B23K26/02

CHUCK TABLE AND INSPECTION APPARATUS
20200266091 · 2020-08-20 ·

A chuck table holding a frame unit including a workpiece is securely placed in an opening of an annular frame by a tape. A transparent holder having a holding surface holds the workpiece with the tape interposed therebetween. A frame body is erected around and surrounding the holder, the frame body having a plurality of suction holes that are open in an inner circumferential surface of the frame body. The frame body has an inside diameter equal to or smaller than an inside diameter of the annular frame. While an opening of the frame body is being covered by the tape, a suction force is transmitted through the suction holes into the frame body, discharging air from between the tape and the holding surface to bring the tape into intimate contact with the holding surface thereby securing the workpiece of the frame unit to the holding surface.

Optical feedback signal compensation for background infrared radiation in a laser chamber
10730141 · 2020-08-04 · ·

Plastic parts are welded in a laser welding system. An infrared laser source in a laser chamber is controlled by a controller using closed-loop feedback control with a corrected feedback signal that is compensated for background infrared radiation in the laser chamber. Prior to the infrared laser source being turned on, the controller senses with the optical sensor an intensity of background infrared radiation in the laser chamber. Once the laser is on, the controller senses with the optical sensor an intensity of infrared laser radiation in the laser chamber. The controller calculates the corrected feedback signal by subtracting the intensity of the background infrared radiation sensed when the infrared laser source was off from the intensity of the infrared laser radiation sensed when the infrared laser source is on.

Device for cutting sheet metal plates out of a sheet metal strip

A device for cutting sheet metal plates out of a sheet metal strip includes a laser cutting device moving back and forth in a transport direction of the sheet metal strip and a y-direction running perpendicular to the transport direction, a first conveyor belt having first end moving back and forth together with the laser cutting device in the transport direction, a second conveyor belt having a second end opposite the first end and moving back and forth in the transport direction. The first and second ends are moved such that a laser beam generated by the laser cutting device is directed towards a gap formed between the first and second ends and extending in the y-direction. In order to avoid adhesions to an underside of the sheet metal strip, at least one support strip and/or the dust discharge shaft is provided with a ventilation device for ventilating the gap.

Device for cutting sheet metal plates out of a sheet metal strip

A device for cutting sheet metal plates out of a sheet metal strip includes a laser cutting device moving back and forth in a transport direction of the sheet metal strip and a y-direction running perpendicular to the transport direction, a first conveyor belt having first end moving back and forth together with the laser cutting device in the transport direction, a second conveyor belt having a second end opposite the first end and moving back and forth in the transport direction. The first and second ends are moved such that a laser beam generated by the laser cutting device is directed towards a gap formed between the first and second ends and extending in the y-direction. In order to avoid adhesions to an underside of the sheet metal strip, at least one support strip and/or the dust discharge shaft is provided with a ventilation device for ventilating the gap.

Laser-processing head and laser-processing machine comprising same

A laser processing head comprising a focusing device for focusing a processing laser beam onto a workpiece, the focusing device arranged in a processing beam path, an optical imaging device comprising a detector, wherein the optical imaging device is configured to image observation radiation from a processing region of the workpiece onto the detector along an observation beam path passing through the focusing device, a beam splitter for separating the observation beam path from the processing beam path of the processing laser beam, imaging optics arranged in the observation beam path between the beam splitter and the detector; and a stop arranged between the imaging optics and the detector, wherein the imaging optics produces an image of the stop in the processing beam path of the processing laser beam between the beam splitter and the workpiece.

LASER PROCESSING METHOD AND LASER PROCESSING SYSTEM

A laser processing method of performing laser processing on a transparent material that is transparent to ultraviolet light by using a laser processing system includes: performing relative positioning of a transfer position of a transfer image and the transparent material in an optical axis direction of a pulse laser beam so that the transfer position is set at a position inside the transparent material at a predetermined depth Zsf from a surface of the transparent material in the optical axis direction; and irradiating the transparent material with the pulse laser beam having a pulse width of 1 ns to 100 ns inclusive and a beam diameter of 10 m to 150 m inclusive at the transfer position.

Systems and methods for fabricating a component with at least one laser device

A controller for use in an additive manufacturing system including at least one laser device configured to generate at least one melt pool in powdered material including a processing device and a memory device. The controller is configured to generate at least one control signal to control a power output of the at least one laser device throughout at least one scan path across the layer of powdered material, the scan path generated at least partially based on a functional relationship between a plurality of points of a generating path and each point of a plurality of points of the scan path. The controller is further configured to generate a non-uniform energy intensity profile for the scan path, and transmit the control signal to the laser device to emit at least one laser beam to generate at least one melt pool.

Laser process monitoring
10675709 · 2020-06-09 · ·

A method and a device for monitoring laser cutting processes in the high-power range above 1 kW mean output envisage automatic quality control after interruption and/or completion of a cutting process carried out with predetermined cutting parameters. The cutting process is interrupted after a first partial processing step, whereupon a partial section (K1 . . . KX) of the processing path is scanned. This preferably takes place at a higher speed than that for the first partial processing procedure and preferably close to or on the same processing path. On the basis of the scan result at least one quality feature of the processing result is automatically determined and compared with predefined quality specifications. Depending on the result of the comparison a fault message can then be issued, the processing interrupted, reworking of a defect point carried out, at least one cutting parameter adjusted and the cutting process continued with the changed set of cutting parameters.

Method for laser cutting with optimized gas dynamics

This disclosure relates to methods for cutting metal workpieces in sheet form with a thickness of at least 2 mm. A laser beam is positioned in a nozzle opening of a cutting gas nozzle configured to cut via the laser beam and a cutting gas so that a beam axis of the laser beam along a direction of propagation of the laser beam is at least a distance of 3 mm from a rear opening wall portion of the nozzle opening. Cutting gas configured for concurrently exiting the nozzle opening with the laser beam is emitted through the nozzle opening at a cutting gas pressure (p) of at most 10 bar.

Method for laser cutting with optimized gas dynamics

This disclosure relates to methods for cutting metal workpieces in sheet form with a thickness of at least 2 mm. A laser beam is positioned in a nozzle opening of a cutting gas nozzle configured to cut via the laser beam and a cutting gas so that a beam axis of the laser beam along a direction of propagation of the laser beam is at least a distance of 3 mm from a rear opening wall portion of the nozzle opening. Cutting gas configured for concurrently exiting the nozzle opening with the laser beam is emitted through the nozzle opening at a cutting gas pressure (p) of at most 10 bar.