A display device including: a display panel; a polarization film disposed on the display panel; and a reflective layer disposed on the polarization film, wherein the reflective layer is disposed between a first hole and a first groove, wherein the first hole passes through the display panel and the polarization film, and the first groove is provided in the display panel around the first hole.

The present invention provides a laser cutting method, a display substrate and a display device. In the laser cutting method, the display substrate and the display device, as a cutting line is defined by two width defining dams on both sides of a region to be cut, the width of the cutting line can be adjusted by adjusting the distance between the two width defining dams. Thus, the width of the laser cutting line is controlled, and the effective use area of the substrate may be saved (and the material may be saved). Meanwhile, as the width defining dams are made of a laser reflective material, a laser beam irradiated onto the width defining dams is reflected without being absorbed by the width defining dams and thus transmitted to a corresponding region on the substrate. As a result, the generation of a carbonization region is avoided.

A method for manufacturing an object including the steps of forming layers by adding successive layers of material to form the object by selective laser melting (SLM), and inducing plastic deformation and residual stress into solidified material of at least one of the successive layers of material to improve mechanical properties and a fatigue resistance of the object, wherein the plastic deformation and the residual stress are induced by a laser.

A wafer processing method includes a modified layer forming step of forming a modified layer along a planned dividing line within a wafer and a dividing step of dividing the wafer along the planned dividing line with the modified layer as a starting point by applying a force to the wafer. The modified layer forming step includes a forward path modified layer forming step, a backward path modified layer forming step, and a phase shift mask reversing step of reversing a phase shift mask so as to reverse phase distribution of a laser beam applied to the wafer in an X-axis direction after the forward path modified layer forming step and before the backward path modified layer forming step, or after the backward path modified layer forming step and before the forward path modified layer forming step.

Methods and apparatuses are disclosed for laser processing. A method includes providing a laser beam transparent to a workpiece. A cover, having a surface quality better than the workpiece's surface, is provided and spaced apart from the workpiece's surface. A fluid is provided between and in contact with the cover and the workpiece's surface. A laser beam is directed through the cover and fluid to the workpiece. An apparatus includes a cover spaced apart from a workpiece's surface and including a surface quality better than the workpiece's surface, a fluid dispenser for introducing fluid between and in contact with the cover and the workpiece's surface, and a laser system that directs a laser beam through the cover and fluid to the workpiece.

A laser peening processing device includes a laser oscillator configured to oscillate a laser beam; and a nozzle configured to inject liquid to a workpiece for laser peening processing, and to cause the laser beam to be incident on the liquid to irradiate the workpiece with the laser beam which propagates through the liquid. The nozzle includes a lens configured to concentrate the laser beam so that a focal point of the laser beam is formed at a processing position of the laser peening processing, a cylindrical casing configured to protect the laser beam before the laser beam is incident on the liquid, and a pipe disposed in the casing and configured to form a flow path for the liquid.

Provided, among other things, is a method of cutting and folding a planar substrate with a focused laser beam, directed from above the substrate, to form a shape with features in 3-dimensions, the method comprising: (a) executing from above laser cuts to the planar substrate so as to provide one or more a releasable segments; (b) executing from above one or more laser-executed upward folds to bend all or a portion of a releasable segment; and (c) executing from above one or more laser-executed downward folds to bend all or a portion of a releasable segment; wherein the cuts and folds are structured so that precursors to the 3D shape remain attached to the substrate while sufficient cuts and folds are made to form the 3D shape, and wherein the planar substrate is immobile during said steps (a) through (c), or is only moved in the plane of the substrate.

A laser-based measurement device includes a motor comprising a hollow shaft. The laser-based measurement device also includes a laser transmitter disposed in the hollow shaft. The laser-based measurement device also includes an optical device disposed at the motor. The motor is configured to drive the optical device to rotate. The optical device is configured to guide a laser beam transmitted by the laser transmitter out of the hollow shaft, or to guide the laser beam reflected by an external environment into the hollow shaft.

A system and method of forming a sapphire component. The method may include disposing an absorptive-barrier layer on a first surface of a sapphire substrate, performing a cut in the sapphire substrate using a laser beam incident on the absorptive-barrier layer, and forming and removing molten sapphire from the cut. The method may also include shielding a region of the first surface that is adjacent to the cut from the molten sapphire using the absorptive-barrier layer, and removing the absorptive-barrier layer from the first surface of the sapphire substrate.

A method for temporarily protecting a surface uses a pressure-sensitive adhesive film and reduces unwinding force when the film is unwound. The pressure-sensitive adhesive film that comprises a backing coated on one side with a rubber adhesive containing at least 5 wt % of tackifying resin, and on the other side with a silicone epoxy varnish.