According to one implementation, a laser peening processing device includes a laser peening processing device includes a laser oscillator, a nozzle and an inclining structure. The laser oscillator emits laser light. The nozzle condenses and irradiates the laser light toward a surface to be processed of a workpiece, with injecting liquid toward the surface to be processed. The inclining structure inclines at least one of the nozzle and the workpiece to make an injection direction of the liquid be different from a normal direction of the surface to be processed. The air bubbles arising by at least one of collision between the liquid and the surface to be processed and shock by irradiation of the laser light on the surface to be processed are flowed in a direction depending on an inclined direction of the surface to the injection direction of the liquid.

A liquid supply mechanism disposed over a holding unit of laser processing apparatus includes a liquid chamber having a circular-disc-shaped transparent plate positioned to form a gap between the circular-disc-shaped transparent plate and an upper surface of the workpiece held by the holding table, a liquid supply nozzle that supplies a liquid from one side of the liquid chamber to the gap, a liquid discharge nozzle that discharges the liquid from the other side of the liquid chamber, and a rotation mechanism that rotates the circular-disc-shaped transparent plate and generates a flow velocity in the liquid supplied to the gap. The laser beam irradiation unit includes a laser oscillator that emits a laser beam and a condenser that condenses the laser beam emitted from the laser oscillator and irradiates the workpiece with the laser beam transmitted through the transparent plate and the liquid supplied to the gap.

A method for the gap-free joining of two workpieces is provided. The method comprises the following steps: a. the workpieces to be joined are brought into contact with one another so that a joining point is formed, b. the joining point is geometrically fixed by means of a film, c. the workpieces are joined in a gap-free manner, wherein the step a. and the step b. can be interchanged.

The invention relates to a method for introducing a defined tear line via material removal on a cover material (20), which has a visible side (22) and a rear side (21) opposite the visible side (22), wherein a pulsed laser beam (31) from a laser (30) is directed to the rear side (21) of the cover material (20) and is guided along a path (50) and at least one observation unit (11) is provided for monitoring the weakening process, wherein a hollow chamber (32) is provided on the visible side (22) of the cover material (20) which has a scattering and/or reflecting inside surface (33) and at least one observation unit (11) is provided on the hollow chamber (32), wherein the light (40) emerging on the visible side (22) of the cover material (20) during the laser irradiation is incident on the inside surface (33) of the hollow chamber (32) and is scattered and/or reflected at least in part on the at least one observation unit (11) and the light incident on the at least one observation unit (11) is used to control the laser (30). A luminescent inside surface (33) can also be used as a hollow chamber (32).

A fiber laser device includes: an amplifying fiber; a delivery fiber in which laser light that has been outputted from the amplifying fiber is guided; and a Raman filter that reflects part of Raman scattered light that is generated by stimulated Raman scattering caused to the laser light.

A method for processing a transparent workpiece includes directing a pulsed laser beam into the transparent workpiece such that a portion of the pulsed laser beam directed into the transparent workpiece generates an induced absorption within the transparent workpiece, thereby forming a damage line within the transparent workpiece, and the portion of the pulsed laser beam directed into the transparent workpiece includes a wavelength , a spot size w.sub.0, and a Rayleigh range Z.sub.R that is greater than $F_D\frac{w_0^2}{},$
where F.sub.D is a dimensionless divergence factor comprising a value of 10 or greater. Further, the method for processing the transparent workpiece includes etching the transparent workpiece with an etching vapor to remove at least a portion of the transparent workpiece along the damage line, thereby forming an aperture extending through the at least a portion of the thickness of the transparent workpiece.

A method for processing a transparent workpiece that includes directing a laser beam into the transparent workpiece. A portion of the laser beam directed into the transparent workpiece comprises a laser beam focal line and generates an induced absorption to produce a defect within the transparent workpiece. The laser beam focal line includes a wavelength , a spot size w.sub.o, a Rayleigh range Z.sub.R that is greater than $F_D\frac{w_o^2}{},$
where F.sub.D is a value of 10 or greater, and an internal focal line angle of greater than 10. The laser beam focal line further comprises a circular angular spectrum within the transparent workpiece and a plurality of rays. Each individual ray of the plurality of rays has a same phase, , when converging to form the circular angular spectrum within the transparent workpiece.

A method for processing a transparent workpiece comprises directing a laser beam oriented along a beam path into the transparent workpiece such that a portion of the laser beam directed into the transparent workpiece is a laser beam focal arc and generates an induced absorption within the transparent workpiece, the induced absorption producing a defect within the transparent workpiece. The laser beam focal arc has a wavelength , a spot size w.sub.0, and a Rayleigh range Z.sub.R that is greater than

[00001]$F_D.Math.\frac{.Math..Math.w_0^2}{},$

where F.sub.D is a dimensionless divergence factor having a value of 10 or greater. The laser beam focal arc varies in a line shift direction relative to an unaffected beam propagation direction, where the line shift direction extends in an x-direction, a y-direction, or both along a length of the laser beam focal arc, such that the defect varies in the line shift direction.

A laser annealing device includes a laser generator, a beam splitter, a /2 phase difference member, a first reflective member, and a second reflective member. The laser generator emits a laser beam. The beam splitter splits the laser beam into a first reflective light and a transmissive light. The /2 phase difference member changes a polarization component of the transmissive light. The first reflective member reflects the transmissive light having the changed polarization component. The second reflective member reflects the transmissive light having the changed polarization component in a way such that the transmissive light having the changed polarization component which is reflected from the first reflective member is incident to the beam splitter.

The invention relates to a method for forming a laser-welded connection, in which two parts to be joined (11; 11a, 12; 12a) are connected to one another under the effect of a laser beam (1) in a joining region (30; 30a) to form a weld (2), wherein one part to be joined (11; 11a) consists of a material transparent to laser radiation and the other part to be joined (12; 12a) consists of a material absorbent to laser radiation, and wherein the two parts to be joined (11; 11a, 12; 12a) form a receptacle (25; 25a; 25b) for a component (13; 13a; 13b; 14) separate from the parts to be joined (11; 11a, 12; 12a).