B23K26/0093

Apparatus for producing an object by means of additive manufacturing and method of using the apparatus

Apparatus for producing an object by means of additive manufacturing, including a process chamber for receiving on a build surface of a build plate a bath of powdered material which can be solidified, a support for positioning the build plate in relation to a surface level of the bath of material, a solidifying device for solidifying a selective part of the material; and a build plate preparation means for preparation of the build surface of the build plate such that the object can be build on the build surface of the build plate. Method of producing an object by means of additive manufacturing on a build surface of a build plate using such an apparatus.

MACHINE FOR WORKING WOODEN WORKPIECES COMPRISING A LASER SYSTEM AND OPERATION METHOD THEREOF

A machine for working a workpiece made of wood, plastic, glass, fiberglass, metal, ceramic, and the like including an entry station for the entrance of the workpiece to be worked and an exit station for the exit of the worked workpiece; a conveyor group for moving the workpiece to be worked, according to a forward direction, from the entry station towards the exit station; at least one working unit of the workpiece, arranged overhead with respect to the conveyor group including at least one working tool of the workpiece; the machine including a laser system configured for carrying out further working operations on the workpiece. Also disclosed is a laser system that can be installed on a machine for machining a workpiece and an operation method of a machine for machining a workpiece.

Method for producing a cohesive laser bond connection and apparatus for forming a laser bond connection

Methods for producing a cohesive laser bond connection, wherein, in a first method step, a bond element (2) made from copper is provided, in a second method step, a contact element (3) made from copper is provided, and, in a third method step, the bond element (2) and the contact element (3) are connected to one another in a joined fashion under the action of green laser radiation (1).

MARKING PROCESS OF AN OBJECT AND RELATED MARKING APPARATUS

A marking process of an object comprising providing a processing device/unit/member/circuit having a word processing software and a display and operationally connected to an apparatus for the marking of an object having a marking head, entering one data by the word processing software suitable for being engraved on an object, switching on a detecting device/unit/member/circuit which are positioned above a work top of the apparatus to receive the object to be marked, positioning the object to be marked above the work top, acquiring an image of the object to be marked and sending it to the word processing software to show it on the display, checking via the display whether the data entered is at least partly superimposed on the image of the object, and starting the marking of the object.

COMPOSITE WORKING MACHINE
20220203475 · 2022-06-30 ·

A press frame includes a lower press frame, an upper press frame that supports a press mechanism, and a vertical press frame. A laser frame includes a lower laser frame, an upper laser frame that supports a laser mechanism, and a vertical laser frame. A transport space for a workpiece in the press frame and a transport space for the workpiece in the laser frame communicate with each other, the transportation in the spaces being performed by a transporter. The upper laser frame includes a joint extending from the vertical laser frame toward the upper press frame side while being spaced from the upper press frame, and that switches between a connected state where the upper press frame and an end of the upper laser frame are connected and a separated state where the connection therebetween is released.

Multifunctional shaft apparatus

A multifunctional shaft apparatus includes a shaft base, a spindle, a tool holder, an ultrasonic vibration assembly, a laser light source and a mirror assembly. The spindle is disposed in the shaft base. The spindle has a laser channel extending along the spindle. The tool holder is disposed on the spindle. The tool holder has a hollow passage, an inner space and a recessed portion. The hollow passage is communicated with the laser channel. An inner wall of the hollow passage has at least one through hole communicated with the inner space, and the recessed portion is disposed on a bottom surface of the tool holder. The bottom surface has a light outlet. The ultrasonic vibration assembly includes a vibration member disposed in the recessed portion. The mirror assembly is disposed in the tool holder and is configured to reflect the laser light beam generated by the laser light source.

Method of manufacturing a silicon carbide device and wafer composite including laser modified zones in a handle substrate

A wafer composite includes a handle substrate, an auxiliary layer formed on a first main surface of the handle substrate, and a silicon carbide structure formed over the auxiliary layer. The handle substrate is subjected to laser radiation that modifies crystalline material along a focal plane in the handle substrate. The focal plane is parallel to the first main surface. The auxiliary layer is configured to stop propagation of microcracks that the laser radiation may generate in the handle substrate.

SYSTEM AND METHOD FOR MANUFACTURING A BUSBAR
20220193818 · 2022-06-23 ·

An assembly that may include a press that may form an indentation within a tab, a roller assembly including a rolling element that may compress a first tab portion of the tab that extends from the indentation against a busbar, and a welding device that may weld the first tab portion of the tab to the busbar.

WAFER MANUFACTURING APPARATUS
20220193826 · 2022-06-23 ·

A wafer manufacturing apparatus includes a chuck table configured to hold an SiC ingot by a suction surface with a wafer to be manufactured on an upper side, an ultrasonic oscillating unit configured to oscillate an ultrasonic wave, a water supply unit, and a peeling unit configured to suck and hold the wafer to be manufactured, and peel the wafer to be manufactured. The chuck table includes a porous plate forming the suction surface and a base supporting the porous plate, and sucks and holds the SiC ingot even in a state in which an area of a second surface of the SiC ingot is smaller than an area of the suction surface, and the water flows on the suction surface exposed on the periphery of the SiC ingot.

HYBRID PROCESSING OF FREEFORM DEPOSITION MATERIAL BY PROGRESSIVE FORGING
20220193776 · 2022-06-23 ·

Aspects are provided for additively manufacturing a component based on direct energy deposition (DED). An apparatus may include a DED system configured to additively manufacture a part. The apparatus may further include a forging tool configured to forge a region of the part during the additive manufacturing. In various embodiments, a solid body is used opposite to the forging tool during the forgery. For example, the solid body may include a mandrel against which the region of the part is forged.