The invention relates to additive manufacturing field and laser shock peening (LSP) field, in particular to a combined apparatus for layer-by-layer interactive additive manufacturing with laser thermal/mechanical effects. In the apparatus, a LSP module and a SLM module operate in alternate so as to perform LSP for the formed part in the forming process of the formed part, and thereby a better strengthening effect of the formed part is achieved. The invention effectively overcomes the challenges of shape control against deformation and cracking of the formed parts incurred by internal stress and property control against poor fatigue property of the formed parts incurred by metallurgical defects during additive manufacturing, improves fatigue strength and mechanical properties of the faulted parts, and realizes high-efficiency and high-quality holistic processing of the formed parts.

An additive manufacturing process is disclosed that involves positioning a metallic layer beneath a component substrate and welding the metallic layer to the component substrate using laser energy.

A method for manufacturing a secondary battery that includes providing a surfactant layer on an exterior body housing an electrode assembly, and then laser processing the exterior body.

An illuminated film-covered keyboard includes: a backlit keyboard module which includes a plurality of keys that are light-permeable, and at least one backlight source; a frame body disposed on the backlit keyboard module, the frame body including a key area, wherein the top surface of each of the plurality of keys is exposed at the key area; and a cover film disposed at the key area and on top of the top surface of each of the plurality of keys, wherein the cover film includes a light-permeable film, a base color layer, a light-shielding layer that is opaque, and a protection layer disposed on a side of the light-shielding layer opposing the base color layer, and wherein the portions of the light-shielding layer that respectively correspond to each of the plurality of keys are removed so as to form a plurality of light-transparent patterns.

A method for processing a transparent workpiece includes directing a pulsed laser beam into the transparent workpiece such that a portion of the pulsed laser beam directed into the transparent workpiece generates an induced absorption within the transparent workpiece, thereby forming a damage line within the transparent workpiece, and the portion of the pulsed laser beam directed into the transparent workpiece includes a wavelength , a spot size w.sub.0, and a Rayleigh range Z.sub.R that is greater than

[00001]$F_D.Math.\frac{.Math.w_0^2}{},$

where F.sub.D is a dimensionless divergence factor comprising a value of 10 or greater. Further, the method for processing the transparent workpiece includes etching the transparent workpiece with an etching vapor to remove at least a portion of the transparent workpiece along the damage line, thereby forming an aperture extending through the at least a portion of the thickness of the transparent workpiece.

Laser cutting a metal foil by providing a polymer film as a carrier layer for the metal foil where the metal foil is ablated by the laser beam wavelength selected for laser cutting and wherein the polymer film is a polymer film that is transparent to the laser beam wavelength selected for laser cutting such that laser cutting produces metal foil cut parts in a substrate while the polymer backing remains intact for supporting the cut parts for subsequent separation of the cut parts from substrate.

A protective film agent for laser dicing that includes a solution in which at least a water-soluble resin, an organic solvent, and an ultraviolet absorber are mixed and in which the content of sodium (Na) of the solution is equal to or lower than 100 ppb in weight ratio. Preferably, the solution further includes an antioxidant.

The present invention relates to additive manufacturing field and laser shock peening (LSP) field, in particular to a combined apparatus for layer-by-layer interactive additive manufacturing with laser thermal/mechanical effects. In the apparatus, a LSP module and a SLM module operate in alternate so as to perform LSP for the formed part in the forming process of the formed part, and thereby a better strengthening effect of the formed part is achieved. The present invention effectively overcomes the challenges of shape control against deformation and cracking of the formed parts incurred by internal stress and property control against poor fatigue property of the formed parts incurred by metallurgical defects during additive manufacturing, improves fatigue strength and mechanical properties of the formed parts, and realizes high-efficiency and high-quality holistic processing of the formed parts.

A micromachining device that utilizes a solid state laser beam scanner to steer and scan laser beams onto a moveable stage. There are no moving parts as in the galvometric scanner devices in current use. The laser beam scanner has two components, a variable frequency signal generator that is electrically connected to at least one substantially transparent and partially conductive substrate plate (hereinafter plate) with a generally planar face thereon that has a series of quantum dots (of an arbitrary size but narrow size distribution) affixed with the plate, where each of the quantum dots possess an inducible dipole moment, and each of the quantum dots are in electrical contact with the plate, where the quantum dots undergo an excitation and successive recombination (or relaxation) by the input of magnetic, optical or electrical signals.

A method for disposing blocking material within an interior of a component for blocking a beam of radiation from a laser during a laser drilling operation, the method including forming one of a multiple of apertures formed via a first process and forming the remainder of the multiple of apertures formed via a laser drilling process. A component for a gas turbine engine includes a surface with at least one of a multiple of apertures formed via a first process, the at least one of the multiple of apertures formed via the first process in communication with a cavity, a remainder of the multiple of apertures formed via a laser drilling process, the remainder of the multiple of apertures in communication with the cavity.