A metal member includes a first plate, and a second plate abutting against and welded to the first plate in at least one butt portion. In the butt portion, a length from a first end to a second end of a welding boundary line between the first plate and the second plate is longer than a length of a straight line connecting the first end to the second end of the welding boundary line.

To solve the problem about the difference in temperature increasing rate between an overlapped part and a one-sheet part so as to further improve the corrosion resistance of plating after hot stamping. An overlapped blank for hot stamping includes: a first steel sheet; and at least one second steel sheet connected to a surface of the first steel sheet via a welding point and smaller in area than the first steel sheet, wherein: the first steel sheet is a plated steel sheet having an aluminum-based plated layer on both faces of the first steel sheet, and the second steel sheet is a plated steel sheet having an aluminum-based plated layer on both faces of the second steel sheet; a coating weight of the aluminum-based plated layer on the first steel sheet is W1 (g/m.sup.2) in terms of an average coating weight on both the faces; a coating weight of the aluminum-based plated layer on a surface on a side not in contact with the first steel sheet in the second steel sheet is W2 (g/m.sup.2); and each of the W1 and the W2 is within a range of 20 g/m.sup.2 or more and 120 g/m.sup.2 or less, and satisfies relationships of Expression (1) and Expression (2).

Provided, among other things, is a method of cutting and folding a planar substrate with a focused laser beam, directed from above the substrate, to form a shape with features in 3-dimensions, the method comprising: (a) executing from above laser cuts to the planar substrate so as to provide one or more a releasable segments; (b) executing from above one or more laser-executed upward folds to bend all or a portion of a releasable segment; and (c) executing from above one or more laser-executed downward folds to bend all or a portion of a releasable segment; wherein the cuts and folds are structured so that precursors to the 3D shape remain attached to the substrate while sufficient cuts and folds are made to form the 3D shape, and wherein the planar substrate is immobile during said steps (a) through (c), or is only moved in the plane of the substrate.

The invention relates to an array type paper chip for 2019-nCoV virus high-throughput detection and a manufacturing method of the array type paper chip. The array type paper chip comprises a glass substrate layer, a paper unit layer and a cell grid layer which are arranged in sequence from bottom to top, wherein the grid layer comprises N circular paper detection units with a diameter R being arranged in the form of an array; and the unit grids of the unit grid layer are in one-to-one correspondence to the paper detection units to separate the paper detection units. The array type paper chip is simple in structure, the manufacturing process is simple and stable, the finished products are stable, requirements on the processing environment and conditions are very low, and processing equipment is low in price. Moreover, the processing process does not revolve any chemical reagent, and therefore, the method is more environmentally friendly than methods such as ultraviolet lithography.

A method of joining two ferrous alloy component parts. The method includes hot metal casting a portion of a first ferrous alloy component part onto a first joining surface of a low carbon intermediate element; friction fitting a joining surface of a second ferrous alloy component part against a second joining surface of the low carbon intermediate element; and fusion welding with a concentrated energy source the intermediate element to the second ferrous alloy component part. The hot metal casting includes flowing a molten ferrous alloy onto the textured first joining surface, wherein the molten ally encompasses tabs extending from the first joining surface and filling apertures defined in the intermediate element. Then cooling the molten ferrous alloy such that a metallurgical and mechanical bond is formed between the portion of the first ferrous alloy component part and the first joining surface of the low carbon intermediate element.

Disclosed is a manufacturing method of a welded pipe, which includes: bending a stainless steel strip while conveying the stainless steel strip in one direction to thereby form a pipe; and welding a butting part of the formed pipe.

An apparatus and a method for producing an elongated profiled part, in which a profiled strip is produced from a flat strip by rolling and the profiled strip is embossed in sections, by means of which at least one longitudinal section of the profiled strip is offset relative to at least one other longitudinal section in a direction perpendicular to the longitudinal direction of the profiled strip, and with which method the strip is trimmed in such a way that, after the embossing, the longitudinal sections that are offset relative to each other have different cross-sections. In order to increase the reproducibility of the method, before the profiling, the flat strip is trimmed in such a way that by means of the embossing of the trimmed and profiled strip, the longitudinal sections that are offset relative to each other have different cross-sections.

A remanufactured internal spline component includes an inner surface defining a cylindrical bore and a remanufactured internal geometry on the inner surface. The internal geometry has a maximum diameter and a minimum diameter. The remanufactured internal geometry is created by removing a worn internal geometry to a pre-cladding diameter, cladding the inner surface in a plurality of layers by laser cladding to produce a cladded surface, and machining the cladded surface to produce the remanufactured internal geometry.

An interposer for electrical connection between a CPU chip and a circuit board is provided. The interposer includes a board-shaped base substrate made of glass having a coefficient of thermal expansion ranging from 3.1×10.sup.−6/K to 3.4×10.sup.−6/K. The interposer further includes a number of holes having diameters ranging from 20 μm to 200 μm. The number of holes ranging from 10 to 10,000 per square centimeter. Conductive paths running on one surface of the board extend right into respective holes and therethrough to the other surface of the board in order to form connection points for the chip.

The invention provides a machine tool (100) having a work table (105) for mounting at least one workpiece (105A), a laser head (101) having a powder nozzle (106) for applying a material to the workpiece and for welding the material to the workpiece (105A), a laser head positioning device for positioning the laser head with respect to the workpiece in order to machine the workpiece (105A) by application and welding of the applied material, an inert gas device (108), fillable with inert gas, for machining the workpiece (105A) by way of the laser head (101) under an inert gas atmosphere, and a positioning device for moving and positioning the inert gas device (108) on the work table (105), said machine tool (100) allowing flexible machining in the scope of subtractive and additive steps of machining a workpiece on a machine tool.