The invention relates to a method of joining substrates. It is the object of the invention in this respect to join substrates of substrate materials together without having to exert an increased effort for a coating with additional coating processes to be carried out and to be able to achieve a good quality of the join connection in so doing. In the method in accordance with the invention a pretreatment of at least one join surface of a substrate to be joined is carried out in low pressure oxygen plasma prior to the actual joining. On the joining, a contact force acts on the substrates to be joined in the range 2 kPa to 5 MPa and in this process a heat treatment is carried out at an elevated temperature of at least 100° C. and at under pressure conditions of a maximum of 10 mbar, preferably <10.sup.−3 mbar.

The invention relates to a method of joining substrates. It is the object of the invention in this respect to join substrates of substrate materials together without having to exert an increased effort for a coating with additional coating processes to be carried out and to be able to achieve a good quality of the join connection in so doing. In the method in accordance with the invention a pretreatment of at least one join surface of a substrate to be joined is carried out in low pressure oxygen plasma prior to the actual joining. On the joining, a contact force acts on the substrates to be joined in the range 2 kPa to 5 MPa and in this process a heat treatment is carried out at an elevated temperature of at least 100° C. and at under pressure conditions of a maximum of 10 mbar, preferably <10.sup.−3 mbar.

A lithium-ion secondary-battery case that allows bonding without weld spatter and has high strength against external force acting on the battery case, and a method for manufacturing the lithium-ion secondary-battery case are provided. Specifically, an austenitic stainless steel foil is used for a cup component (2), and a two-phase stainless steel having an austenite transformation start temperature A.sub.C1 in a temperature increase process at 650° C. to 950° C. and an austenite and ferrite two-phase temperature range of 880° C. and higher, is used for a cover component (3), and the diffusion bonding is proceeded while accompanied by grain boundary movement upon transformation of the two-phase steel from a ferrite phase into an austenite phase within a heating temperature range of 880° C. to 1080° C.

A structure of assembly grasp for palladium-alloy tubes and the manufacturing method thereof are described. The structure of assembly grasp for palladium-alloy tubes includes a grasp with a plurality of holes, a plurality of palladium-alloy tubes inserted into the plurality of holes, and an intermetallic compound layer between the palladium-alloy tubes and the inner sidewalls of the plurality of holes.

A method of joining a bulk metallic glass to a second similar or dissimilar material in an air environment. The method includes the steps of: a) removing an oxide layer on at least a portion of a surface of a first bulk metallic glass during thermoplastic forming of the first bulk metallic glass in a supercooled liquid region, wherein the removing of the oxide layer on the at least the portion of the surface creates a fresh surface that is at least substantially free of oxides and/or contaminants; and b) joining the fresh surface of the first bulk metallic glass to a second material.

A method of joining first and second parts formed of dissimilar materials is provided. The first part defines a first part contacting surface having a frustoconical shape. The first and second parts are brought into contact with one another, with one of the first and second parts being rotated while the other remains stationary, so as to generate frictional heat between the contacting surfaces of the parts, the generated frictional heat producing softened adjacent regions in the first and second parts. A force is applied to the first and second parts to plastically deform the softened adjacent regions and to forge together the first and second parts to form a solid-state joint. A composite torsional damper hub assembly includes a steel stem and a damper hub welded to the stem at an interface. The damper hub is formed of aluminum or an aluminum alloy, and the interface is generally frustoconical.

A substrate stacking apparatus that stacks first and second substrates on each other, by forming a contact region where the first substrate held by a first holding section and the second substrate held by a second holding section contact each other, at one portion of the first and second substrates, and expanding the contact region from the one portion by releasing holding of the first substrate by the first holding section, wherein an amount of deformation occurring in a plurality of directions at least in the first substrate differs when the contact region expands, and the substrate stacking apparatus includes a restricting section that restricts misalignment between the first and second substrates caused by a difference in the amount of deformation. In the substrate stacking apparatus above, the restricting section may restrict the misalignment such that an amount of the misalignment is less than or equal to a prescribed value.

A substrate stacking apparatus that stacks first and second substrates on each other, by forming a contact region where the first substrate held by a first holding section and the second substrate held by a second holding section contact each other, at one portion of the first and second substrates, and expanding the contact region from the one portion by releasing holding of the first substrate by the first holding section, wherein an amount of deformation occurring in a plurality of directions at least in the first substrate differs when the contact region expands, and the substrate stacking apparatus includes a restricting section that restricts misalignment between the first and second substrates caused by a difference in the amount of deformation. In the substrate stacking apparatus above, the restricting section may restrict the misalignment such that an amount of the misalignment is less than or equal to a prescribed value.

The present disclosure provides methods for preparing an extruded product from a solid billet. The methods can include providing an as-cast billet for extrusion; applying a simultaneous rotational shear and axial extrusion force to the as-cast billet to plasticize the as-cast billet; and extruding the plasticized as-cast billet with an extrusion die to form an extruded product. Methods for preparing extruded products from billets can also include: providing a billet for extrusion; while maintaining a majority of the billet below 100° C., applying a simultaneous rotational shear and axial extrusion force to one end of the billet to plasticize the one end of the billet; and extruding the plasticized one end of the billet with an extrusion die to form an extruded product. Methods for preparing an extruded product from a billet can also include providing a billet for extrusion; applying a simultaneous rotational shear and axial extrusion force to the billet to plasticize the billet; extruding the plasticized billet with an extrusion die to form an extruded product; and artificially aging the extruded product for less than the ASTM recommended amount of time.

Methods for processing a metal substrate for use in a power electronics device are provided. In one example, the method includes placing a metal substrate on a support associated with a laser system. The method includes performing a pulsed laser treatment process on at least a portion of the surface of the metal substrate. The pulsed laser treatment process exposes the at least a portion of the surface of the metal substrate to a plurality of laser pulses to modify a surface roughness of the at least a portion of the surface of the metal substrate. After performing the pulsed laser treatment process, the method includes creating a metallized interface for coupling an electrical component to the metal substrate at the at least a portion of the surface of the metal substrate.