The present application discloses a reflow oven and the operation method thereof. The reflow oven can operate in air mode and inert gas mode. The reflow oven comprises a heating zone, a blocked exhaust zone and a cooling zone. The reflow oven further comprises a first pipeline, a second pipeline and a third pipeline. When the reflow oven operates in air mode, external clean air is delivered to the heating zone and is discharged from the heating zone and the blocked exhaust zone. When the reflow oven operates in inert gas mode, an inert gas is delivered from the blocked exhaust zone to the heating zone and is discharged from the heating zone. Satisfying the accurate temperature profiling necessary for reflow processing in the operation atmosphere of air or an inert gas, the reflow oven in the present application can effectively discharge volatile pollutants to reduce the number of follow-up services and maintenances. In addition, the reflow oven in the present application can save the expensive inert gas.

A soldering device according to an embodiment includes a jet nozzle and a cover. The jet nozzle jets a molten solder. The cover is filled with an inert gas in an inside thereof and has a hole part at a position that corresponds to the jet nozzle. The cover causes the jet nozzle to protrude from the hole part for an application time period when the solder is applied to an application target and houses the jet nozzle in the inside thereof for a waiting time period other than the application time period.

A soldering device according to an embodiment includes a jet nozzle and a cover. The jet nozzle jets a molten solder. The cover is filled with an inert gas in an inside thereof and has a hole part at a position that corresponds to the jet nozzle. The cover causes the jet nozzle to protrude from the hole part for an application time period when the solder is applied to an application target and houses the jet nozzle in the inside thereof for a waiting time period other than the application time period.

A system includes a fixture, a laser assembly, and a positioning assembly. The fixture is configured to hold (i) a substrate of a distal-end assembly of a catheter and (ii) a lead placed on a given solder pad disposed on the substrate, the laser assembly is configured to emit a laser beam, and the positioning assembly is configured to move the fixture, with the substrate and the lead, relative to the laser assembly, so as to mark a soldering position, at which the lead is to be attached to the given solder pad, with a laser spot of the laser beam.

A system includes a fixture, a laser assembly, and a positioning assembly. The fixture is configured to hold (i) a substrate of a distal-end assembly of a catheter and (ii) a lead placed on a given solder pad disposed on the substrate, the laser assembly is configured to emit a laser beam, and the positioning assembly is configured to move the fixture, with the substrate and the lead, relative to the laser assembly, so as to mark a soldering position, at which the lead is to be attached to the given solder pad, with a laser spot of the laser beam.

An apparatus for fabricating an internally finned pressure vessel includes a plurality of positioning discs, each of the positioning discs defining a plurality of circumferentially spaced slots extending radially into the positioning disc from a perimeter thereof, and one or more rods extending through the plurality of positioning discs, the plurality of positioning discs being held in axial alignment by the one or more rods. A method of fabricating the internally finned pressure vessel includes providing the apparatus, loading a plurality of fins into the slots of the positioning discs, inserting the apparatus containing the plurality of fins into a pressure vessel, attaching the plurality of fins to the pressure vessel by a brazing process, and removing the apparatus from the pressure vessel.

By a method of determining the state of an iron tip according to the present invention, in a soldering device including: an iron tip that includes a solder hole into which a solder piece is supplied and that heats and melts the solder piece in the solder hole; a gas supply source that supplies a gas; and a gas supply portion that makes the gas supply source communicate with the solder hole and that supplies the gas from the gas supply source into the solder hole, the total flow rate of the gas flowing through the gas supply portion or a supply pressure is constant, a physical quantity of the gas flowing within the gas supply portion is measured and the measured physical quantity is compared with a previously provided reference value or table such that the state of the iron tip is determined. In this way, it is possible to constantly accurately determine the state of the iron tip.

By a method of determining the state of an iron tip according to the present invention, in a soldering device including: an iron tip that includes a solder hole into which a solder piece is supplied and that heats and melts the solder piece in the solder hole; a gas supply source that supplies a gas; and a gas supply portion that makes the gas supply source communicate with the solder hole and that supplies the gas from the gas supply source into the solder hole, the total flow rate of the gas flowing through the gas supply portion or a supply pressure is constant, a physical quantity of the gas flowing within the gas supply portion is measured and the measured physical quantity is compared with a previously provided reference value or table such that the state of the iron tip is determined. In this way, it is possible to constantly accurately determine the state of the iron tip.

A circuit board clamp includes a clamp frame having a first and second frame supports. The clamp frame also includes a top plate arranged between the first and second frame supports. The top plate supports a piston via a threaded fastener engaging a top plate aperture. The piston may be displaced relative to the top plate in accordance with adjustment of the threaded fastener. A pressure plate assembly has a pressure plate and a stem attached to the pressure plate. The stem is positioned within a tubular section of the piston, and the pressure plate is positioned opposite the circuit board from the heat sink. The pressure plate contacts a surface mounted integrated circuit between the circuit board and the pressure plate. A bias member is seated on the bias seat and applies a biasing force on the pressure plate.

The laser reflow apparatus of the present invention comprises a laser pressurization head module for pressing a bonding object, which includes a plurality of electronic components arranged on a substrate by a transmissive pressurization member while irradiating a laser beam through the pressurization member, to bond the electronic components to the substrate; and a bonding object transfer module for transferring the bonding object having transferred from one side of the laser pressurization head module to carry the bonding object to the other side thereof after passing through a reflow process of the laser pressurized head module.