A composition for pressure bonding contains a metal powder and a solid reducing agent and has a compressibility of 10% to 90%, the compressibility being expressed by a relationship formula using the thickness A of a dried coating film formed by drying the composition in an air atmosphere at 110° C. under atmospheric pressure for 20 minutes and the thickness B of a sintered body formed by treating the dried coating film in a nitrogen atmosphere at 280° C. under a pressure of 6 MPa for 20 minutes. The solid reducing agent may be BIS-TRIS. Also provided is a bonded structure of conductors in which a bonding portion via which two conductors are bonded together is formed by treating, under pressure, the two conductors and a coating film formed of the composition for pressure bonding provided therebetween.

A composition for pressure bonding contains a metal powder and a solid reducing agent and has a compressibility of 10% to 90%, the compressibility being expressed by a relationship formula using the thickness A of a dried coating film formed by drying the composition in an air atmosphere at 110° C. under atmospheric pressure for 20 minutes and the thickness B of a sintered body formed by treating the dried coating film in a nitrogen atmosphere at 280° C. under a pressure of 6 MPa for 20 minutes. The solid reducing agent may be BIS-TRIS. Also provided is a bonded structure of conductors in which a bonding portion via which two conductors are bonded together is formed by treating, under pressure, the two conductors and a coating film formed of the composition for pressure bonding provided therebetween.

Provided is a beryllium copper alloy bonded body including a first member made of a beryllium copper alloy and a second member made of a beryllium copper alloy, wherein the first member and the second member are bonded to each other via the nickel layer having a thickness of 8 μm or less.

Disclosed is a welding device, which includes a drive unit, a first connecting rod, a second connecting rod, a welding head and a welding base. The drive unit is in driving connection to one end of the first connecting rod and one end of the second connecting rod; another end of the first connecting rod is in driving connection to the welding head, and is configured for causing, being driven by the drive unit, the welding head to move in a direction close to or away from the welding base; and another end of the second connecting rod is in driving connection to the welding base, and is configured for causing, being driven by the drive unit, the welding base to move in a direction close to or away from the welding head. The present application can ensure the synchronous movement of the welding head and the welding base.

The invention relates to a method for manufacturing a solid metal based component. The method comprising the steps of providing a plurality of metal based sheets; arranging the plurality of metal based sheets in a stack, 5 wherein the stack comprises a first metal based sheet, a last metal based sheet and at least one intermediate metal based sheet; perimetrically sealing at least a portion of the stack forming at least one cavity inside of the stack; removing gas from said at least one cavity, and subjecting the stack to a hot isostatic pressing process for a predetermined time at a predetermined 10 pressure and a predetermined temperature so that the plurality of metal based sheets of the stack bond metallurgically to each other to form a solid metal based component. The invention further relates to a single-piece metal based component.

A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.

Provided is a beryllium copper alloy bonded body including a first member made of a beryllium copper alloy and a second member made of a beryllium copper alloy, wherein the first member and the second member are bonded to each other via the nickel layer having a thickness of 8 μm or less.

A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.

A method for fabricating a multilayered metal nanowire array including providing a metal seed layer, stacking a plurality of porous templates on the seed layer so that a gap forms between each adjacent pair of templates, depositing by electroplating a metal in the pores so that the metal produces nanowires in the templates and lateral interposers in the gaps between the templates, and dissolving the templates so as to produce the multilayered nanowire array including the lateral interposers. The layers between the interposers can have the same or different thicknesses, the diameter and density of the pores in each layer can be the same or different and the metal deposited in the pores of the layers can be the same or different.

A joining method of joins a main body and a cover, the main body being a flat plate and made of aluminum or an aluminum alloy and including a passage through which a medium for promoting heat exchange is circulated, and the cover being a flat plate and made of aluminum or an aluminum alloy and configured to cover the passage of the main body. The method includes: a covering step of covering the main body with the cover; and a diffusion bonding step of joining the main body and the cover by diffusion bonding under a condition in which a joining temperature is 500° C. or higher and 640° C. or lower, and a joining surface pressure is 0.7 MPa or higher. Each of a joining surface of the main body and a joining surface of the cover has a flatness of 0.2 or less.