An outer mask used when manufacturing a photo mask by etching an object to be processed, the object having a surface on which a pattern portion is provided, the outer mask includes: a base portion exhibiting a plate shape and including an opening in a central region, and a frame portion exhibiting a frame shape and provided along a periphery of the base portion. The frame portion has a surface which contacts the surface of the object at four corners of the surface of the object.

The present inventive concept discloses design providing for the mounting of a CNC cutting machine upon a sturdily framed wheeled vehicle. The vehicular cutting machine can then be transported upon its own integral structure, to practically any jobsite. This mobility is a particular advantage to the customer at the jobsite where there is a requirement for a smaller number of precision parts in a short time during a plant or facility start-up, shutdown, or power outage. The inventive concept presents a method of use of CNC cutting machines that has not been used in the metal-cutting industry, oftentimes because of harsh road environments or the sheer difficulty of designing and building a self-powered, self-equipped CNC cutting machine. The present inventive concept negates the problems previously encountered by the prior art, and makes possible a cutting machine which is transportable and immediately available for operation upon reaching a designated website.

A swirl ring for a plasma arc torch includes a body configured to at least partially surround and slidingly engage an electrode of the plasma arc torch. The body includes a first end and a second end opposite the first end, the first and second ends defining a longitudinal axis, and at least one protuberance extending from the second end in a direction of the longitudinal axis. The at least one protuberance is configured to engage a switch of the plasma arc torch for sensing a presence of a swirl ring in the plasma arc torch.

Methods of dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. In an example, a method of dicing a semiconductor wafer having a plurality of integrated circuits involves forming a mask above the semiconductor wafer, the mask composed of a layer covering and protecting the integrated circuits. The mask is then patterned with a split laser beam laser scribing process, such as a split shaped laser beam laser scribing process, to provide a patterned mask with gaps, exposing regions of the semiconductor wafer between the integrated circuits. The semiconductor wafer is then plasma etched through the gaps in the patterned mask to singulate the integrated circuits.

Methods of dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. In an example, a method of dicing a semiconductor wafer having a plurality of integrated circuits involves forming a mask above the semiconductor wafer, the mask composed of a layer covering and protecting the integrated circuits. The mask is then patterned with a split laser beam laser scribing process, such as a split shaped laser beam laser scribing process, to provide a patterned mask with gaps, exposing regions of the semiconductor wafer between the integrated circuits. The semiconductor wafer is then plasma etched through the gaps in the patterned mask to singulate the integrated circuits.

A surface processing equipment using energy beam including a multi-axis platform, a surface profile measuring device, an energy beam generator and a computing device is provided. The multi-axis platform is configured to carry a workpiece and move the workpiece to the first position or the second position. The surface profile measuring device has a working area, and the first position is located on the working area. The surface profile measuring device is configured to measure the workpiece to obtain surface profile. The energy beam generator is configured to provide an energy beam to the workpiece for processing, and the second position is located on a transmission path of the energy beam. The computing device is connected to the surface profile measuring device and the energy beam generator. The computing device adjusts the energy beam generator according to the error profile.

A plasma cutting system includes a power supply that outputs first and second plasma cutting currents. A torch is connected to the power supply and includes a first cathode that receives the first plasma cutting current, a first electrode and swirl ring, a second cathode that receives the second plasma cutting current, and a second electrode and swirl ring. The torch simultaneously generates a first and second plasma arcs from the electrodes. A gas controller is configured to separately control a flow of a first plasma gas to the first swirl ring and a flow of a second plasma gas flow to the second swirl ring. A torch actuator moves the torch during cutting, and includes a motor having a hollow shaft rotor for rotating the torch during cutting. A motion controller is operatively connected to the torch actuator to control movements of the torch during cutting.

In some aspects, methods for controlling a plasma arc in a plasma torch of a plasma cutting system in a low operating current mode can include: receiving, by a computing device within the plasma power supply, a command to begin a plasma processing operation; generating a pilot arc command to generate a pilot arc within the plasma torch, the generating of the pilot arc command including directing an electrical signal and a gas flow to the plasma torch, the electrical signal being configured to generate the pilot arc at a current having a first arc amperage magnitude; and generating an operational arc command to facilitate a transition from the pilot arc to an operational plasma arc, the generating of the operational arc command including adjusting the current directed to the plasma torch to be a second arc amperage magnitude that is lower than the first arc amperage magnitude.

In some aspects, methods for controlling a pneumatic system in a plasma arc processing system can include: receiving, by a computing device, a command to begin a plasma processing operation; generating a valve command signal for a valve that includes an operational drive voltage of at least about 125% of a continuous duty cycle coil voltage rating of the valve to open the valve; and once open, adjusting the valve command signal to facilitate a steady state operation to: monitor a steady state operational duty cycle of the valve, the steady state operational duty cycle being determined by comparing the continuous duty cycle coil voltage rating of the valve to an actual operational drive voltage supplied to the valve, and control the operational drive voltage supplied to the valve to maintain a steady state operational duty cycle of the valve at less than about 60% during steady state operation.

Disclosed herein are methods and apparatuses for scoring a glass article, including positioning a plasma flame of a plasma torch and the glass article in close proximity to one another; and moving the plasma torch across a surface of the glass article to form at least one indentation in the surface, wherein the at least one indentation is formed from the plasma flame melting at least a portion of the glass surface to form a scoring line, without penetrating through a total thickness of the glass article.