A method of fabricating plates of super-hard material and cutting techniques suitable for such a method. A method of fabricating a plate (14) of super-hard material, the method comprising: • providing a substrate (4) have a lateral dimension of at least 40 mm; • growing a layer of super-hard material on the substrate (4) using a chemical vapour deposition process; and • slicing one or more plates (14) of super-hard material from the substrate using a collimated cutting beam (8), the or each plate of super-hard material (14) having a lateral dimension of at least 40 mm, wherein the collimated cutting beam (8) is collimated with a half angle divergence of no more than 5 degrees.

Multi-layer sheets of graphene-based material having a plurality of pores extending therethrough are described herein. Methods for making the sheets include exposing a graphene-based material comprising multilayer graphene having from 5 to 20 layers of graphene to a particle beam having an ion energy of at least about 1500 eV to create damage tracks in the graphene sheets. The damage tracks in the graphene sheets are then exposed to a chemical etchant, such as an oxidant to define pores through the stacked graphene sheets. Production of the damage tracks and etching of the damage tracks can take place while the graphene is disposed on a substrate.

The present disclosure generally relates to methods and apparatuses for additive manufacturing using foil-based build materials. Such methods and apparatuses eliminate several drawbacks of conventional powder-based methods, including powder handling, recoater jams, and health risks. In addition, the present disclosure provides methods and apparatuses for compensation of in-process warping of build plates and foil-based build materials, in-process monitoring, and closed loop control.

The present disclosure generally relates to methods and apparatuses for additive manufacturing using foil-based build materials. Such methods and apparatuses eliminate several drawbacks of conventional powder-based methods, including powder handling, recoater jams, and health risks. In addition, the present disclosure provides methods and apparatuses for compensation of in-process warping of build plates and foil-based build materials, in-process monitoring, and closed loop control.

The dual focused ion beam and scanning electron beam system includes an electron source that generates an electron beam and an ion source that generates an ion beam. The electron beam column directs an electron beam at a normal angle relative to a top surface of the stage. An ion beam column directs the ion beam at the stage. The ion beam is at an angle relative to the electron beam. A detector receives the electron beam reflected from the wafer on the stage.

The dual focused ion beam and scanning electron beam system includes an electron source that generates an electron beam and an ion source that generates an ion beam. The electron beam column directs an electron beam at a normal angle relative to a top surface of the stage. An ion beam column directs the ion beam at the stage. The ion beam is at an angle relative to the electron beam. A detector receives the electron beam reflected from the wafer on the stage.

A system includes a machine tool having a clamp. The system also includes a processing head configured to be temporarily held by the clamp of the machine tool. The processing head is also configured to deposit one or more media onto a workpiece. The processing head includes a guide configured to direct energy from an energy source onto the workpiece and/or the one or more media. The processing head also includes one or more supplies including one or more reservoirs within the processing head. The one or more reservoirs are configured to receive the one or more media, store the one or more media as the processing head is moved from one location to another location, and provide the one or more media.

A system includes a machine tool having a clamp. The system also includes a processing head configured to be temporarily held by the clamp of the machine tool. The processing head is also configured to deposit one or more media onto a workpiece. The processing head includes a guide configured to direct energy from an energy source onto the workpiece and/or the one or more media. The processing head also includes one or more supplies including one or more reservoirs within the processing head. The one or more reservoirs are configured to receive the one or more media, store the one or more media as the processing head is moved from one location to another location, and provide the one or more media.

A machine tool arranged to deliver an energy source through a processing head onto a work-piece, wherein; the machine-tool has a clamping mechanism arranged to temporarily receive the processing-head, or another machining or processing-head, to process a work-piece; the processing-head comprising one or more guiding mechanisms arranged to direct the energy source onto a work-piece and a processing-head docking-manifold arranged to have connected thereto one or more media to be, in use, supplied to the processing-head to facilitate processing of the work-piece; wherein the processing-head docking-manifold allows the one or more media to be supplied to the processing-head when the processing-head is connected to the clamping mechanism; and wherein the machine-tool also comprises at least one mechanism arranged to move a supply docking-manifold into and/or out of connection with the processing-head docking-manifold such that when the two manifolds are connected the or each media is supplied to the processing head.

A machine tool arranged to deliver an energy source through a processing head onto a work-piece, wherein; the machine-tool has a clamping mechanism arranged to temporarily receive the processing-head, or another machining or processing-head, to process a work-piece; the processing-head comprising one or more guiding mechanisms arranged to direct the energy source onto a work-piece and a processing-head docking-manifold arranged to have connected thereto one or more media to be, in use, supplied to the processing-head to facilitate processing of the work-piece; wherein the processing-head docking-manifold allows the one or more media to be supplied to the processing-head when the processing-head is connected to the clamping mechanism; and wherein the machine-tool also comprises at least one mechanism arranged to move a supply docking-manifold into and/or out of connection with the processing-head docking-manifold such that when the two manifolds are connected the or each media is supplied to the processing head.