A method for forming a metal flow module includes stacking together a first metal plate having opposing first and second major surfaces and one or more flow channels defined at least in part in the first major surface with a second metal plate having opposing first and second major surfaces, the plates stacked together with their respective first major surfaces facing each other and with a layer of flux positioned in between contacting portions of the respective first major surfaces defined as those portions of the respective first and second major surfaces which would be in contact absent the flux; then heating the plates together in a non-oxidizing atmosphere to thermally bond the contacting portions of the respective first major surfaces of the first and second metal plates. Resulting modules are also disclosed.

A method for forming a metal flow module includes stacking together a first metal plate having opposing first and second major surfaces and one or more flow channels defined at least in part in the first major surface with a second metal plate having opposing first and second major surfaces, the plates stacked together with their respective first major surfaces facing each other and with a layer of flux positioned in between contacting portions of the respective first major surfaces defined as those portions of the respective first and second major surfaces which would be in contact absent the flux; then heating the plates together in a non-oxidizing atmosphere to thermally bond the contacting portions of the respective first major surfaces of the first and second metal plates. Resulting modules are also disclosed.

A method of securing an insert in a preselected region of a workpiece. An opening wall is formed in the workpiece with an opening wall surface defining an opening to produce a remainder segment of the workpiece. The opening encompasses or coincides with the preselected region. An insert is provided to fit in the opening. An insert heated portion and a remainder segment heated portion are heated to a hot working temperature, at which they are plastically deformable. While the insert is subjected to an engagement motion, to move the insert relative to the remainder segment, an insert engagement surface of the insert is pressed against the opening wall surface, for plastic deformation of the insert heated portion and of the remainder segment heated portion, creating a metallic bond between the insert and the remainder segment. The insert and the remainder segment are allowed to cool, to bond them together.

A method of attaching a tube having a tube wall defining a tube channel therein to a workpiece having a workpiece wall. A workpiece opening defined by a workpiece opening wall surface is formed in the workpiece wall. A tube engagement surface is formed on the tube wall for engagement with the workpiece opening wall surface. A workpiece heated portion in the workpiece, and a tube heated portion in the tube, are heated in a non-oxidizing atmosphere by energized heating elements to a hot working temperature. The tube is subjected to an engagement motion, moving the tube engagement surface relative to the workpiece opening wall surface. While the heated portions are at the hot working temperature, and while the tube is subject to the engagement motion, the tube engagement surface is pressed against the workpiece opening wall surface, for plastic deformation of the heated portions, to create a metallic bond.

A semiconductor device includes a first die, the first die including a first dielectric layer and a plurality of first bond pads formed within apertures in the first dielectric layer, and a second die bonded to the first die, the second die including a second dielectric layer and a plurality of second bond pads protruding from the second dielectric layer. The first die is bonded to the second die such that the plurality of second bond pads protrude into the apertures in the first dielectric layer to establish respective metallurgical bonds with the plurality of first bond pads. A reduction in the distance between the respective bond pads of the dies results in a lower temperature for establishing a hybrid bond.

A semiconductor device includes a first die, the first die including a first dielectric layer and a plurality of first bond pads formed within apertures in the first dielectric layer, and a second die bonded to the first die, the second die including a second dielectric layer and a plurality of second bond pads protruding from the second dielectric layer. The first die is bonded to the second die such that the plurality of second bond pads protrude into the apertures in the first dielectric layer to establish respective metallurgical bonds with the plurality of first bond pads. A reduction in the distance between the respective bond pads of the dies results in a lower temperature for establishing a hybrid bond.

A method of bonding two components includes plating a first of the components with a first silver layer, a tin layer, and a second silver layer, plating a second of the components with silver, inserting the first and second components into a pre-heated press, and applying pressure to the components causing the components to bond. A stack of layers has a first component layer, a first silver layer, a tin layer, a second silver layer, a second component silver layer, and a second component layer.

An embodiment relates to an ultrasonic additive manufacturing process, comprising joining a foil comprising a bulk metallic glass to a substrate; and forming a cladded composite comprising the foil and the substrate; wherein a thickness of the cladded composite is greater than a critical casting thickness of the bulk metallic glass, wherein the cladded composite comprises a cladding layer of the bulk metallic glass on the substrate and the bulk metallic glass comprises approximately 0% crystallinity, approximately 0% porosity, less than 50 MPa thermal stress, approximately 0% distortion, approximately 0 inch heat affected zone, approximately 0% dilution, and a strength of about 2,000-3,500 MPa.

An embodiment relates to an ultrasonic additive manufacturing process, comprising joining a foil comprising a bulk metallic glass to a substrate; and forming a cladded composite comprising the foil and the substrate; wherein a thickness of the cladded composite is greater than a critical casting thickness of the bulk metallic glass, wherein the cladded composite comprises a cladding layer of the bulk metallic glass on the substrate and the bulk metallic glass comprises approximately 0% crystallinity, approximately 0% porosity, less than 50 MPa thermal stress, approximately 0% distortion, approximately 0 inch heat affected zone, approximately 0% dilution, and a strength of about 2,000-3,500 MPa.

A friction stir spot welding apparatus includes a pin member, a shoulder member, a rotation driver, a forward/backward movement driver, and a controller. The controller controls the forward/backward movement driver, such that the pin member and/or the shoulder member press workpieces before a clamp member presses the workpieces, and then controls the rotation driver and the forward/backward movement driver, such that the pin member and the shoulder member stir the workpieces.