Compression cold welding methods, joint structures, and hermetically sealed containment devices are provided. The method includes providing a first substrate having at least one first joint structure which comprises a first joining surface, which surface comprises a first metal; providing a second substrate having at least one second joint structure which comprises a second joining surface, which surface comprises a second metal; and compressing together the at least one first joint structure and the at least one second joint structure to locally deform and shear the joining surfaces at one or more interfaces in an amount effective to form a metal-to-metal bond between the first metal and second metal of the joining surfaces. Overlaps at the joining surfaces are effective to displace surface contaminants and facilitate intimate contact between the joining surfaces without heat input. Hermetically sealed devices can contain drug formulations, biosensors, or MEMS devices.

Compression cold welding methods, joint structures, and hermetically sealed containment devices are provided. The method includes providing a first substrate having at least one first joint structure which comprises a first joining surface, which surface comprises a first metal; providing a second substrate having at least one second joint structure which comprises a second joining surface, which surface comprises a second metal; and compressing together the at least one first joint structure and the at least one second joint structure to locally deform and shear the joining surfaces at one or more interfaces in an amount effective to form a metal-to-metal bond between the first metal and second metal of the joining surfaces. Overlaps at the joining surfaces are effective to displace surface contaminants and facilitate intimate contact between the joining surfaces without heat input. Hermetically sealed devices can contain drug formulations, biosensors, or MEMS devices.

A method for bonding two substrates is described, comprising providing a first and a second silicon substrate, providing a raised feature on at least one of the first and the second silicon substrate, forming a layer of gold on the first and the second silicon substrates, and pressing the first substrate against the second substrate, to form a thermocompression bond around the raised feature. The high initial pressure caused by the raised feature on the opposing surface provides for a hermetic bond without fracture of the raised feature, while the complete embedding of the raised feature into the opposing surface allows for the two bonding planes to come into contact. This large contact area provides for high strength.

A method for producing a material that has the primary desirable properties that can be used for electrical terminal connectors. The present invention is directed at a clad material having high electrical conductivity, specific strength, good ductility, compatibility with joining materials, and low cost properties, and the method for making the material. In an aspect, the cladded material is made from one or more metals that collectively, have the properties discussed above. In an aspect, the cladded material is a transition-metal interconnector for electrical terminal connectors. In an exemplary aspect, the material is cladded aluminum and copper. The present invention relates to cladding materials built for use in connecting materials with different properties (e.g., aluminum and copper) in cathodes and anodes.

A method for producing a material that has the primary desirable properties that can be used for electrical terminal connectors. The present invention is directed at a clad material having high electrical conductivity, specific strength, good ductility, compatibility with joining materials, and low cost properties, and the method for making the material. In an aspect, the cladded material is made from one or more metals that collectively, have the properties discussed above. In an aspect, the cladded material is a transition-metal interconnector for electrical terminal connectors. In an exemplary aspect, the material is cladded aluminum and copper. The present invention relates to cladding materials built for use in connecting materials with different properties (e.g., aluminum and copper) in cathodes and anodes.

There is proposed a method of forming an inflated aerofoil (1), the method comprising the steps of: forming a layered, planar pre-form (30); providing at least one stress-relieving opening (44, 45, 46, 47) through the pre-form; hot creep forming and inflating the pre-form (30) to form an intermediate aerofoil; and subsequently removing material from the intermediate aerofoil, including at least a region containing the or each stress-relieving opening (44, 45, 46, 47), to form a finished aerofoil.

The invention relates to nuclear technology, and to irradiation targets and their preparation. One embodiment of the present invention includes a method for preparation of a target containing intermetallic composition of antimony Ti—Sb, Al—Sb, Cu—Sb, or Ni—Sb in order to produce radionuclides (e.g., tin—117m) with a beam of accelerated particles. The intermetallic compounds of antimony can be welded by means of diffusion welding to a copper backing cooled during irradiation on the beam of accelerated particles. Another target can be encapsulated into a shell made of metallic niobium, stainless steel, nickel or titanium cooled outside by water during irradiation. Titanium shell can be plated outside by nickel to avoid interaction with the cooling water.

The present invention relates to a method of forming a joint bonding together two solid objects and joints made by the method, where the joint is formed by a layer of a binary system which upon heat treatment forms a porous, coherent and continuous single solid-solution phase extending across a bonding layer of the joint.

The present invention relates to a method of forming a joint bonding together two solid objects and joints made by the method, where the joint is formed by a layer of a binary system which upon heat treatment forms a porous, coherent and continuous single solid-solution phase extending across a bonding layer of the joint.

Provided are a heat-resistant member provided with a heat-shielding coating suitable for stable manufacturing and excellent in heat-insulating, thermoresponsive and distortion accommodating properties, and a method for manufacturing the same. The heat-shielding coating includes a metallic portion formed of agglomerates of a plurality of metal particles, and inorganic compound particles dispersed in the metallic portion. The metal particles are diffusion-bonded each other, and the metallic portion and a base material of the heat-resistant member are diffusion-bonded each other. The manufacturing method includes the steps of depositing mixed particles of the metal particles and the inorganic compound particles on a surface of the base material in a film shape; resistance-heating the mixed particles by current-passing while pressurized in a thickness direction; diffusion-bonding the metal particles each other; and the metallic portion and the base material each other.