In order to cut a plurality of clumps having an approximately uniform shapes and approximately uniform dimensions out of a cell aggregate which has proliferated and appropriately eliminate contamination with fragments of different shapes or dimensions, when cutting the clumps of approximately uniform shape out of the cell aggregate which has proliferated, cutting lines along which the clumps of a specific shape are cut out are set such that the area of a peripheral part of the cell aggregate which is not cut by the cutting line exceeds the surface area of one of the clumps, and the cell aggregate is cut by irradiating with laser light in such a way as to trace the cutting lines.

A method according to one aspect of the present disclosure is a laser marking method for a powder compact containing metal powder, which includes: a first step of scanning with laser light of first power which is weaker over a predetermined area in a surface of the powder compact, to melt and smooth inside of the predetermined area; and a second step of scanning with laser light of second power which is greater, to form a dot formed of a recess of a predetermined depth at a predetermined location in the predetermined area.

A method for making an infrared light absorber is provided, and the method includes following steps: providing a first carbon nanotube array on a substrate; truncating the carbon nanotube array by irradiating a top surface of the carbon nanotube array by a laser beam in two directions, the top surface being away from the substrate, wherein the two directions being at an angle, the angle is in a range of 30 degrees to 90 degrees.

A method for microstructuring a plate-shaped glass substrate by laser radiation includes: introducing one-sided recesses into the glass substrate, in which a focus of the laser radiation forms a spatial beam along a beam axis and in which the laser radiation creates modifications in the glass substrate along the beam axis so that an action of an etching medium subsequently creates the recesses in the glass substrate through anisotropic removal of material in a respective region of the modifications. A chemical composition of the glass substrate is partially changed and thus at least one region of changed properties is created before the action of the etching medium.

An embodiment relates to an ultrasonic additive manufacturing process, comprising joining a foil comprising a bulk metallic glass to a substrate; and forming a cladded composite comprising the foil and the substrate; wherein a thickness of the cladded composite is greater than a critical casting thickness of the bulk metallic glass, wherein the cladded composite comprises a cladding layer of the bulk metallic glass on the substrate and the bulk metallic glass comprises approximately 0% crystallinity, approximately 0% porosity, less than 50 MPa thermal stress, approximately 0% distortion, approximately 0 inch heat affected zone, approximately 0% dilution, and a strength of about 2,000-3,500 MPa.

There is provided a manufacturing method of a protective-component-provided workpiece. The manufacturing method of a protective-component-provided workpiece includes a step of dissolving a thermoplastic resin whose solubility parameter is equal to or higher than 8.5, in a liquid ultraviolet-curable resin, to prepare a liquid mixed resin, a step of supplying the mixed resin to a support surface of a support table to form a resin layer with a predetermined thickness, a step of irradiating the resin layer with ultraviolet rays and curing the resin layer to form a protective component with a sheet shape, and a step of heating the sheet-shaped protective component before or after one surface of the sheet-shaped protective component and one surface of the workpiece are brought into close contact with each other, and causing the sheet-shaped protective component to come into close contact with the workpiece and integrate with the workpiece.

A processing device and a processing method for a solid structure are used to perform a processing procedure on the solid structure. The processing device for the solid structure of the invention provides energy to the solid structure by various electromagnetic radiation sources to cause the solid structure to generate qualitative changes or defects, that is, to form a modified layer. Stress and/or hardness of the modified layer are/is different from that of other non-processed areas.

A microelectronic device has bump bond structures on input/output (I/O) pads. The bump bond structures include copper-containing pillars, a barrier layer including cobalt and zinc on the copper-containing pillars, and tin-containing solder on the barrier layer. The barrier layer includes 0.1 weight percent to 50 weight percent cobalt and an amount of zinc equivalent to a layer of pure zinc 0.05 microns to 0.5 microns thick. A lead frame has a copper-containing member with a similar barrier layer in an area for a solder joint. Methods of forming the microelectronic device are disclosed.

In a laser processing apparatus for refining magnetic domains of a grain-oriented electromagnetic steel sheet by setting a laser beam to be focused on the grain-oriented electromagnetic steel sheet and scanned in a scanning direction, the laser beam focused on the grain-oriented electromagnetic steel sheet is linearly polarized light, and an angle between a linear polarization direction and the scanning direction is higher than 45° and equal to or lower than 90°.

A method and an apparatus for manufacturing a metallic article involve providing a non-metallic feedstock, for example in the form of an oxide of a desired metal or a mixture of oxides of the components of a desired metal alloy. A manufacturing apparatus has a reduction apparatus for electrochemically reducing the feedstock to a metallic product and a processor for converting the metallic product to a metallic powder. The powder is fed into an additive-manufacturing apparatus for fabricating the metallic article from the metallic powder. At least the reduction apparatus and the processor, and preferably also the additive-manufacturing apparatus, are collocated, or located in the same container, or in the same building, or on the same site.