One aspect of the present disclosure is a welding method including welding an upper plate and a lower plate overlapped with the upper plate by irradiating a surface of the upper plate with a laser beam. The welding includes forming a main welding path that intersects a welding advancing direction and that includes turning points. The upper plate and the lower plate are arranged in an inclined manner with respect to a horizontal plane when viewed parallel to the welding advancing direction. In the forming the main welding path, an amount of energy applied by the laser beam in an area in a neighborhood of the turning point on a vertically upper side is designed to be larger than an amount of energy applied by the laser beam in an area in a neighborhood of the turning point on a vertically lower side.

One aspect of the present disclosure is a welding method including welding an upper plate and a lower plate overlapped with the upper plate by irradiating a surface of the upper plate with a laser beam. The welding includes forming a main welding path that intersects a welding advancing direction and that includes turning points. The upper plate and the lower plate are arranged in an inclined manner with respect to a horizontal plane when viewed parallel to the welding advancing direction. In the forming the main welding path, an amount of energy applied by the laser beam in an area in a neighborhood of the turning point on a vertically upper side is designed to be larger than an amount of energy applied by the laser beam in an area in a neighborhood of the turning point on a vertically lower side.

Processes of chamfering and/or beveling an edge of a glass substrate of arbitrary shape using lasers are described herein. Two general methods to produce chamfers on glass substrates are the first method involves cutting the edge with the desired chamfer shape utilizing an ultra-short pulse laser to create perforations within the glass; followed by an ion exchange.

Processes of chamfering and/or beveling an edge of a glass substrate of arbitrary shape using lasers are described herein. Two general methods to produce chamfers on glass substrates are the first method involves cutting the edge with the desired chamfer shape utilizing an ultra-short pulse laser to create perforations within the glass; followed by an ion exchange.

Method for processing of material by use of a pulsed laser Each laser pulse is shaped regarding its beam profile so that a cross sectional area, which is defined by a cross section of the laser pulse in its focal point orthogonal to its propagation direction, is of particular shape and has a main extension axis of greater extent than its minor extension axis. One major crack is effected by each laser pulse, the major crack having a lateral extension basically oriented according to the main extension axis of the respective pulse in the focal point. Furthermore, each laser pulse is emitted so that the orientation of its main extension axis in the focal point corresponds to a pre-defined orientation relative to an orientation of a respective tangent to the processing path at the assigned processing point.

Electrostatic capacitance type height sensor (10) includes sensor electrode (11) attached to a tip of laser machining nozzle (1), signal processor (13) that transmits a voltage signal to sensor electrode (11) and detects a signal from sensor electrode (11) to measure a distance between a tip of sensor electrode (11) and workpiece (5) electrically connected to a ground, and cable (12) electrically connecting sensor electrode (11) to signal processor (13). Signal processor (13) includes a disconnection determinator that determines that cable (12) is broken if the signal from sensor electrode (11) is higher or equal to a predetermined level.

Electrostatic capacitance type height sensor (10) includes sensor electrode (11) attached to a tip of laser machining nozzle (1), signal processor (13) that transmits a voltage signal to sensor electrode (11) and detects a signal from sensor electrode (11) to measure a distance between a tip of sensor electrode (11) and workpiece (5) electrically connected to a ground, and cable (12) electrically connecting sensor electrode (11) to signal processor (13). Signal processor (13) includes a disconnection determinator that determines that cable (12) is broken if the signal from sensor electrode (11) is higher or equal to a predetermined level.

The patent presents a new method of damping for laser activation systems including five steps: Step 1: Locating, clamping the batteries, PCB; Step 2: Receiving hammering force; Step 3: Damping for batteries; Step 4: Damping for PCB; Step 5: Sliding electrical contact drive. This damping method has outstanding advantages in vibration suppression in different frequency ranges and amplitudes, along with applied damping according to the requirements and characteristics of each part. As a result, the two-level damping method improves stability and longevity of the laser activation system.

The patent presents a new method of damping for laser activation systems including five steps: Step 1: Locating, clamping the batteries, PCB; Step 2: Receiving hammering force; Step 3: Damping for batteries; Step 4: Damping for PCB; Step 5: Sliding electrical contact drive. This damping method has outstanding advantages in vibration suppression in different frequency ranges and amplitudes, along with applied damping according to the requirements and characteristics of each part. As a result, the two-level damping method improves stability and longevity of the laser activation system.

A laser beam irradiation apparatus including a laser source configured to emit light; a collimator configured to collimate the emitted light; a scanner configured to adjust the collimated light to change an irradiation direction thereof; a first lens part configured to focus the adjusted light to irradiate a laser beam on a sealing part; a camera configured to receive visible light passing through the scanner; a heat sensing part configured to receive infrared (IR) light passing through the scanner; and a control part configured to control a moving direction and an intensity of the laser beam.