A laser marking head and a laser marking machine are disclosed. The laser marking head includes: a laser generator, the laser generator being configured to emit laser; a first guide rail; a first sliding device, the first sliding device being sleeved on and being capable of sliding on the first guide rail; a first reflector, the first reflector being positioned on the first sliding device; a second guide rail, the second guide rail being fixed on the first sliding device and being perpendicular to the first guide rail; a second sliding device, the second sliding device being sleeved on and being capable of sliding on the second guide rail; and a second reflector, the second reflector being positioned on the second sliding device.

Provided are a micro-hole array capable of accurately holding optical fibers or the like and a method for manufacturing a micro-hole array by which micro-holes having high shape accuracy can be formed. A micro-hole array has thirty or more through holes 3 formed per cm.sup.2 in a glass plate 2 with a thickness of 0.5 mm to 5 mm, both inclusive, the through holes 3 each having a cylindrical portion 5 having a cylindricity of 5% or less of a hole diameter d.sub.1 of the through hole 3.

According to one implementation, a laser peening processing device includes a laser peening processing device includes a laser oscillator, a nozzle and an inclining structure. The laser oscillator emits laser light. The nozzle condenses and irradiates the laser light toward a surface to be processed of a workpiece, with injecting liquid toward the surface to be processed. The inclining structure inclines at least one of the nozzle and the workpiece to make an injection direction of the liquid be different from a normal direction of the surface to be processed. The air bubbles arising by at least one of collision between the liquid and the surface to be processed and shock by irradiation of the laser light on the surface to be processed are flowed in a direction depending on an inclined direction of the surface to the injection direction of the liquid.

Provided are a method for manufacturing a wet friction plate, whereby efficiency of the work of forming a fine groove on a friction material can be improved, the wet friction plate, and a wet multiple-plate clutch device having the wet friction plate. In the method for manufacturing a wet friction plate 200, a core metal 201 and a friction material 210 are prepared in a first step. Thereafter, a resin layer 203 is formed on the core metal 201 in a second step. The resin layer 203 is formed on each of entire two plate surfaces of the core metal 201. Subsequently, the friction material 210 is attached onto the resin layer 203 of the core metal 201 in a third step. Subsequently, a fine groove 211 is formed in the friction material 210 in a fourth step. Specifically, irradiation of a laser beam L is started on an exposed portion 205 of the core metal 201. A laser head 301 is displaced in an annular shape while continuously emitting the laser beam L. Thus, annular fine grooves 204 and 211 are formed in the exposed portion 205 of the core metal 201 and the friction material 210.

A solid overlay for laser shock peening is described herein. The solid overlay includes a transparent or translucent material, wherein the solid overlay is structured and adapted to a shape of a surface of a component to be treated by the laser shock peening. The solid overlay is configured to confine a plasma plume generated by laser light.

System for spatially controlling an amount of energy delivered to a processed surface of a processed substrate including a first area and a second area, the first area having a first combination of optical properties and thermal properties, and the second area having a second combination of optical properties and thermal properties, the first combination and second combination being different, the system including a light source configured to emit a pulsed light beam towards the processed surface, wherein the pulsed light beam delivers a first amount of energy onto the first area of the processed surface so that the first area reaches a first target temperature, and a second amount of energy to the second area of the processed surface so that the second area reaches a second target temperature. A corresponding method is also described.

A process for growing a substrate (24) as a melt pool (28) solidifies beneath a molten slag layer (30). An energy beam (36) is used to melt a powder (32) or a hollow feed wire (42) with a powdered alloy core (44) under the slag layer. The slag layer is at least partially transparent (37) to the energy beam, and it may be partially optically absorbent or translucent to the energy beam to absorb enough energy to remain molten. As with a conventional ESW process, the slag layer insulates the molten material and shields it from reaction with air. A composition of the powder may be changed across a solidification axis (A) of the resulting component (60) to provide a functionally graded directionally solidified product.

The liquid-assisted micromachining methods include methods of processing a substrate made of a transparent dielectric material. A working surface of the substrate is placed in contact with a liquid-assist medium that comprises fluorine. A focused pulsed laser beam is directed through a first substrate surface and through the opposite working surface to form a focus spot in the liquid-assist medium. The focus spot is then moved over a motion path from its initial position in the liquid-assist medium through the substrate body in the general direction from the working surface to the first surface to create a modification of the transparent dielectric material that defines in the body a core portion. The core portion is removed to form the substrate feature, which can be a through or closed fiber hole that supports one or more optical fibers. Optical components formed using the processed substrate are also disclosed.

A fixture used in the manufacture of an eyepiece, to cut the eyepiece to a particular shape, and a method of using the fixture to cut the eyepiece to have a desired shape. Embodiments are directed to a configurable fixture to align, hold, and protect a plastic sheet (e.g., a wafer) while a laser cutting apparatus is cutting one or more eyepieces out of the wafer. During the cutting, the fixture protects the eyepieces from reflected laser light by providing voids around the laser cutting lines, and by supporting each eyepiece near its perimeter. The fixture can be quickly rearranged for different eyepieces, different eyepiece shapes, and/or different plastic sheet sizes.

Disclosed are methods and coatings for protecting the surface of a non-metallic composite part, comprising applying a protective layer to an exposed surface of the non-metallic composite part, the protective layer comprising: (a) a multilayer having at least a co-cured layer applied to the surface of the non-metallic part and laser-sensitive layer applied to a surface of the co-cured layer, wherein the laser-sensitive layer is selected from a reflective layer, an optical sensor layer or a layer having both reflective and optical sensor properties; or (b) a co-cured coating which comprises a laser-sensitive material incorporated therein to form a laser-sensitive co-cured layer applied to a surface of the non-metallic composite part, wherein the laser-sensitive material is selected from a reflective material, an optical sensor material or a combination thereof, such that the non-metallic composite part will be protected from damage during subsequent laser ablation to remove an outer coating.