The invention relates to an electrical functional component (01) having at least one electrically conductive conductor strip (02), at least one contact pin (03) being arranged on the conductor strip (02), said contact pin (03) being able to be contacted with a contact element complementary in function, in particular a plug or a socket, and a contact zone being provided between the conductor strip (02) and the contact pin (03), said contact zone electrically connecting the conductor strip (02) and the contact pin (03) to each other, the electrically conductive contact zone being formed in the type of an annular cold-pressure-welded transition zone (11), the surface material of the conductor strip (02) and/or the surface material of the contact pin (03) comprising at least one cold-working area (12, 14) in the transition zone (11), a welding zone (13) being provided at least in sections on or in at least one cold-working zone (12, 14), the contact pin (03) and the conductor strip (02) being connected to each other in the welding zone (13) in an electrically conductive manner by material bonding.

A ultrasonic welding method of joining dissimilar-material workpieces, such as sheet materials, and the joined components formed thereby. The method includes applying ultrasonic energy to a thermoplastic piece to fill a hole of a dissimilar piece to form a weld point that is made up with polymer from the thermoplastic piece. In general, the geometry of the thermoplastic piece is not altered during the process. The dissimilar piece generally has a higher melting temperate and can be metal, thermoset polymers, or other thermoplastic material. The welded pieces can be arranged in a lap, laminate, or double lap configuration. In some embodiments, the hole of the dissimilar sheet material includes undercut features that improve the mechanical interlock between the dissimilar pieces. In some embodiments, the weld point has a mushroom cap to improve mechanical interlock.

A method for the additive manufacturing of an object and a system for manufacturing an object. The method includes depositing a second foil sheet onto the first foil sheet, wherein the first foil sheet and the second foil sheet each comprise a structural layer, forming a layer stack comprising the first foil sheet and the second foil sheet, the layer stack comprising an object section and at least one support section configured to enclose the object section in the layer stack, and applying at least one of heat or pressure to opposite sides of the layer stack with a first plate and a second plate, wherein applying the at least one of heat or pressure increases he temperature of the layer stack to a temperature lower than the melting temperature of the structural layer, and the at least one of at or pressure bonds the first foil sheet to the second foil sheet in the layer stack, the first plate and the second plate are in contact with the at least one support section, and the at least one support section is configured to conduct the at least one of heat or pressure through the layer stack to the object section.

Provided is a semiconductor device formed by performing bonding at room temperature with respect to a wafer in which bonded electrodes and insulating layers and are respectively exposed to front surfaces, including a bonding interlayer which independently exhibits non-conductivity and exhibits conductivity by being bonded to the bonded electrodes, between the front surfaces.

Provided is a semiconductor device formed by performing bonding at room temperature with respect to a wafer in which bonded electrodes and insulating layers and are respectively exposed to front surfaces, including a bonding interlayer which independently exhibits non-conductivity and exhibits conductivity by being bonded to the bonded electrodes, between the front surfaces.

An electronic component is described wherein the electronic component comprises a stack of electronic elements comprising a transient liquid phase sintering adhesive between and in electrical contact with each said first external termination of adjacent electronic elements

A method includes moving a first part along a movement path. The method also includes introducing drops of a liquid metal onto the first part using a three-dimensional (3D) printer. The drops of the liquid metal solidify to form a second part that is joined to the first part. The method also includes mechanically joining the second part to a third part.

A method includes moving a first part along a movement path. The method also includes introducing drops of a liquid metal onto the first part using a three-dimensional (3D) printer. The drops of the liquid metal solidify to form a second part that is joined to the first part. The method also includes mechanically joining the second part to a third part.

A mobile waterstop welding apparatus includes a first and second support member for supporting a first and second waterstop section, respectively. The second support member is movable between a loading configuration, a heating configuration, and a welding configuration. In the loading configuration, the first and second support members are spaced apart so that the first and second waterstop sections may be loaded onto the first and second support members. In the heating configuration, the first and second support members are spaced apart so that a heating iron may be placed in-between respective welding ends of the first and second waterstop sections. In the welding configuration, the first and second support members are moved towards each other so as to weld the first and second waterstop sections together at their respective welding ends. During the welding process, a spring assembly may urge the first and second support members towards each other.

A mobile waterstop welding apparatus includes a first and second support member for supporting a first and second waterstop section, respectively. The second support member is movable between a loading configuration, a heating configuration, and a welding configuration. In the loading configuration, the first and second support members are spaced apart so that the first and second waterstop sections may be loaded onto the first and second support members. In the heating configuration, the first and second support members are spaced apart so that a heating iron may be placed in-between respective welding ends of the first and second waterstop sections. In the welding configuration, the first and second support members are moved towards each other so as to weld the first and second waterstop sections together at their respective welding ends. During the welding process, a spring assembly may urge the first and second support members towards each other.