Devices and methods for cutting an opening from a workpiece. The apparatus comprises a first emitter and a second emitter, a power of a first laser emitted by the first emitter being smaller than a power of a second laser emitted by the second emitter. The apparatus further comprises a laser head, an image sensor, and a processing unit. The laser head is coupled to the first and second emitters and adapted to move adjacent to a first side of a workpiece and direct the first and second lasers onto the first side. The image sensor is configured to receive the first laser to form an image of the first laser. The processing unit is configured to determine a difference between a profile of the image of the first laser and a predetermined profile of an opening to be cut from the workpiece.

A laser light irradiation device includes: a laser light source; a spatial light modulator including a display unit configured to display a phase pattern; an objective lens configured to condense a laser light emitted from the spatial light modulator at the object; an image-transfer optical system configured to transfer an image of the laser light on the display unit to an entrance pupil plane of the objective lens; a reflected light detector configured to detect reflected light of the laser light which is incident in the object and reflected by an opposite surface opposite to a laser light entrance surface; and a controller configured to control the phase pattern. When the reflected light detector detects the reflected light, the controller displays a reflected light aberration correction pattern which is the phase pattern correcting aberration generated in the event of the laser light being transmitted through the object having twice the predetermined thickness.

A processing device to form a pattern on a surface of an object to be processed using diffraction of a laser beam emitted from a laser source, the device including: a main body providing a space to process the object using the laser beam emitted from the laser source; a laser transmission unit formed at a first portion of the main body, and configured to diffract the laser beam so that a diffracted laser beam is emitted toward the object; an actuator formed at a second portion of the main body, and connected to the laser transmission unit so as to change an emission pattern of the diffracted laser beam while rotating the laser transmission unit vertically/horizontally or in a set radius; and a controller provided at a third portion of the main body, and connected to the actuator to control an operation of the actuator.

A laser welding control method, apparatus and system, and an electronic device are disclosed, the method includes: receiving a current position of a welding head fed back by an encoder; determining whether the current position reaches a set position; and in response to the welding head reaching the set position, sending a laser control signal to a laser device to control the laser device to output laser at the set position.

Provided are a joint component formed with fine recessed portions so that degradation of the flatness of a metal base body, such as a core, to which a joint object such as a friction member is joined can be reduced, a multiplate clutch device including the joint component, and a joint component manufacturing method. At a friction plate (200) as the joint component, many fine recessed portions (204) are formed at a joint surface (203) as a portion of a core (201) joined to friction members (207). The joint surface (203) is formed in a circular ring shape along a peripheral direction of the core (201), and is formed with a flatness of equal to or less than 0.15 mm. The fine recessed portions (204) are formed at the joint surface (203) such that adjacent ones of the fine recessed portions (204) do not overlap with each other and a formation density per unit area (Ua) at the joint surface (203) is uniform. The fine recessed portions (204) are formed as laser processing marks formed at the core (201) by irradiation with laser light L.

A reel-to-reel method to laser-ablate a circuitry pattern on the fly in a reel-to-reel machine as part of a process to fabricate a printed flexible circuit. The laser ablation method includes using an appropriate laser to irradiate a metal sheet thus ablating the edges of an intended circuitry pattern. Slugs can be removed by using an optional sacrificial liner, and the slugs can be optionally ablated into smaller parts first. The laser ablation can also include an optional method of creating tie bars to provide structural support to the web of circuitry patterns.

A laser processing machine including: a laser source that emits a laser beam; a polarization rotator unit; a beam rotator unit; a lens; and a controller, which apply the laser beam to a workpiece, the polarization rotator unit includes a wave plate and first actuator that rotates the wave plate, the beam rotator unit includes an optical system that adjusts an irradiation angle of the laser beam to the workpiece by making an incident laser beam eccentric to output and making the laser beam incident on the lens at a position eccentric from a central axis, a second actuator rotates the optical system, the lens condenses the laser beam on the workpiece, the controller controls a rotational speed ratio between the first actuator and the second actuator, and adjusts a polarized state of the laser beam by controlling the rotational speed ratio.

A method and arrangement for the texturing of a moving steel strip wherein a texture is applied to a surface of a moving steel strip by ablation by means of a single laser beam or a plurality of laser beams directed at the surface of the moving steel strip and wherein a liquid is supplied on the moving steel strip over a surface area on the moving steel strip that covers the working area of the single laser beam or the plurality of laser beams on the moving steel strip.

An assembly for rapid manufacturing of symmetrical objects by direct metal deposition is disclosed. A rotary stage provides rotational movement to an object supported by the stage around a central stage axis. Nozzles are spaced above the rotary stage for performing direct metal deposition for building an object supported by the stage. Each nozzle is independently moveable along a horizontal axis and independently pivotable, and combined, moveable along a vertical axis for providing symmetrical movement corresponding to a symmetrical deposition configuration of the object while the object is rotated around the central stage axis.

A method of splitting a semiconductor work piece includes: forming a separation zone within the semiconductor work piece, wherein forming the separation zone comprises modifying semiconductor material of the semiconductor work piece at a plurality of targeted positions within the separation zone in at least one physical property which increases thermo-mechanical stress within the separation zone relative to a remainder of the semiconductor work piece, wherein modifying the semiconductor material in one of the targeted positions comprises focusing at least two laser beams to the targeted position; and applying an external force or stress to the semiconductor work piece such that at least one crack propagates along the separation zone and the semiconductor work piece splits into two separate pieces. Additional work piece splitting techniques and techniques for compensating work piece deformation that occurs during the splitting process are also described.