A method of determining a cutter height on a wedge bonding machine is provided. The method includes the steps of: (a) lowering a wedge bonding tool toward a surface on the wedge bonding machine; (b) determining a first height measurement when the wedge bonding tool contacts the surface; (c) lowering a cutter of the wedge bonding machine, relative to the wedge bonding tool; (d) determining a second height measurement when the cutter contacts the surface; and (e) determining a cutter height using the first height measurement and the second height measurement.

A method of determining a cutter height on a wedge bonding machine is provided. The method includes the steps of: (a) lowering a wedge bonding tool toward a surface on the wedge bonding machine; (b) determining a first height measurement when the wedge bonding tool contacts the surface; (c) lowering a cutter of the wedge bonding machine, relative to the wedge bonding tool; (d) determining a second height measurement when the cutter contacts the surface; and (e) determining a cutter height using the first height measurement and the second height measurement.

A sonotrode assembly for an ultrasonic welding device. The sonotrode assembly includes a oscillator assembly and a cooling device. The cooling device includes at least one cooling body. The cooling body is held supported in the cooling device in such a manner that the cooling body is reversibly displaceable between an abutting position in which a contact surface of the cooling body abuts on a contact surface of the oscillator assembly and a spaced position in which the contact surface of the cooling body is spaced apart from the contact surface of the oscillator assembly.

A sonotrode assembly for an ultrasonic welding device. The sonotrode assembly includes a oscillator assembly and a cooling device. The cooling device includes at least one cooling body. The cooling body is held supported in the cooling device in such a manner that the cooling body is reversibly displaceable between an abutting position in which a contact surface of the cooling body abuts on a contact surface of the oscillator assembly and a spaced position in which the contact surface of the cooling body is spaced apart from the contact surface of the oscillator assembly.

A method for manufacturing a rod includes a step of preparing a hollow first member and a second member formed so as to have a portion smaller in outer diameter than an outer diameter of the first member, a restraining step of placing a restraining member into abutment with an outer peripheral surface of the first member, a step of moving an inner peripheral surface of the first member and an outer peripheral surface of the second member closer to each other while rotating at least one of the first member or the second member, and a step of joining the first member and the second member by welding with the aid of friction by axially pressing in the first member and the second member by a predetermined amount after placing the inner peripheral surface of the first member and the outer peripheral surface of the second member into contact.

A fixture assembly includes a first fixture portion, a second fixture portion that interfaces with the first fixture portion, and a sub-fixture movably mounted to the first fixture portion. A multiple of actuators selectively move the sub-fixture toward the second fixture portion. A method of manufacturing a fan blade includes deploying the sub-fixture from the first fixture portion to effectuate a peripheral diffusion bond to join the blade body and the cover of the fan blade.

A method of operating a wire bonding machine is provided. The method includes: (a) operating a wire bonding machine during at least one of (i) an automatic wire bonding operation and (ii) a dry cycle wire bonding operation, wherein a bonding force is applied during the operation of the wire bonding machine; and (b) monitoring an accuracy of the bonding force of the wire bonding machine during the at least one of (i) an automatic wire bonding operation and (ii) a dry cycle wire bonding operation.

A method of operating a wire bonding machine is provided. The method includes: (a) operating a wire bonding machine during at least one of (i) an automatic wire bonding operation and (ii) a dry cycle wire bonding operation, wherein a bonding force is applied during the operation of the wire bonding machine; and (b) monitoring an accuracy of the bonding force of the wire bonding machine during the at least one of (i) an automatic wire bonding operation and (ii) a dry cycle wire bonding operation.

In order to reduce the adverse effect from a thermal medium splashing as a result of a vapor chamber bursting, this protective structure is provided with a perforation member comprising an end section that: comprises an upper surface and a lower surface; either comes into contact with a first surface, which is either the upper surface or the lower surface, or is located near the first surface, before a flat vapor chamber in contact with an electronic component is overheated by heat from the electronic component; and breaks an outer member of the vapor chamber and penetrates into the interior when the vapor chamber is overheated by the heat.

A welding and deburring system is provided for joining first and second work pieces to one another. The system includes a friction stir welding tool for joining the first and second work pieces to one another at a weld. The system further includes a deburring tool attached to the friction stir welding tool and removing a material flash generated at the weld. The system further includes one or more nozzles disposed in a fixed position relative to the friction stir welding tool, with the nozzles directing a cryogenic fluid to at least one of the friction stir welding tool, the deburring tool, the first work piece, the second work piece, and the weld.