Embodiments of the present disclosure include method for sequentially mounting multiple semiconductor devices onto a substrate having a composite metal structure on both the semiconductor devices and the substrate for improved process tolerance and reduced device distances without thermal interference. The mounting process causes “selective” intermixing between the metal layers on the devices and the substrate and increases the melting point of the resulting alloy materials.

An electric cable includes a terminal, and a manufacture method thereof is to suppress shedding of wire strands from a core wire. The electric cable with terminal includes an end of an electric cable connected to the terminal. The electric cable includes a core wire that is a bundle of a plurality of wire strands. The terminal includes a connection portion in which the core wire is exposed at the end of the electric cable. The core wire is placed on the connection portion including a welded portion that is to be ultrasonic welded to the connection portion. The welded portion includes a high compression portion in which the core wire is compressed, and a low compression portion in which a position that is closer than the high compression portion to the end of the core wire is compressed at a compression lower than that of the high compression portion.

An electric cable includes a terminal, and a manufacture method thereof is to suppress shedding of wire strands from a core wire. The electric cable with terminal includes an end of an electric cable connected to the terminal. The electric cable includes a core wire that is a bundle of a plurality of wire strands. The terminal includes a connection portion in which the core wire is exposed at the end of the electric cable. The core wire is placed on the connection portion including a welded portion that is to be ultrasonic welded to the connection portion. The welded portion includes a high compression portion in which the core wire is compressed, and a low compression portion in which a position that is closer than the high compression portion to the end of the core wire is compressed at a compression lower than that of the high compression portion.

Disclosed are a joint of a copper terminal and an aluminium conductor and an ultrasonic welding method thereof. One spacing metal layer is added between the copper terminal and the aluminium conductor, and firstly, the spacing metal layer is fixed at a welding end of a base material by means of a manner such as electroplating, pressure welding, electric arc spray welding or electromagnetic welding, and the three parts are then welded together by means of an ultrasonic welding manner. The welding method is suitable for the welding of various joints, the electrochemical corrosion resulting from the potential difference between the copper and aluminium electrodes can be effectively reduced, and the mechanical properties of the joint can be improved.

System and method of manufacturing a laminated three-dimensional (3D) metallic object. The method includes: providing a plurality of foils of metal; marking portions of some of the foils in the plurality of foils with a marking agent that includes a material having electrochemical potential higher than the metal; bonding the plurality of marked foils into a block; and selectively etching parts of the block not in proximity to the marking agent.

System and method of manufacturing a laminated three-dimensional (3D) metallic object. The method includes: providing a plurality of foils of metal; marking portions of some of the foils in the plurality of foils with a marking agent that includes a material having electrochemical potential higher than the metal; bonding the plurality of marked foils into a block; and selectively etching parts of the block not in proximity to the marking agent.

A connection system for an optimized joining process of busbars, including at least one busbar of a first electronic circuit and at least one busbar of a second electronic circuit. The at least two electronic circuits represent individual components, and the individual components are connectable to one another via the at least one busbar. The at least one of the at least one busbar of the first electronic circuit is mechanically processed.

A machine component includes a first region having a first linear expansion coefficient, and a second region having a second linear expansion coefficient greater than the first linear expansion coefficient and joined to the first region. A region including an outer periphery of an interface between the first region and the second region is inclined toward the second region side over the entire periphery. On a surface of the first region, a groove is formed to extend along the outer periphery of the interface.

A machine component includes a first region having a first linear expansion coefficient, and a second region having a second linear expansion coefficient greater than the first linear expansion coefficient and joined to the first region. A region including an outer periphery of an interface between the first region and the second region is inclined toward the second region side over the entire periphery. On a surface of the first region, a groove is formed to extend along the outer periphery of the interface.

Disclosed is a friction welding method including: a heating step wherein, in relation to joining surfaces (S1, S2) defined by opposite end surfaces of a pair of materials (W1, W2), the pair of materials (W1, W2) are moved from a state in which their axes are unaligned with each other, in a direction for aligning the respective axes with each other, to a prescribed position where the joining surfaces (S1, S2) are brought into contact with each other and friction heated; and a pressure contacting step wherein the pair of materials are brought into pressure contact with each other. The method is characterized in that the heating step and the pressure contacting step are carried out while rotating each of the materials (W1, W2) at the same rotation speed in the same direction, as seen from one side in the axial direction.