Disclosed herein is a method of drilling in a multilayer printed circuit board. The method includes drilling a one hole; directing electromagnetic radiation having at least one wavelength with higher energy than a work-function the metal layer toward the hole, and thus causing the metal layer to emit free electrons; and measuring the quantity or intensity of electrically charged particles derived from the emitted free electrons, to detect the extent of exposure or disappearance of the metal layer during drilling.

Method for preparing the upper surface of a build platform for additive manufacturing by powder bed deposition, the method comprises at least one step of increasing the roughness of at least one region of the upper surface of the build platform by imprinting a pattern onto this region. The imprinting of the pattern is done inside the machine for additive manufacturing by powder bed deposition in which the build platform is subsequently used for additive manufacturing by powder bed deposition.

The present disclosure generally relates to methods and apparatuses for additive manufacturing using foil-based build materials. Such methods and apparatuses eliminate several drawbacks of conventional powder-based methods, including powder handling, recoater jams, and health risks. In addition, the present disclosure provides methods and apparatuses for compensation of in-process warping of build plates and foil-based build materials.

The present disclosure generally relates to methods and apparatuses for additive manufacturing using foil-based build materials. Such methods and apparatuses eliminate several drawbacks of conventional powder-based methods, including powder handling, recoater jams, and health risks. In addition, the present disclosure provides methods and apparatuses for compensation of in-process warping of build plates and foil-based build materials.

The present disclosure generally relates to methods and apparatuses for additive manufacturing using foil-based build materials. Such methods and apparatuses eliminate several drawbacks of conventional powder-based methods, including powder handling, recoater jams, and health risks. In addition, the present disclosure provides methods and apparatuses for compensation of in-process warping of build plates and foil-based build materials, in-process monitoring, and closed loop control.

The present disclosure generally relates to methods and apparatuses for additive manufacturing using foil-based build materials. Such methods and apparatuses eliminate several drawbacks of conventional powder-based methods, including powder handling, recoater jams, and health risks. In addition, the present disclosure provides methods and apparatuses for compensation of in-process warping of build plates and foil-based build materials, in-process monitoring, and closed loop control.

Void structures, systems and devices with void structures, and methods of fabricating void structures are disclosed. A void structure is disclosed with a repeating elongated-aperture pattern designed to provide negative Poisson's Ratio behavior under macroscopic stress and strain loading. The pattern can include horizontal and vertical elliptically shaped apertures that are arranged on horizontal and vertical lines in a way that the lines are equally spaced in both dimensions. The centers of each aperture is on a crossing point of two of the lines. The vertical and horizontal elliptically shaped apertures alternate on the vertical and horizontal lines such that any vertical aperture is surrounded by horizontal apertures along the lines (and vice versa), and the next vertical apertures are found on both diagonals. The voids can also act as cooling and/or damping holes and, due to their arrangement, also as stress reduction features.

Void structures, systems and devices with void structures, and methods of fabricating void structures are disclosed. A void structure is disclosed with a repeating elongated-aperture pattern designed to provide negative Poisson's Ratio behavior under macroscopic stress and strain loading. The pattern can include horizontal and vertical elliptically shaped apertures that are arranged on horizontal and vertical lines in a way that the lines are equally spaced in both dimensions. The centers of each aperture is on a crossing point of two of the lines. The vertical and horizontal elliptically shaped apertures alternate on the vertical and horizontal lines such that any vertical aperture is surrounded by horizontal apertures along the lines (and vice versa), and the next vertical apertures are found on both diagonals. The voids can also act as cooling and/or damping holes and, due to their arrangement, also as stress reduction features.

The invention relates to a method for manufacturing an equipment part, comprising the following steps: providing a substrate, an upper face of which includes a large main surface; providing a computer model comprising spatial coordinates of said main surface and a second portion of the equipment part; then additive manufacturing of the second portion from the main surface, so as to secure said main surface and said second portion; then cutting in a thickness of the substrate to obtain a thin plate including the main surface secured to the second portion of the equipment part.

The invention relates to a method for manufacturing an equipment part, comprising the following steps: providing a substrate, an upper face of which includes a large main surface; providing a computer model comprising spatial coordinates of said main surface and a second portion of the equipment part; then additive manufacturing of the second portion from the main surface, so as to secure said main surface and said second portion; then cutting in a thickness of the substrate to obtain a thin plate including the main surface secured to the second portion of the equipment part.