A soldering jig for double-faced cooling power modules is provided. The soldering jig prevents thermal deformation of a substrate during a soldering process. The soldering jig is used to fix the position of an upper substrate and a lower substrate when a semiconductor chip is disposed and soldered between the upper and lower substrates. The soldering jig includes a lower jig plate that is disposed under the lower substrate and fixes the position of lower substrate, an upper jig plate that is disposed over the upper substrate and compresses the upper substrate toward the lower substrate. Additionally, a connector which couples the lower jig plate and the upper jig plate, and an insert is installed on the connector and is disposed between the upper substrate and the lower substrate to maintain a constant distance between the upper substrate and the lower substrate during a soldering process.

Provided are a soldering apparatus that allows a gasket to be easily attached to and detached from the soldering apparatus, and a method of fixing the gasket to the soldering apparatus. The soldering apparatus includes: a furnace body; a gasket that is provided to at least a part of the furnace body, and that seals the furnace body; and a push rivet that fixes the gasket in an attachable/detachable manner to the furnace body.

Provided are a soldering apparatus that allows a gasket to be easily attached to and detached from the soldering apparatus, and a method of fixing the gasket to the soldering apparatus. The soldering apparatus includes: a furnace body; a gasket that is provided to at least a part of the furnace body, and that seals the furnace body; and a push rivet that fixes the gasket in an attachable/detachable manner to the furnace body.

The invention relates to a method for cleaning the process gas in soldering installations and solder suction systems, in particular for reducing the abietic acid in the process gas, wherein the process gas to be cleaned is conducted through a cleaning system which contains one or more of the following compounds (cleaning compounds): a) carboxylic acids with reducing properties, namely oxalic acid, formic acid, citric acid and/or ascorbic acid: b) metal compounds of higher oxidation states, namely manganates, permanganates, chromates and/or dichromates; c) alcohols which can be convened into the carboxylic acids mentioned in a) by means of oxidation; d) basic lime compounds.

The invention relates to a method for cleaning the process gas in soldering installations and solder suction systems, in particular for reducing the abietic acid in the process gas, wherein the process gas to be cleaned is conducted through a cleaning system which contains one or more of the following compounds (cleaning compounds): a) carboxylic acids with reducing properties, namely oxalic acid, formic acid, citric acid and/or ascorbic acid: b) metal compounds of higher oxidation states, namely manganates, permanganates, chromates and/or dichromates; c) alcohols which can be convened into the carboxylic acids mentioned in a) by means of oxidation; d) basic lime compounds.

A method for manufacturing a ceramic heater-type glow plug that includes: a ceramic heater; a metallic outer cylinder that holds the ceramic heater at one end and has the other end inserted in and fixed to a metallic housing; and lead wire that is connected to the ceramic heater and electrifies the ceramic heater, the method for manufacturing a ceramic heater-type glow plug includes the steps of: forming a metalized layer in a region of the ceramic heater that is connected to the lead wire; press-inserting at least the metalized layer of the ceramic heater in a connection fitting that connects the ceramic heater and the lead wire; and heating the ceramic heater and the connection fitting at a temperature at which a material for forming the metalized layer is brought into a semi-molten state and joining by mass transfer between the connection fitting and a solid layer of the metalized layer.

Methods and associated structures of forming a package structure including forming a low melting point solder material on a solder resist opening location of an IHS keep out zone, forming a sealant in a non SRO keep out zone region; attaching the IHS to the sealant, and curing the sealant, wherein a solder joint is formed between the IHS and the low melting point solder material.

A tool and a method of reflow are provided. In various embodiments, the tool includes a chamber unit, a wafer lifting system, a heater, and an exhausting unit. The wafer lifting system is disposed in the chamber unit. The heater is coupled to the chamber unit, and configured to heat the wafer. The exhausting unit coupled to the chamber unit, and configured to exhaust gas in the chamber unit. The wafer lifting system is configured to receive and move the wafer in the chamber unit, and to provide a vertical distance between the heater and the wafer in the chamber unit.

A tool and a method of reflow are provided. In various embodiments, the tool includes a chamber unit, a wafer lifting system, a heater, and an exhausting unit. The wafer lifting system is disposed in the chamber unit. The heater is coupled to the chamber unit, and configured to heat the wafer. The exhausting unit coupled to the chamber unit, and configured to exhaust gas in the chamber unit. The wafer lifting system is configured to receive and move the wafer in the chamber unit, and to provide a vertical distance between the heater and the wafer in the chamber unit.

A collet for attachment to distal portion (16) of a die-transporting shank (17), which comprises: a body (13) having a through hole (2) in its centre; said hole (2) consisting of three sections (3, 6, 7); first section (3) adjacent the proximal end (4) of the body (13), shaped to receive a protrusion on the shank distal portion (16); second section (6) adjacent the first section (3), linking the first section (3) to third section (7); said third section (7) opening to distal end (11) of the body (13); and an insert (14) having a through hole (10) in its centre, fitted into the third section (7); said insert hole (10) being smaller in diameter than that of the second section (6); distal portions of the body (13) and the insert (14) being of frusto-conical shape, having a flat-ended insert portion (12) extending beyond the distal end (11) of the body (13).