The invention relates to a bridge (B) for laser cutting machines. In the latter, a laser cutting head (K) is guided over a workpiece support (W) by means of a guide system. The bridge (B) is configured in the form of a substantially straight and box-like profile (1) which has at least one guide for a cutting carriage carrying the laser cutting head (K). According to the invention, at least two side faces (10, 11) of the profile (1) that are located opposite one another with regard to the vertical plane of symmetry (VSE) of the bridge enclose a non-zero angle (a) of less than 180 that opens in the direction of the machining region, at least over a part of the height of said profile (1).

A laser machining apparatus includes: a laser beam emission device; a visible laser beam emission device; a scanner; and a controller. The controller is configured to perform: generating machining data including coordinate data representing a machining pattern to be machined on a workpiece; machining the workpiece with a laser beam according to the machining data by controlling the laser beam emission device and the scanner; generating, in response to receiving a resuming command after the machining has been halted at a stopping position, a guide pattern based on a stopping point coordinate and the machining data, the guide pattern being used for resuming the machining from the stopping position, the stopping point coordinate indicating the stopping position and being determined by the coordinate data; and projecting the guide pattern onto the workpiece with a visible laser beam by controlling the visible laser beam emission device and the scanner.

A laser machining apparatus includes: a laser beam emission device; a visible laser beam emission device; a scanner; and a controller. The controller is configured to perform: generating machining data including coordinate data representing a machining pattern to be machined on a workpiece; machining the workpiece with a laser beam according to the machining data by controlling the laser beam emission device and the scanner; generating, in response to receiving a resuming command after the machining has been halted at a stopping position, a guide pattern based on a stopping point coordinate and the machining data, the guide pattern being used for resuming the machining from the stopping position, the stopping point coordinate indicating the stopping position and being determined by the coordinate data; and projecting the guide pattern onto the workpiece with a visible laser beam by controlling the visible laser beam emission device and the scanner.

A wafer producing method for producing a wafer from an ingot, the ingot being previously formed with a separation layer along which the wafer is to be separated from the ingot. The wafer producing method includes a first ultrasonic vibration applying step of applying ultrasonic vibration to a given area of the ingot at a high density to thereby form a partially broken portion where a part of the separation layer is broken, a second ultrasonic vibration applying step of applying the ultrasonic vibration to the whole area of the ingot larger than the given area at a low density, after performing the first ultrasonic vibration applying step, thereby forming a fully broken portion where the separation layer is fully broken in such a manner that breaking starts from the partially broken portion, and a separating step of separating the wafer from the ingot along the fully broken portion.

Modified low emissivity (low-E) coated glass, so that windows using the processed glass allow uninterrupted use of RF devices within commercial or residential buildings. Glass processed in the manner described herein will not significantly diminish the energy conserving properties of the low-E coated glass. This method and apparatus disrupts the conductivity of the coating in small regions. In an embodiment, the method and apparatus ablates the low-E coating along narrow contiguous paths, such that electrical conductivity can no longer occur across the paths. The paths may take the form of intersecting curves and/or lines, so that the remaining coating consists of electrically isolated areas. The method and apparatus are applicable both to treating glass panels at the factory as well as treating windows in-situ after installation.

Modified low emissivity (low-E) coated glass, so that windows using the processed glass allow uninterrupted use of RF devices within commercial or residential buildings. Glass processed in the manner described herein will not significantly diminish the energy conserving properties of the low-E coated glass. This method and apparatus disrupts the conductivity of the coating in small regions. In an embodiment, the method and apparatus ablates the low-E coating along narrow contiguous paths, such that electrical conductivity can no longer occur across the paths. The paths may take the form of intersecting curves and/or lines, so that the remaining coating consists of electrically isolated areas. The method and apparatus are applicable both to treating glass panels at the factory as well as treating windows in-situ after installation.

A method for producing a component by the successive solidification of individual layers of powdered, granular or liquid material by irradiation with laser radiation using a laser, each layer being divided into an inner region and an edge region with an edge region surface, and, for each layer, after irradiation with the laser, at least the edge region surface of the edge region of the layer being irradiated with an ultrashort pulse laser. An optical irradiation device produces a component by successive solidification of individual layers of powdered, granular or liquid material.

A method for producing a component by the successive solidification of individual layers of powdered, granular or liquid material by irradiation with laser radiation using a laser, each layer being divided into an inner region and an edge region with an edge region surface, and, for each layer, after irradiation with the laser, at least the edge region surface of the edge region of the layer being irradiated with an ultrashort pulse laser. An optical irradiation device produces a component by successive solidification of individual layers of powdered, granular or liquid material.

An additive manufacturing apparatus according to one embodiment includes a support surface, a manufacturing unit, and a control unit. The support surface can support an object that is additively manufactured. The manufacturing unit includes a nozzle that moves relative to the support surface, ejects powder, and outputs an energy ray to melt or sinter the powder, thereby forming a layer of the object. The manufacturing unit can change the orientation of the nozzle. The control unit can change a layer forming condition for the nozzle in accordance with a change in the orientation of the nozzle.

Welding quality of a welding section W welded by laser welding is determined by acquiring an image of the welding section W and its surrounding region by means of a high-speed camera 11, analyzing, as parameters, the number of spatters P per unit length and the area of a high-luminance region in the acquired image by means of an analyzer 12, and comparing the analyzed parameters with respective comparison tables created beforehand, to determine the welding quality of the welding section Wa. Information on the welding quality of the welding section W is displayed on a monitor 13. Not only the laser welding quality of the welding section can be determined but also in-process shearing strength prediction as well as in-process fracture mode prediction can be performed, thus enabling quality control matching high-speed and high-precision laser welding.