Patent classifications
B23K20/002
METHOD OF DIFFUSION BONDING
A method of diffusion bonding two components together comprises providing a first component having a first bonding surface, and a second component having a second bonding surface. Each of the first bonding surface and the second bonding surface is etched. A cold working process is applied to each of the first bonding surface and the second bonding surface. Each of the first bonding surface and the second bonding surface is then etched. The first component is positioned adjacent to the second component with the first bonding surface abutting against the second bonding surface, to define a joint surface between the first component and the second component. A peripheral edge of the joint surface is sealed. The first bonding surface is diffusion bonded to the second bonding surface.
METHOD AND APPARATUS TO FORM A WORKPIECE EMPLOYING VIBRATION WELDING
A workpiece is described, and includes a substrate, a cable, and a cover piece. A portion of the cable is joined to the substrate employing a vibration welding tool, and the cover piece is interposed between the portion of the cable and the vibration welding tool during the joining.
Creep resistant electron emitter material and fabrication method
In the present invention, a flat emitter is formed from emitter material preforms shaped as thin sheets of the emitter material. These sheets are subjected to various levels and/or amounts of mechanical working during their initial formation and are bonded to one another to create a preform having the desired thickness. The preform including the bonded sheets is subsequently worked to shape the preform into the desired configuration for the emitter. The working of the sheets of emitter material utilized to create the preform and the working of the preform to form the emitter provide a highly creep-resistant emitter that significantly improves the operation and useful life of the resulting emitter.
PROCESSES AND TOOLING ASSOCIATED WITH DIFFUSION BONDING THE PERIPHERY OF A CAVITY-BACK AIRFOIL
A fixture assembly includes a first fixture portion, a second fixture portion that interfaces with the first fixture portion, and a sub-fixture movably mounted to the first fixture portion. A multiple of actuators selectively move the sub-fixture toward the second fixture portion. A method of manufacturing a fan blade includes deploying the sub-fixture from the first fixture portion to effectuate a peripheral diffusion bond to join the blade body and the cover of the fan blade.
Method for manufacturing heat exchanger plate and method for friction stir welding
Certain embodiments relate to a heat exchanger plate capable of performing friction stir welding at a deep position of the heat exchanger plate, and improving air-tightness and water-tightness. A method may include a lid groove closing process to insert a lid plate into a lid groove formed at a periphery of a concave groove opening to a surface of a base member. The method may also include a primary joining process to perform friction stirring while relatively moving a primary joining rotary tool equipped with a stirring pin along a butting portion of a side wall of the lid groove and a side surface of the lid plate. In the primary joining process, the rotating stirring pin may be inserted into the butting portion, and the friction stirring may be performed in a state of only the stirring pin being in contact with the base member and the lid plate.
Bonded functionally graded material structure for heat transfer and CTE matching and method of making same
A method for producing a bonded functionally graded Material (FGM) structure, includes the steps of providing a plurality of dissimilar material layers; forming a first group and a second group of through holes alternately on a plurality of intermediate dissimilar material layers and on a bottom dissimilar material layer, wherein the first group of through holes has a diameter larger than a diameter of the second group of through holes; stacking the plurality of dissimilar material layers on top of one another. A first group of through holes on any dissimilar material layer is arranged corresponding to a second group of through holes on a dissimilar material layer stacked above, and a second group of through holes on any dissimilar material layer is arranged corresponding to a first group of through holes on a dissimilar material stacked right below; and bonding the plurality of dissimilar material layers.
Method for cohesive joining to a cable end, and also configured cable
The invention proposes a method for cohesive joining to a cable end (1), in which method a welding tool element (30, 37, 41, 43, 45, 48, 53) is fitted on an open bundle end of individual cores (2, 15) of the cable end (1), welding energy is fed into the individual cores (2, 15), and the welding tool element (30, 37, 41, 43, 45, 48, 53) is removed from the bundle end. In the process, an engagement recess (7, 21) can be formed in the open bundle end, an engagement pin (6, 20, 31, 38, 42, 44, 46, 49, 54) of the welding tool element (30, 37, 41, 43, 45, 48, 53) can engage into the engagement recess (7, 21), and at least a portion of the welding energy can be fed via the engagement recess (7, 21). A configured cable comprising individual cores (2, 15) with a receiving sleeve (4, 16, 33) is also presented, wherein the receiving sleeve (4, 16, 33) has an inlet opening (9) for a bundle (3) of the individual cores (2, 15), the receiving sleeve (4, 16, 33) has an end piece (5, 18) which is widened in relation to the inlet opening (9), and there is, at least also in the widened end piece (5, 18), a cohesive connection between at least one subset of the individual cores (2, 15) with respect to one another and/or between at least a subset of the individual cores (2, 15) and the receiving sleeve (4, 16, 33).
ULTRASONIC WELDING SYSTEMS, METHODS OF USING THE SAME, AND RELATED WORKPIECES INCLUDING WELDED CONDUCTIVE PINS
An ultrasonic welding system is provided. The ultrasonic welding system includes a support structure for supporting a workpiece. The ultrasonic welding system also includes a weld head assembly including an ultrasonic converter carrying a sonotrode. The ultrasonic welding system also includes a conductive pin supply configured to provide a plurality of conductive pins for welding using the sonotrode.
IN SITU CRACK REPAIR IN STRUCTURES
A method for repairing a crack in a structure includes mounting a manifold to the structure around the crack. The structure has a nonplanar surface contour that surrounds the crack. The manifold has a base portion, a cover portion, and a plug. The base portion has a grip surface configured to conform to the nonplanar surface contour of the structure. The cover portion is connected to the base portion, and has an injection port and a vent port in fluid communication with a channel aligned to the crack. The injection port transfers a bonding material into and out of the channel. The plug closes and opens the vent port. The method includes filling the channel with the bonding material to direct the bonding material into the crack, and draining the bonding material from the manifold.
Homogenizing heterogeneous foils for light alloy metal parts
A method for the manufacturing of an object. The method includes receiving a desired alloy composition for the object, depositing a plurality of foils in a stack to form the object, applying heat to the stack at a first temperature to bond the plurality of foils to each other, and applying heat to the stack at a second temperature to homogenize the composition of the stack. The homogenized stack has the desired alloy composition.