A method according to one aspect of the present disclosure is a laser marking method for a powder compact containing metal powder, which includes: a first step of scanning with laser light of first power which is weaker over a predetermined area in a surface of the powder compact, to melt and smooth inside of the predetermined area; and a second step of scanning with laser light of second power which is greater, to form a dot formed of a recess of a predetermined depth at a predetermined location in the predetermined area.

A feed axis motor includes a front-side housing fixed to an end face of a stator core. The stator core is formed of a material with iron as a main component. The front-side housing is formed of a material with aluminum as a main component. The stator core and the front-side housing are coupled with each other at a welding mark generated by laser welding. The welding mark extends in a circumferential direction so as to cover a line of contact between the stator core and the front-side housing. The welding mark seals the boundary portion between the stator core and the front-side housing.

A feed axis motor includes a front-side housing fixed to an end face of a stator core. The stator core is formed of a material with iron as a main component. The front-side housing is formed of a material with aluminum as a main component. The stator core and the front-side housing are coupled with each other at a welding mark generated by laser welding. The welding mark extends in a circumferential direction so as to cover a line of contact between the stator core and the front-side housing. The welding mark seals the boundary portion between the stator core and the front-side housing.

A method of manufacturing an electronic apparatus includes: providing a work substrate including a preliminary set module including an active area including a hole formation area; and a protective film covering at least one of an upper surface and a rear surface of the preliminary set module; radiating the laser beam to the work substrate from a first start point toward a moving path removing at least a portion of the work substrate to form a first start cutting line in the hole formation area, the moving path of the laser beam defined as a boundary between the hole formation area and the active area; radiating the laser beam along the moving path; and removing the hole formation area from the preliminary set module to form a module hole, wherein the first start cutting line forms a predetermined angle with respect to a tangential line of the moving path.

A method of manufacturing an electronic apparatus includes: providing a work substrate including a preliminary set module including an active area including a hole formation area; and a protective film covering at least one of an upper surface and a rear surface of the preliminary set module; radiating the laser beam to the work substrate from a first start point toward a moving path removing at least a portion of the work substrate to form a first start cutting line in the hole formation area, the moving path of the laser beam defined as a boundary between the hole formation area and the active area; radiating the laser beam along the moving path; and removing the hole formation area from the preliminary set module to form a module hole, wherein the first start cutting line forms a predetermined angle with respect to a tangential line of the moving path.

The controller executes a first process of moving a support portion so that inside the peripheral edge of an object, a focusing position moves along the peripheral edge, thereby forming a first modified region, and following the first process, executes a second process of moving the support portion so that the focusing position moves, thereby forming a second modified region The measurement data acquiring portion, at execution of the first process, acquires measurement data associated with position information on a position of the object. The controller, at execution of the second process, causes the driving portion to shift a position of the condenser lens, the position being along the direction of an optical axis, to an initial position based on the measurement data acquired in the first process, before or when the focusing position moves from outside of the object to inside thereof.

A machine for separative machining of a plate-shaped workpiece that has: a first movement unit for moving the workpiece in a first direction (X); a second movement unit for moving a machining head for the separative machining in a second direction (Y); and two workpiece bearing faces for bearing the workpiece. A gap that extends along the second direction (Y) is formed between the workpiece bearing faces. The machine has a push-out unit having a push-out element, wherein the push-out element is movable at least in the second direction (Y) within the gap so as to press, at a predefined push-out position (AP), against a workpiece part that was cut free from the workpiece during separative machining. The disclosure further relates to methods for pushing out a workpiece part which, in particular, was cut free on such a machine.

A processing apparatus includes a delivery unit for delivering a workpiece between a cassette placed on a cassette rest and a chuck table and a measuring unit for measuring a thickness of the workpiece. The delivery unit includes a base having a non-contact-type suction holder for ejecting air to develop a negative pressure to attract and hold the workpiece under suction out of contact therewith, and a moving unit for moving the base. The height of the non-contact-type suction holder is adjusted according to the thickness of the workpiece measured by the measuring unit to place the non-contact-type suction holder in a position that is spaced from a face side of the workpiece by a distance in a predetermined range while the workpiece is being delivered by the delivery unit.

A method for the additive construction of a structure for a component includes the following steps: providing a prefabricated component for the component on a building board, wherein the component has a separating plane, providing a powder bed from a base material for the structure, moving the building board closer to a coating device, aligning a processing surface and the separating plane of the component for preventing adhesion between the component and the coating device, and optically measuring a surface of the powder bed.

A method for the additive construction of a structure for a component includes the following steps: providing a prefabricated component for the component on a building board, wherein the component has a separating plane, providing a powder bed from a base material for the structure, moving the building board closer to a coating device, aligning a processing surface and the separating plane of the component for preventing adhesion between the component and the coating device, and optically measuring a surface of the powder bed.