A joined article includes a first component having a laser-treated surface portion and a second component having a laser-treated surface portion. An adhesive joins the first component to the second component at the treated surface portion. A method of making a joined article form components and a system for making joined articles are also disclosed.

A method of laser welding together two or more overlapping metal workpieces (12, 14, or 12, 150, 14) included in a welding region (16) of a workpiece stack-up (10) involves advancing a beam spot (44) of a laser beam (24) relative to a top surface (20) of the workpiece stack-up along a first weld path (72) in a first direction (74) to form an elongated melt puddle (76) and, then, advancing the beam spot (44) of the laser beam (24) along a second weld path (78) in a second direction (80) that is opposite of the first direction while the elongated melt puddle is still in a molten state. The first weld path and the second weld path overlap so that the beam spot of the laser beam is conveyed through the elongated melt puddle when the beam spot is advanced along the second weld path.

A micromachining device that utilizes a solid state laser beam scanner to steer and scan laser beams onto a moveable stage. There are no moving parts as in the galvometric scanner devices in current use. The laser beam scanner has two components, a variable frequency signal generator that is electrically connected to at least one substantially transparent and partially conductive substrate plate (hereinafter plate) with a generally planar face thereon that has a series of quantum dots (of an arbitrary size but narrow size distribution) affixed with the plate, where each of the quantum dots possess an inducible dipole moment, and each of the quantum dots are in electrical contact with the plate, where the quantum dots undergo an excitation and successive recombination (or relaxation) by the input of magnetic, optical or electrical signals.

A process for room temperature substrate bonding employs a first substrate substantially transparent to a laser wavelength is selected. A second substrate for mating at an interface with the first substrate is then selected. A transmissivity change at the interface is created and the first and second substrates are mated at the interface. The first substrate is then irradiated with a laser of the transparency wavelength substantially focused at the interface and a localized high temperature at the interface from energy supplied by the laser is created. The first and second substrates immediately adjacent the interface are softened with diffusion across the interface to fuse the substrates.

Systems and methods for machining openings of a component are provided. In one exemplary aspect, a laser system includes features for machining an opening into a component, such as a cooling hole for a CMC component of a gas turbine engine. The component can be oriented in a first position and lasered while oriented in the first position to form a portion of the opening. The component is then oriented to a second position and lasered while oriented in the second position to form another portion of the opening. The component is alternated between the first and second positions until the predetermined geometry of the opening is formed. The component is oriented in the first and second positions such that the laser beam can machine the component without clipping areas that are not desired to be machined.

A laser processing machine 100 includes: a laser processing unit 1 configured to process a workpiece W by using a laser beam L; an imaging device configured to image the workpiece W irradiated with the laser beam L; and a control device configured to control the laser processing unit 1 in accordance with a processing condition 51c for processing the workpiece W. The control device controls operation of the laser processing unit 1 such that size OIS of an optical image OI and a peak value PV of light intensity LI of the optical image OI observed from image information obtained by imaging the workpiece W with the imaging device approach preset reference values 60.

A roof laser brazing system comprises a side home position jig installed at each of opposite sides of the transferring path of the body in the brazing section, a roof-pressing jig detachably mounted on a handling robot, docked to the side home position jig, and that home-positions and presses the roof panel loaded on the opposite side panels, a brazing assembly mounted on at least one brazing robot in the side home position jig side and that brazes bonding portions between the opposite side panels and the roof panel using a laser as a heat source, and a grinding assembly mounted on the at least one grinding robot in the grinding section and that grinds brazing beads of the bonding portions between the opposite side panels and the roof panel.

A build plate-clamping assembly may include a work station having a build plate-receiving surface and a lock-pin extending from the build plate-receiving surface of the work station. The lock-pin may include a hollow pin body, a piston disposed within the hollow pin body, with the piston axially movable from a retracted position to an actuated position, and a plurality of detents, with the plurality of detents radially extensible through respective ones of a plurality of detent-apertures in the hollow pin body responsive to the piston having been axially moved to the actuated position. A methods of working on workpieces may include lockingly engaging a build plate at a first work station, performing a first work-step, releasing the build plate from the first work station, lockingly engaging the build plate at a second work station, and performing a second work-step. An additive manufacturing system may include a vision system with a first build plate-receiving surface and an additive manufacturing machine with a second build plate-receiving surface.

Apparatus and methods of cleaning a sealing head (23) of a capsule filling line, comprising operating an ablation unit (10) to irradiate the sealing head (23) to ablate a residue off the sealing head (23).

A device configured for a treatment with a laser, including a support transparent for the laser and at least one optoelectronic circuit including at least one optoelectronic component having a three-dimensional semiconductor element covered with an active layer, the three-dimensional semiconductor element including a base bonded to the support, the device including a region absorbing for the laser resting on the support and surrounding the base.