A method of producing a glass substrate having a hole is provided. The method includes preparing the glass substrate having a first surface and a second surface facing each other; forming a hole in the glass substrate with a laser; and annealing the glass substrate placed on a first support substrate having a thermal expansion coefficient whose difference from a thermal expansion coefficient of the glass substrate is less than or equal to 1 ppm/K, where the first support substrate is placed on a second support substrate having a thermal expansion coefficient of less than or equal to 10 ppm/K.

Disclosed is a first method of providing a heating system to an outer skin of an aircraft, that has the steps of forming laser-induced graphene (LIG) on a polymer sheet by directing laser energy towards the polymer sheet; coupling electrical leads to the LIG; and bonding the polymer sheet against the outer skin or erosion protection layer secured to the outer skin so that to the polymer sheet conforms with a shape of the outer skin.

A facet region detection method includes a first irradiation step and a second irradiation step in which a first surface and a second surface, respectively, of an ingot are irradiated with light, and a first fluorescence detection step and a second fluorescence detection step in which distribution of the number of photons of fluorescence in the first surface and the second surface, respectively, is obtained. The facet region detection method further includes a first determination step and a second determination step in which a facet region and a non-facet region are determined in the first surface and the second surface on a basis of the number of photons of the fluorescence, and a calculation step in which an estimated position of a facet region inside the ingot is calculated based on the facet region in the first surface and the facet region in the second surface.

Provided that is a marking machine for applying markings to an ingot having separating layers formed at a depth corresponding to a thickness of a wafer to be produced. The marking machine includes a reading unit configured to read the ingot information formed on the ingot, a control unit having a storage section configured to store the ingot information read by the reading unit, and a marking unit configured to mark, based on the ingot information stored in the storage section, information that includes the ingot information, to the wafer to be produced.

There is provided a peeling apparatus including an ingot holding unit that has a holding surface for holding an ingot, a wafer holding unit that is capable of approaching and separating from the ingot holding unit and has a holding surface for holding under suction a wafer to be produced, and a cleaning brush that cleans peel-off surfaces at which the wafer to be produced has been peeled off from the ingot and thereby removes peeling swarf.

Systems and methods here may be used to support a laser eye surgery device, including a base assembly mounted to an optical scanning assembly via, a horizontal x axis bearing, a horizontal y axis bearing, and a vertical z axis bearing, mounted on the base assembly, configured to limit movement of the optical scanning assembly in an x axis, y axis and z axis respectively, relative to the base assembly, a vertical z axis spring, configured to counteract the forces of gravity on the optical scanning assembly in the z axis, and, mirrors mounted on the base assembly and positioned to reflect an energy beam into the optical scanning assembly no matter where the optical scanning assembly is located on the x axis bearing, the y axis bearing and the z axis bearing.

A method for separating a temporarily bonded substrate stack by bombardment of a joining layer of the substrate stack by means of laser beams emitted by a laser, characterised in that laser beams of the laser reflected and/or transmitted at the temporarily bonded substrate stack are detected during the bombardment of the joining layer with the laser beams. The invention also relates to a corresponding device.

A method for identifying joining positions of workpieces includes capturing images of a joint by a camera, determining measurement data for the joining positions associated with a course of the joint from the images of the joint, determining a mathematical model of the joint course from a part of the measurement data, providing a curve based on the mathematical model for positioning a welding laser during a laser welding process along the curve.

A method for treating a surface of a contoured titanium substrate used for adhesively bonded engine components. The method including applying energy from a fiber laser system to a contoured surface of a titanium substrate, the laser energy is distributed to the contoured titanium surface by at least one of direct light of sight, reflection, or scattering of one or more laser beam.

A method for producing a cavity in a substrate composed of hard brittle material is provided. A laser beam of an ultrashort pulse laser is directed a side surface of the substrate and is concentrated by a focusing optical unit to form an elongated focus in the substrate. Incident energy of the laser beam produces a filament-shaped flaw in a volume of the substrate. The filament-shaped flaw extends into the volume to a predetermined depth and does not pass through the substrate. To produce the filament-shaped flaw, the ultrashort pulse laser radiates in a pulse or a pulse packet having at least two successive laser pulses. After at least two filament-shaped flaws are introduced, the substrate is exposed to an etching medium which removes material of the substrate and widens the at least two filament-shaped flaws to form filaments. At least two filaments are connected to form a cavity.