A laser machining device includes a laser light source, a spatial light modulator which includes a display unit, an objective lens, an image-transfer optical system, a camera and a controller. The controller executes first display processing and second display processing. According to first display processing, when the camera captures the image, the display unit displays a first phase pattern for adjusting a condensing position of laser light condensed by the objective lens to a first condensing position. According to second display processing, when the camera captures the image, the display unit displays a second phase pattern for adjusting the condensing position of the laser light condensed by the objective lens to a second condensing position different from the first condensing position in an irradiation direction of the laser light.

Disclosed embodiments include a gantry assembly that has (i) a moveable carriage with a laser head affixed thereto and (ii) two sides (moveable subassemblies) that are connected by a joining subassembly. One side of the gantry has two motors: (i) a first motor (x-axis motor) that moves the carriage along a first axis (x-axis) between the two sides of the gantry, and (ii) a second motor (y-axis motor) that moves the gantry along a second axis (y-axis) perpendicular to the first axis. In some embodiments, the gantry assembly also includes a drive shaft (or alternative drive mechanism) operated by the second motor (y-axis motor) to facilitate movement of the two sides of the gantry together along the second axis (y-axis).

The present invention relates to a hybrid material processing method includes steps of: emitting a laser beam toward an intended-to-be-modified area intended on a workpiece by a laser to perform a property modification for the intended-to-be-modified area; applying an optical image positioning assisted equipment to perform a precise positioning for a modified area or a positioning marker on the workpiece, so as to align a machine tool to the modified area; and driving the machine tool to perform a processing for the modified area.

A laser beam irradiation unit of a laser processing apparatus includes: a laser oscillator in which a repetition frequency is set so as to oscillate a pulsed laser having a pulse width shorter than a time of electronic excitation caused by irradiating the workpiece with a laser beam and oscillate at least two pulsed lasers within the electronic excitation time; a condenser that irradiates the workpiece held on the chuck table with the pulsed laser beams oscillated by the laser oscillator; and a thinning-out unit that is disposed between the laser oscillator and the condenser and guides the pulsed laser beams necessary for processing to the condenser by thinning out and discarding pulsed laser beams in a predetermined cycle.

The present invention relates to a composite container comprising a bottom film layer and a top film layer at least partially adhered to the bottom film layer. The top film layer is scored to form at least one resealable flap and at least one pull tab which is not adhered to the bottom film layer. The bottom film layer comprises at least one cavity opening. A cardboard layer is adhered on its lower surface to the upper surface of the top film layer, wherein the cardboard layer has at least one cavity opening which is substantially aligned with the scoring of the top film layer resealable flap and the cardboard layer is perforated to define a perimeter of at least one pull tab which is substantially aligned with and adhered, on its underside, to the upper surface of the top film layer pull tab.

A joint body includes first and second metal members and a joint portion including a welded portion where the first and second metal members are joined together, the welded portion having a line shape. The joint portion includes first and second longitudinal portions and a plurality of connecting portions. The first longitudinal portion has first intersecting portions arranged in a first direction and extends in the first direction. The second longitudinal portion has second intersecting portions arranged in the first direction and extends in the first direction. The welded portion intersects itself at the first and second intersecting portions. The connecting portions are arranged in the first direction. The connecting portions extend in a first direction and connect the first and second longitudinal portions.

A laser processing apparatus includes: a chuck table for holding a single-crystal SiC ingot on a holding surface thereof; a laser beam applying unit for applying a laser beam to the single-crystal SiC ingot held on the holding surface of the chuck table; and a camera unit configured to capture an image of the single-crystal SiC ingot held on the holding surface of the chuck table. The chuck table includes a porous material making up the holding surface and a glass frame made of a non-porous material and having a recess defined therein and receiving the porous material fitted therein, and a negative pressure transfer path for transferring a negative pressure to the porous material fitted in the recess.

A system comprising a beam source (110) and an optical system (304) comprising first and second portions. The system further comprises first and second torque motors integrated into respective ones of the first and second portions, The first torque motor (420) is configured to rotate first portion (416) around a first axis (434). The second torque motor (426) is configured to rotate second portion (418) around a second axis (436). The first axis is perpendicular to the second axis.

A wafer producing apparatus detects a facet area from an upper surface of an SiC ingot, sets X and Y coordinates of plural points lying on a boundary between the facet area and a nonfacet area in an XY plane, and sets a focal point of a laser beam having a transmission wavelength to SiC inside the SiC ingot at a predetermined depth from the upper surface of the SiC ingot. The predetermined depth corresponds to the thickness of the SiC wafer to be produced. A control unit increases the energy of the laser beam and raises a position of the focal point in applying the laser beam to the facet area as compared with the energy of the laser beam and a position of the focal point in applying the laser beam to the nonfacet area, according to the X and Y coordinates.

An optical module includes an optical semiconductor chip having a first surface that includes a laser beam irradiation region and a cleavage region, an optical fiber optically coupled to the first surface, and a support member having a second surface bonded to the first surface, and configured to support the optical fiber. The optical semiconductor chip has an optical signal input and output part located in the cleavage region, and the second surface is bonded to the first surface within the cleavage region.