It is configured such that, for performing variable engravement for each formed object on a coil material to be fed to a press machine for molding a part of a can, a formed object with an engravement can be molded at a high productivity. A laser engraving device is a device for performing laser engraving on a coil material to be fed to a press machine for molding a part of a can, and includes a feeding mechanism for deeding a coil material at a predetermined speed, a laser head for irradiating the coil material fed at the predetermined speed with a laser beam, and performing engravement for each formed object, and a data communication unit for switching engraving data of the laser head. The data communication unit collectively switches a plurality of engraving data to be subjected to engravement on a plurality of formed objects, and the laser head continuously performs engravement of the plurality of engraving data on predetermined positions of the coil material.

A method for restoring a blade or vane platform of a gas turbine assembly configured for a power plant by: providing a blade or a vane having a platform with an edge deterioration zone; removing the deterioration zone by electro discharging machining technology; and rebuilding a removed zone by additive manufacturing technology. The removing can be performed to create a recessed plane along a platform edge, the recessed plane being connected to a platform plane by an enter inclined plane and an exit inclined plane arranged opposed along the platform edge.

A joint structure includes: a first steel plate; a second steel plate disposed along the first steel plate; a laser welding part that joins together a joint face part, which configures a first part of the first steel plate, and the second steel plate from one side in a plate thickness direction of the first steel plate and the second steel plate; and a fastening member that is screwed into, and fastens together, the second steel plate and a general face part from the one side in the plate thickness direction, the general face part configuring a second part of the first steel plate, being provided adjacent to the joint face part, and being disposed so as to be spaced apart from the second steel plate at the one side in the plate thickness direction.

A processing apparatus includes: a chuck table that is configured to be capable of rotation in a state of supporting the workpiece; a processing unit including a spindle to which a processing tool for grinding or polishing is mounted and a drive source that rotates the spindle; a measuring unit that measures distribution of thickness of the workpiece; a laser beam applying unit that has an adjustor for adjusting power of a laser beam applied to the workpiece; and a control unit including a power setting section that sets the power of the laser beam applied to an arbitrary region of the workpiece based on the distribution of the thickness of the workpiece measured by the measuring unit, and an adjustor control section that controls the adjustor of the laser beam applying unit such as to realize the power of the laser beam set by the power setting section.

A system and method of additive manufacturing is disclosed herein which when run or performed form a product with a powder-based additive manufacturing device by adding sequential layers of material on top of one another. As each sequential layer of material is added, the system and method can include monitoring the sequential layer with a defect analysis subsystem to detect whether the sequential layer has any defects. For a detected defect, it can be determined whether defect correction is required. For a required defect correction, one or more correction parameters for the required defect correction can be identified; and a correction command including the one or more correction parameters can be sent to the additive manufacturing device, the correction command causing the additive manufacturing device to help correct the detected defect in the sequential layer according to the correction parameters prior to moving on to a next sequential layer.

A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form shield tunnels in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of heating the polyester sheet, pushing up each device chip through the polyester sheet, and picking up each device chip from the polyester sheet.

A method has acts of providing a blank of head, providing a reinforcement element, combining the blank of head and the reinforcement element, and co-forging. The blank of head is made of a material having a hardness ranging from HRB50 to HRB105 measured by Rockwell Hardness Test and being softer than HRB105 and has a recess. The reinforcement element is made of a material having a hardness ranging from HRC15 to HRC55 measured by Rockwell Hardness Test. The reinforcement element is put into the recess in the blank of head, and an inner surface of the recess and the reinforcement element are combined securely with each other completely by a welding process. The blank of head combined with the reinforcement element is put into a mold, is heated to 700° C. to 1100° C., and is applied with a co-forging process to form an eutectic bonding by thermocompression.

A surface irregularity reducing method includes a holding step of holding a first workpiece on a first holder and holding a second workpiece that is of the same material as the first workpiece on a second holder, and a surface irregularity reducing step of moving the first holder and the second holder relatively to each other while the first workpiece held on the first holder and the second workpiece held on the second holder are being kept in contact with each other, thereby removing surface irregularities of a contact surface of at least either the first workpiece or the second workpiece.

A wafer manufacturing method includes: a crack layer forming step of applying a laser beam of such a wavelength as to be transmitted through an ingot to the ingot, with a focal point of the laser beam positioned in a region spaced from an end face of the ingot by a distance corresponding to the thickness of the wafer to be manufactured, to form a crack layer, a cut groove forming step of positioning a cutting blade on an extension line of the crack layer and forming a cut groove continuous with the crack layer in a periphery of the ingot; and a peeling step of applying an ultrasonic wave to the end face of the ingot to peel off the wafer to be manufactured, along the crack layer.

An additive manufacturing system configured to additively build an article can include an energy applicator, a build platform, and a powder nozzle configured to eject powder toward the build platform to be acted on by the energy applicator. The system can include a control module configured to control the energy applicator to create an amorphous structure forming at least a portion of the article.