable relative to the base element.

Soldering nozzle and method for the production thereof
20210060677 · 2021-03-04 ·

A soldering nozzle (100) for selectively soldering assemblies by means of molten solder supplied through a soldering nozzle (100) from a solder bath. The soldering nozzle (100) is designed as a deep-drawn part. A method for the production of a soldering nozzle (100) is specified as well, including the provision of a blank (401); the drawing of the blank (401) through at least one female die (411, 421) by means of at least one male die (413, 422, 431) to produce an oblong shape (439) of locally annular or substantially annular cross-section, with a first end (436) corresponding to an action point of the male die (413, 422, 431) and a second end (437) corresponding to an introduction cross-section of the male die (413, 422, 431), the cross-section preferably increasing from the first end (436) towards the second end (437); and the formation of an opening (446) at the tip end (436).

Aluminum based solderable contact

A method of producing a solderable aluminum contact comprises formulating an ink, applying the ink to an aluminum substrate to form an ink layer on a surface of the aluminum substrate, and melting the ink layer. The ink includes a solderable element that is conductive. The melting of the ink layer forms an alloy on the surface of the aluminum substrate including the solderable element.

IR non-contact temperature sensing in a dispenser

A dispensing system includes an optional pre-heat station configured to receive an electronic substrate, a dispense station configured to dispense material on the electronic substrate received from the optional pre-heat station, an optional post-heat station configured to receive the electronic substrate from the dispense station, and a non-contact sensor positioned above the electronic substrate on at least one of the optional pre-heat station, the dispense station, and the optional post-heat station.