A surface treatment system includes a holder configured to secure an object within the holder and a surface treatment device that is configured to treat a surface of the object within the holder with two types of surface treatments. The device is capable of producing a plasma or a flame at its nozzle for surface treatment. By controlling the materials supplied to the device and the way in which is operated, either a flame or plasma is produced. Thus, the surface treatment system is capable of treating a wide range of materials for printing by a direct-to-object printer.

Adhesive matter remaining at the end of a cuboid metal material is reliably removed in a relatively short time while suppressing the decrease in yield rate of the metal material. Distances of the upper surface and the lower surface of a cuboid metal material from a reference position are measured using a distance measurement device in the longitudinal direction of the slab including the longitudinal end of the slab. On the basis of the measurement results, the state of remaining of adhesive matter remaining on the upper and lower surfaces of the longitudinal end of the slab is comprehended. On the basis of the state of remaining of adhesive matter, the amount and position of cutting by a cutting tool is determined. Corner removing cutting is performed on the upper and lower surfaces of the longitudinal end of the slab using the cutting tool in accordance with the determined amount and position of cutting.

Adhesive matter remaining at the end of a cuboid metal material is reliably removed in a relatively short time while suppressing the decrease in yield rate of the metal material. Distances of the upper surface and the lower surface of a cuboid metal material from a reference position are measured using a distance measurement device in the longitudinal direction of the slab including the longitudinal end of the slab. On the basis of the measurement results, the state of remaining of adhesive matter remaining on the upper and lower surfaces of the longitudinal end of the slab is comprehended. On the basis of the state of remaining of adhesive matter, the amount and position of cutting by a cutting tool is determined. Corner removing cutting is performed on the upper and lower surfaces of the longitudinal end of the slab using the cutting tool in accordance with the determined amount and position of cutting.

A wire electrical discharge machine includes a wire feeding hole position acquisition unit configured to obtain a position of a wire feeding hole that allows for insertion and feeding of a wire electrode. In this wire electrical discharge machine, when the position of the wire feeding hole obtained by the wire feeding hole position acquisition unit is deviated from a wire feeding position defined by a machining program, a wire feeding control unit controls a machine main body to move the wire electrode to the position of the wire feeding hole and feed the wire electrode there, and a machining control unit controls the machine main body to perform electrical discharge machining on a workpiece with the wire electrode while moving the wire electrode on a path segment between a position where the wire electrode has been fed and the wire feeding position defined by the machining program.

A wire electrical discharge machine includes a wire feeding hole position acquisition unit configured to obtain a position of a wire feeding hole that allows for insertion and feeding of a wire electrode. In this wire electrical discharge machine, when the position of the wire feeding hole obtained by the wire feeding hole position acquisition unit is deviated from a wire feeding position defined by a machining program, a wire feeding control unit controls a machine main body to move the wire electrode to the position of the wire feeding hole and feed the wire electrode there, and a machining control unit controls the machine main body to perform electrical discharge machining on a workpiece with the wire electrode while moving the wire electrode on a path segment between a position where the wire electrode has been fed and the wire feeding position defined by the machining program.

A surface treatment system includes a holder configured to secure an object within the holder and a surface treatment device that is configured to treat a surface of the object within the holder with two types of surface treatments. The device is capable of producing a plasma or a flame at its nozzle for surface treatment. By controlling the materials supplied to the device and the way in which is operated, either a flame or plasma is produced. Thus, the surface treatment system is capable of treating a wide range of materials for printing by a direct-to-object printer.

A surface treatment system includes a holder configured to secure an object within the holder and a surface treatment device that is configured to treat a surface of the object within the holder with two types of surface treatments. The device is capable of producing a plasma or a flame at its nozzle for surface treatment. By controlling the materials supplied to the device and the way in which is operated, either a flame or plasma is produced. Thus, the surface treatment system is capable of treating a wide range of materials for printing by a direct-to-object printer.

A surface treatment system includes a holder configured to secure an object within the holder and a surface treatment device that is configured to treat a surface of the object within the holder with two types of surface treatments. The device is capable of producing a plasma or a flame at its nozzle for surface treatment. By controlling the materials supplied to the device and the way in which is operated, either a flame or plasma is produced. Thus, the surface treatment system is capable of treating a wide range of materials for printing by a direct-to-object printer.

A surface treatment system includes a holder configured to secure an object within the holder and a surface treatment device that is configured to treat a surface of the object within the holder with two types of surface treatments. The device is capable of producing a plasma or a flame at its nozzle for surface treatment. By controlling the materials supplied to the device and the way in which is operated, either a flame or plasma is produced. Thus, the surface treatment system is capable of treating a wide range of materials for printing by a direct-to-object printer.

Systems and methods suitable for cutting a material and deburring devices for performing a deburring operation on an edge of the material. Such a system includes a frame and table systems supported by the frame. Each table system includes a table for supporting the material and each table system is independently movable relative to the frame in lateral directions. A first carriage unit and second carriage units are supported by the frame and independently operable to travel in a travel direction transverse to the lateral directions. The first carriage unit includes multiple cutting devices, and the second carriage units includes multiple deburring devices. Each cutting device operates in conjunction with a corresponding one of the deburring devices, and the cutting and deburring devices are independently operable to cause the cutting devices and the deburring devices to simultaneously travel in the travel direction.