A protective film agent for laser dicing that includes a solution in which at least a water-soluble resin, an organic solvent, and an ultraviolet absorber are mixed and in which the content of sodium (Na) of the solution is equal to or lower than 100 ppb in weight ratio. Preferably, the solution further includes an antioxidant.

A sheet processing method including irradiating a transparent conductive layer covered with a transparent sheet with a pulsed laser beam such that the pulsed laser beam is applied to a portion of the transparent conductive layer through the transparent sheet, and that the portion irradiated has an insulating property. The pulsed laser beam has a top-hat intensity distribution and has a transmittance through the transparent sheet being higher than a transmittance through the transparent conductive layer.

A method for processing a transparent workpiece that includes directing a laser beam output by a beam source onto a phase-adjustment device such that the laser beam downstream the phase-adjustment device is an Airy beam and directing the Airy beam onto a surface of the transparent workpiece. The Airy beam forms an Airy beam focal region in the transparent workpiece, the Airy beam of the Airy beam focal region having a maximum intensity of 100 TW/cm.sup.2 or less, the Airy beam of the Airy beam focal region induces absorption in the transparent workpiece, the induced absorption producing a curved defect in the transparent workpiece.

A laser bonding system which improves bonding between a semiconductor chip and a substrate is provided. A laser bonding system comprises a laser bonding apparatus; and a controller configured to control the laser bonding apparatus, wherein the laser bonding apparatus includes a stage which supports a substrate including a pad, and a semiconductor chip including a connection terminal; a pressurizer which moves up and down above the stage; a temperature measuring sensor configured to measure a temperature of the semiconductor chip and generate a temperature value; and a laser radiation apparatus configured to bond a pad of the substrate and a connection terminal of the semiconductor chip, using a laser beam passing through the pressurizer, and the controller lifts the pressurizer in response to the temperature value.

The invention relates to methods for creating and detecting images inside diamonds that carry information for various purposes, for example, an identification code, marks identifying diamonds. A method for creating an optically permeable image inside a diamond is disclosed, in which image consists of a given set of optically permeable elements of micron or submicron size, which elements are disturbances in the periodicity of the diamond crystal structure. The image created in the diamond is a mark consisting of the given set of optically permeable elements of micron or submicron size. The elements are disturbances in the periodicity of the diamond crystal structure with the participation of chemical elements of impurities formed at vacancies and interstitials in the volume of micron or submicron size. Methods and systems for detecting optically permeable images inside diamonds are also disclosed.

A detection mechanism of a detection device includes a pulsed laser oscillator that emits a pulsed laser beam; an fθ lens facing a workpiece held by a chuck table; a thermal excitation section that applies the pulsed laser beam emitted from the pulsed laser oscillator to an upper surface of a wafer through the fθ lens and generates an ultrasonic wave propagated in a spherical form by thermal excitation; and an image forming section that forms an image by capturing a reflected laser beam influenced by vibration of the ultrasonic wave generated by the thermal excitation section, propagated through the inside of the workpiece, reflected by a lower surface of the workpiece, and returned to the upper surface of the workpiece, by an aperture synthesis method.

A method for processing a transparent workpiece includes directing a pulsed laser beam into the transparent workpiece such that a portion of the pulsed laser beam directed into the transparent workpiece generates an induced absorption within the transparent workpiece, thereby forming a damage line within the transparent workpiece, and the portion of the pulsed laser beam directed into the transparent workpiece includes a wavelength λ, a spot size w.sub.o, and a Rayleigh range Z.sub.R that is greater than

[00001]$F_D\frac{\pi w_{0,}^2}{\lambda },$

where F.sub.D is a dimensionless divergence factor comprising a value of 10 or greater. Further, the method for processing the transparent workpiece includes etching the transparent workpiece with an etching vapor to remove at least a portion of the transparent workpiece along the damage line, thereby forming an aperture extending through the at least a portion of the thickness of the transparent workpiece.

The invention relates to a device for roughening cylinder bores using a beam tool and offering a very high level of process reliability even for a large quantity.

A method for processing a transparent workpiece that includes directing a laser beam into the transparent workpiece. A portion of the laser beam directed into the transparent workpiece comprises a laser beam focal line and generates an induced absorption to produce a defect within the transparent workpiece. The laser beam focal line includes a wavelength λ, a spot size w.sub.o, a Rayleigh range Z.sub.R that is greater than

[00001]$F_D\frac{\pi w_o^2}{\lambda },$

where F.sub.D is a value of 10 or greater, and an internal focal line angle of greater than 10°. The laser beam focal line further comprises a circular angular spectrum within the transparent workpiece and a plurality of rays. Each individual ray of the plurality of rays has a same phase, ϕ, when converging to form the circular angular spectrum within the transparent workpiece.

A system and method for producing continuous channels within a transparent material is disclosed. According to one embodiment, the system and method includes forming a channel with a laser beam, such that the continuous channel has at least one vent from the channel to outside the transparent material.