One aspect of the present disclosure is a welding method including welding an upper plate and a lower plate overlapped with the upper plate by irradiating a surface of the upper plate with a laser beam. The welding includes forming a main welding path that intersects a welding advancing direction and that includes turning points. The upper plate and the lower plate are arranged in an inclined manner with respect to a horizontal plane when viewed parallel to the welding advancing direction. In the forming the main welding path, an amount of energy applied by the laser beam in an area in a neighborhood of the turning point on a vertically upper side is designed to be larger than an amount of energy applied by the laser beam in an area in a neighborhood of the turning point on a vertically lower side.

An information processing device includes a support extraction unit that extracts a support supporting an object corresponding to a cutout region at an outermost position among one or more supports supporting the object based on cutout region information indicating the cutout region as a region to be cut out by a laser processing machine and support information indicating the one or more supports supporting the object corresponding to the cutout region and a judgment unit that judges whether the object will incline and rise by being supported by the one or more supports or not based on a support count as the number of supports supporting the object at outermost positions.

A laser processing apparatus includes a laser beam applying mechanism for applying a laser beam to a workpiece held by a holding mechanism while keeping a converged spot of the laser beam in the workpiece, and a temperature detector for detecting a temperature of the holding mechanism or a temperature of an actuator of a moving mechanism that moves the holding mechanism in a processing feed direction. The laser beam applying mechanism has a converged spot position adjusting unit. The controller, depending on a temperature change detected by the temperature detector, controls the converged spot position adjusting unit to establish a position of the converged spot of the laser beam in a thicknesswise direction of the workpiece.

A laser processing apparatus includes a laser beam applying mechanism for applying a laser beam to a workpiece held by a holding mechanism while keeping a converged spot of the laser beam in the workpiece, and a temperature detector for detecting a temperature of the holding mechanism or a temperature of an actuator of a moving mechanism that moves the holding mechanism in a processing feed direction. The laser beam applying mechanism has a converged spot position adjusting unit. The controller, depending on a temperature change detected by the temperature detector, controls the converged spot position adjusting unit to establish a position of the converged spot of the laser beam in a thicknesswise direction of the workpiece.

A wafer production method includes a separation layer forming step of positioning, from an end surface, the focal point of a laser beam with a wavelength having transmissibility with respect to a semiconductor ingot, at a depth corresponding to the thickness of a wafer to be produced, and irradiating the ingot with the laser beam to form a separation layer, a manufacturing history forming step of positioning the focal point of a laser beam with such a characteristic as not giving damage to a wafer to be produced next, to the upper surface of a region in which a device is not formed in the wafer to be produced, and irradiating the ingot with the laser beam to form a manufacturing history by ablation processing, and separating the wafer to be produced from the ingot using the separation layer as the point of origin, to produce the wafer.

A wafer production method includes a separation layer forming step of positioning, from an end surface, the focal point of a laser beam with a wavelength having transmissibility with respect to a semiconductor ingot, at a depth corresponding to the thickness of a wafer to be produced, and irradiating the ingot with the laser beam to form a separation layer, a manufacturing history forming step of positioning the focal point of a laser beam with such a characteristic as not giving damage to a wafer to be produced next, to the upper surface of a region in which a device is not formed in the wafer to be produced, and irradiating the ingot with the laser beam to form a manufacturing history by ablation processing, and separating the wafer to be produced from the ingot using the separation layer as the point of origin, to produce the wafer.

A chuck table holding a frame unit including a workpiece is securely placed in an opening of an annular frame by a tape. A transparent holder having a holding surface holds the workpiece with the tape interposed therebetween. A frame body is erected around and surrounding the holder, the frame body having a plurality of suction holes that are open in an inner circumferential surface of the frame body. The frame body has an inside diameter equal to or smaller than an inside diameter of the annular frame. While an opening of the frame body is being covered by the tape, a suction force is transmitted through the suction holes into the frame body, discharging air from between the tape and the holding surface to bring the tape into intimate contact with the holding surface thereby securing the workpiece of the frame unit to the holding surface.

A chuck table holding a frame unit including a workpiece is securely placed in an opening of an annular frame by a tape. A transparent holder having a holding surface holds the workpiece with the tape interposed therebetween. A frame body is erected around and surrounding the holder, the frame body having a plurality of suction holes that are open in an inner circumferential surface of the frame body. The frame body has an inside diameter equal to or smaller than an inside diameter of the annular frame. While an opening of the frame body is being covered by the tape, a suction force is transmitted through the suction holes into the frame body, discharging air from between the tape and the holding surface to bring the tape into intimate contact with the holding surface thereby securing the workpiece of the frame unit to the holding surface.

An additive-manufacturing head includes: a ring-shape laser beam forming unit having axicon lenses facing each other and a convex lens between the axicon lenses to form a laser beam entering through the axicon lens into a ring-shape laser beam and emit the ring-shape laser beam from the other axicon lens; a lens moving mechanism to move the convex lens in the optical axis direction of the laser beam; a laser beam emitting unit to emit the ring-shape laser beam toward a workpiece; and a material powder feeding tube having an outlet which is disposed inside the ring-shape laser beam emitted from the laser beam emitting unit and from which material powder is released, to feed the material powder from the outlet toward the workpiece. Accordingly, the additive-manufacturing head capable of freely controlling the size of the laser-beam-irradiated region and the laser beam intensity distribution on the workpiece is provided.

An additive-manufacturing head includes: a ring-shape laser beam forming unit having axicon lenses facing each other and a convex lens between the axicon lenses to form a laser beam entering through the axicon lens into a ring-shape laser beam and emit the ring-shape laser beam from the other axicon lens; a lens moving mechanism to move the convex lens in the optical axis direction of the laser beam; a laser beam emitting unit to emit the ring-shape laser beam toward a workpiece; and a material powder feeding tube having an outlet which is disposed inside the ring-shape laser beam emitted from the laser beam emitting unit and from which material powder is released, to feed the material powder from the outlet toward the workpiece. Accordingly, the additive-manufacturing head capable of freely controlling the size of the laser-beam-irradiated region and the laser beam intensity distribution on the workpiece is provided.