The invention relates to an apparatus for especially thermally joining micro-electromechanical parts (2, 3) in a process chamber (8), comprising a bottom support plate (11) for holding at least one first (2) of the parts (2, 3) to be joined, and a pressing device (15) for applying pressure to at least one second (3) of the parts (2, 3) to be joined in relation to the at least one first part (2). The pressing device (15) is equipped with an expandable membrane (19) provided for entering in contact with the at least one second part (3). Fluid pressure, in particular gas pressure, can be applied to said membrane (19) on the side thereof facing away from the parts (2, 3) to be joined.

A screen (24A-H) of a specified thickness (T) for insertion in a gap (32) between surfaces of workpieces (32, 34) to be joined by brazing. The screen thickness determines and maintains the gap thickness during brazing. The screen has a higher melting point than the braze filler material (22), is wettable by a melt of the braze filler material, and may have a higher tensile strength than the braze filler material at operating temperatures of the braze joint. The screen may include electrical resistance heating wires (52, 62) to melt the filler material (46). The screen may be covered by the filler material, forming a brazing foil (20B). The screen may include electrically conductive insulated wires (92, 93) connected to a sensor (95) such as a thermocouple or strain gauge to monitor a condition of the braze joint during subsequent operation.

A screen (24A-H) of a specified thickness (T) for insertion in a gap (32) between surfaces of workpieces (32, 34) to be joined by brazing. The screen thickness determines and maintains the gap thickness during brazing. The screen has a higher melting point than the braze filler material (22), is wettable by a melt of the braze filler material, and may have a higher tensile strength than the braze filler material at operating temperatures of the braze joint. The screen may include electrical resistance heating wires (52, 62) to melt the filler material (46). The screen may be covered by the filler material, forming a brazing foil (20B). The screen may include electrically conductive insulated wires (92, 93) connected to a sensor (95) such as a thermocouple or strain gauge to monitor a condition of the braze joint during subsequent operation.

A method includes placing a first package component over a vacuum boat, wherein the vacuum boat comprises a hole, and wherein the first package component covers the hole. A second package component is placed over the first package component, wherein solder regions are disposed between the first and the second package components. The hole is vacuumed, wherein the first package component is pressed by a pressure against the vacuum boat, and wherein the pressure is generated by a vacuum in the hole. When the vacuum in the hole is maintained, the solder regions are reflowed to bond the second package component to the first package component.

A welding quality processing method and device, and a circuit board. The method includes: obtaining warpage data of each circuit board layer in a multi-layer circuit board under a preset welding temperature change curve; performing simulation according to a stacked state of the multi-layer circuit board and the warpage data to generate a warpage level of each region in the multi-layer circuit board in the stacked state; and processing the multi-layer circuit board according to the warpage level.

A welding quality processing method and device, and a circuit board. The method includes: obtaining warpage data of each circuit board layer in a multi-layer circuit board under a preset welding temperature change curve; performing simulation according to a stacked state of the multi-layer circuit board and the warpage data to generate a warpage level of each region in the multi-layer circuit board in the stacked state; and processing the multi-layer circuit board according to the warpage level.

A solder and methods of forming an electrical interconnection are shown. Examples of solders include gallium based solders. A solder including gallium is shown that includes particles of other solders mixed with a gallium based matrix. Methods of applying a solder are shown that include swiping a solder material over a surface that includes a resist pattern. Methods of applying a solder are also shown that include applying a solder that is immersed in an acid solution that provides a fluxing function to aid in solder adhesion.

A solder and methods of forming an electrical interconnection are shown. Examples of solders include gallium based solders. A solder including gallium is shown that includes particles of other solders mixed with a gallium based matrix. Methods of applying a solder are shown that include swiping a solder material over a surface that includes a resist pattern. Methods of applying a solder are also shown that include applying a solder that is immersed in an acid solution that provides a fluxing function to aid in solder adhesion.

Systems and methods are disclosed for integrated compressed air cooling for welding systems. In particular, the disclosed systems and methods may employ compressed air to implement one or more welding processes (e.g., a gouging or cutting processes), with the compressed air being conveyed through such welding systems. In some examples, the compressed air is routed within the welding system to provide cooling for one or more components therein. For instance, components such as power conversion circuitry may heat up during the welding process. Routing compressed air to or near the components will introduce relatively cool air to the environment. As the passing compressed air heats in response to interaction with the heated components, heat is drawn from the components and/or the nearby environment.

A soldered product manufacturing device 1 includes a stage 13 on which a substrate W is placed, solder being arranged on the substrate W; a cover 16 configured to cover at least an upper part of the substrate W placed on the stage 13 at a predetermined distance therefrom; a chamber 11 configured to house the stage 13 and the cover 16; a heater 15 configured to heat the substrate W on the stage 13; and a reducing gas supply device 19 configured to supply a reducing gas F. A method for manufacturing a soldered product includes, by using the soldered product manufacturing device 1, placing the substrate W on the stage 13; covering the substrate W placed on the stage 13 with the cover 16; heating the substrate W; and supplying the reducing gas F into the chamber 11.