A method of manufacturing a diamond substrate includes: a step of placing a laser condensing unit 190 configured to condense laser light B so as to face an upper surface 10a of a block 10 of single crystal diamond; and a step of forming a modified layer 20, which includes a processing mark 21b of graphite and a crack 22b extending along a surface (111) around the processing mark 21b, along the surface (111) of the single crystal diamond at a predetermined depth from an upper surface of the block by radiating the laser light B on the upper surface 10a of the block 10 from the laser condensing unit 190 under predetermined conditions and condensing the laser light B inside the block 10, and moving the laser condensing unit 190 and the block 10 in a relative manner two-dimensionally.

An apparatus for cutting brittle material comprises an aspheric focusing lens, an aperture, and a laser-source generating a beam of pulsed laser-radiation. The aspheric lens and the aperture form the beam of pulsed laser-radiation into an elongated focus having a uniform intensity distribution along the optical axis of the aspheric focusing lens. The elongated focus extends through the full thickness of a workpiece made of a brittle material. The workpiece is cut by tracing the optical axis along a cutting line. Each pulse or burst of pulsed laser-radiation creates an extended defect through the full thickness of the workpiece.

A manufacturing process of an element chip comprises a preparing step for preparing a substrate having first and second sides opposed to each other, the substrate containing a semiconductor layer, a wiring layer and a resin layer formed on the first side, and the substrate including a plurality of dicing regions and element regions defined by the dicing regions. Also, the manufacturing process comprises a laser grooving step for irradiating a laser beam onto the dicing regions to form grooves so as to expose the semiconductor layer along the dicing regions. Further, the manufacturing process comprises a dicing step for plasma-etching the semiconductor layer along the dicing regions through the second side to divide the substrate into a plurality of the element chips. The laser grooving step includes a melting step for melting a surface of the semiconductor layer exposed along the dicing regions.

A laser welding system for joining first and second thermoplastic workpieces, and including a clamp, an actuator, and a laser source. The clamp includes first and second clamping structures positioned together to engage opposite sides of the workpieces when they adjoin each other. The first clamping structure has a non-flat or irregular surface, facing the first workpiece. The actuator causes the clamping structures to press the first and second workpieces together. The laser source applies laser radiation having a wavelength of 2 microns toward the workpieces to be joined, while they are pressed together by the clamp, to melt irradiated portions of the workpieces to one another. The first clamping structure transmits substantially all of the energy of the laser radiation through the material. The first workpiece has a non-flat or irregular surface facing the first clamping structure, which substantially conforms with the surface of the first clamping structure.

A manipulator device such as a robot arm that is capable of increasing manufacturing throughput for additively manufactured parts, and allows for the manipulation of parts that would be difficult or impossible for a human to move is described. The manipulator can grasp various permanent or temporary additively manufactured manipulation points on a part to enable repositioning or maneuvering of the part.

The invention aims to provide a contactless method to create small conductive tracks on a substrate. To this end a method is provided for selective material deposition, comprising depositing a first material on a substrate; followed by solidifying the first material selectively in a first solidified pattern by one or more energy beams; and followed by propelling non-solidified material away from the substrate by a large area photonic exposure, controlled in timing, energy and intensity to leave the solidified first pattern of the first material.

Laser cutting on a plated steel sheet is executed by cutting the plated steel sheet by irradiating the plated steel sheet covered with a plate metal with laser light at a wavelength in a 1 micrometer band; and emitting assist gas onto a cut surface of the plated steel sheet, the cut surface being formed in the step of cutting, to make the plate metal fused by irradiation of the laser light flow to the cut surface so as to cover the cut surface with the plate metal.

The invention relates to a process for manufacturing a part comprising a formation of successive solid metal layers (201 . . . 20n) that are stacked on top of one another, each layer describing a pattern defined using a numerical model (M), each layer being formed by the deposition of a metal (25), referred to as solder, the solder being subjected to an input of energy so as to start to melt and to constitute, by solidifying, said layer, wherein the solder takes the form of a powder (25), the exposure of which to an energy beam (32) results in melting followed by solidification so as to form a solid layer (201 . . . 20n). The process is characterized in that the solder (25) is an aluminum alloy comprising at least the following alloy elements: —Fe, in a weight fraction of from 1 to 3.7%, preferably from 1 to 3.6%; —Zr and/or Hf and/or Er and/or Sc and/or Ti, in a weight fraction of from 0.5 to 4%, preferably from 1 to 4%, more preferably from 1.5 to 3.5%, even more preferably from 1.5 to 2% each, and in a weight fraction of less than or equal to 4%, preferably less than or equal to 3%, more preferably less than or equal to 2% in total; —Si, in a weight fraction of from 0 to 4%, preferably from 0.5 to 3%; —V, in a weight fraction of from 0 to 4%, preferably from 0.5 to 3%. The invention also relates to a part obtained by this process. The alloy used in the additive manufacturing process according to the invention makes it possible to obtain parts having remarkable features.

A method and apparatus for substrate dicing are described. The method includes utilizing a laser to dice a substrate along a dicing path to form a perforated line around each device within the substrate. The dicing path is created by exposing the substrate to bursts of laser pulses at different locations around each device. The laser pulses are delivered to the substrate and may have a pulse repetition frequency of greater than about 25 MHz, a pulse width of less than about 15 picoseconds, and a laser wavelength of about 1.0 μm to about 5 μm.

Laser annealing apparatus includes a plurality of frequency-tripled solid-state lasers, each delivering an output beam of radiation at a wavelength between 340 nm and 360 nm. Each output beam has a beam-quality factor (M.sup.2) greater of than 50 in one transverse axis and greater than 20 in another transverse axis. The output beams are combined and formed into a line-beam that is projected on a substrate being annealed. Each output beam contributes to the length of the line-beam.