A method of producing a copper/ceramic bonded body, the copper member having a composition having a Cu purity of 99.96 mass % or more, a balance of inevitable impurities, a P content of 2 mass ppm or less, and a total content of Pb, Se and Te of 10 mass ppm or less, the method includes bonding the laminated copper member and the ceramic member by pressing and heating, wherein an average crystal grain size of the copper member before bonding is 10 μm or more, an aspect ratio is 2 or less, and a pressing load is 0.05 MPa or more and 1.5 MPa or less, a heating temperature is 800° C. or higher and 850° C. or lower, and a holding time at the heating temperature is 10 minutes or longer and 90 minutes or shorter.

A method of batch soldering includes: forming a soldered joint between a metal region of a first semiconductor die and a metal region of a substrate using a solder preform via a soldering process which does not apply pressure directly to the first semiconductor die, the solder preform having a maximum thickness of 30 μm and a lower melting point than the metal regions; setting a soldering temperature of the soldering process so that the solder preform melts and fully reacts with the metal region of the first semiconductor die and the metal region of the substrate to form one or more intermetallic phases throughout the entire soldered joint, each intermetallic phase having a melting point above the preform melting point and the soldering temperature; and soldering a second semiconductor die to the same or different metal region of the substrate, without applying pressure directly to the second semiconductor die.

A system is provided, comprising a two-sided adapter, made of a Ni-based alloy, that is connected at each of the two sides with a different type of metal, e.g. steel, and wherein the connection of the different types of metal, e.g. steel with the adapter is characterized in that it is achieved at least in part by use of friction welding. A method for linking different types of metal, e.g. steel by using a two-sided adapter as an intermediate, wherein at least one of the adapter-metal (e.g. steel) connections is made by means of friction welding, is also provided.

A system is provided, comprising a two-sided adapter, made of a Ni-based alloy, that is connected at each of the two sides with a different type of metal, e.g. steel, and wherein the connection of the different types of metal, e.g. steel with the adapter is characterized in that it is achieved at least in part by use of friction welding. A method for linking different types of metal, e.g. steel by using a two-sided adapter as an intermediate, wherein at least one of the adapter-metal (e.g. steel) connections is made by means of friction welding, is also provided.

Provided is a metal joint (5) including: a Ag—Cu—Zn layer (7); and Cu—Zn layers (6) joined to both surfaces of the Ag—Cu—Zn layer (7), wherein the Ag—Cu—Zn layer (7) has a composition in which a Cu component is 1 atm % or more and 10 atm % or less, a Zn component is 1 atm % or more and 40 atm % or less, and the balance is a Ag component with respect to the total 100 atm %, and wherein the Cu—Zn layers (6) have a composition in which a Zn component is 10 atm % or more and 40 atm % or less and the balance is a Cu component with respect to the total 100 atm %. It is therefore possible to obtain the metal joint (5), which is capable of joining metal base materials to each other without being limited to aluminum-based materials, and also have high mechanical strength.

Hydrogen purification devices and their components are disclosed. In some embodiments, the devices may include at least one foil-microscreen assembly disposed between and secured to first and second end frames. The at least one foil-microscreen assembly may include at least one hydrogen-selective membrane and at least one microscreen structure including a non-porous planar sheet having a plurality of apertures forming a plurality of fluid passages. The planar sheet may include generally opposed planar surfaces configured to provide support to the permeate side. The plurality of fluid passages may extend between the opposed surfaces. The at least one hydrogen-selective membrane may be metallurgically bonded to the at least one microscreen structure. In some embodiments, the devices may include a permeate frame having at least one membrane support structure that spans at least a substantial portion of an open region and that is configured to support at least one foil-microscreen assembly.

Hydrogen purification devices and their components are disclosed. In some embodiments, the devices may include at least one foil-microscreen assembly disposed between and secured to first and second end frames. The at least one foil-microscreen assembly may include at least one hydrogen-selective membrane and at least one microscreen structure including a non-porous planar sheet having a plurality of apertures forming a plurality of fluid passages. The planar sheet may include generally opposed planar surfaces configured to provide support to the permeate side. The plurality of fluid passages may extend between the opposed surfaces. The at least one hydrogen-selective membrane may be metallurgically bonded to the at least one microscreen structure. In some embodiments, the devices may include a permeate frame having at least one membrane support structure that spans at least a substantial portion of an open region and that is configured to support at least one foil-microscreen assembly.

A system and method for joining dissimilar metals. In one embodiment, a method comprises providing a first metal plate, a second metal plate, and an intermediate body that is positioned between the first metal plate and the second metal plate. The first metal plate is then driven into the intermediate body, which causes at least a portion of the intermediate body to collide with the second metal plate. As a result, the material of the intermediate body joins the first metal plate to the second plate. In another embodiment, a method for joining dissimilar metals comprises providing a first metal that is not amenable to welding, a second metal that is joinable to the first metal, and an intermediate body that is not joinable to at least the first metal. The intermediate body may have at least one hole such that the first metal and the second metal are positioned over and on opposite sides of the hole(s). At least a portion of the second metal may then be driven into the hole(s) to be joined to first metal.

A system and method for joining dissimilar metals. In one embodiment, a method comprises providing a first metal plate, a second metal plate, and an intermediate body that is positioned between the first metal plate and the second metal plate. The first metal plate is then driven into the intermediate body, which causes at least a portion of the intermediate body to collide with the second metal plate. As a result, the material of the intermediate body joins the first metal plate to the second plate. In another embodiment, a method for joining dissimilar metals comprises providing a first metal that is not amenable to welding, a second metal that is joinable to the first metal, and an intermediate body that is not joinable to at least the first metal. The intermediate body may have at least one hole such that the first metal and the second metal are positioned over and on opposite sides of the hole(s). At least a portion of the second metal may then be driven into the hole(s) to be joined to first metal.

A fixture assembly includes a first fixture portion, a second fixture portion that interfaces with the first fixture portion, and a sub-fixture movably mounted to the first fixture portion. A multiple of actuators selectively move the sub-fixture toward the second fixture portion. A method of manufacturing a fan blade includes deploying the sub-fixture from the first fixture portion to effectuate a peripheral diffusion bond to join the blade body and the cover of the fan blade.