A chip removing device and a chip removing method are provided. The chip removing device includes: a carrier substrate, a laser generation module, and a blowing module. The carrier substrate carries at least one substrate, and a plurality of chips disposed on the substrate. The laser generation module corresponds to the carrier substrate and is used to apply a laser beam to the chip to reduce the bonding force between the chip and the substrate. The blowing module is disposed above the carrier substrate and close to the substrate for applying a gas to the chip to blow the chip away from the substrate.

A directed energy deposition nozzle assembly including (1) a nozzle configured to dispense material for directed energy deposition, wherein the material comprises one or more of metallic powder, ceramic powder, and glass powder, and wherein (a) the nozzle has an orifice through which the material exits the nozzle, wherein the nozzle comprises an inner body and an outer body that is peripherally disposed around the inner body, and wherein the orifice is defined by a gap between the inner body and the outer body, or (b) the nozzle comprises a plurality of orifices through which the material exits the nozzle, and (2) a vibrator configured to apply a vibration to the nozzle.

An assembly for rapid manufacturing of symmetrical objects by direct metal deposition is disclosed. A rotary stage provides rotational movement to an object supported by the stage around a central stage axis. Nozzles are spaced above the rotary stage for performing direct metal deposition for building an object supported by the stage. Each nozzle is independently moveable along a horizontal axis and independently pivotable, and combined, moveable along a vertical axis for providing symmetrical movement corresponding to a symmetrical deposition configuration of the object while the object is rotated around the central stage axis.

A processing machine for processing a workpiece with a processing beam includes a nozzle changer and a protective enclosure. The nozzle change is for mounting nozzles on or demounting nozzles from a processing head of the processing machine. The nozzle changer has multiple nozzle holders for holding nozzles. The protective enclosure is configured to close off a working space for the processing of the workpiece with the processing beam from a working space surrounding area. The nozzle changer is movable between a nozzle changing position within the protective enclosure and a setup position outside the protective enclosure.

A method of monitoring an additive manufacturing process in which one or more energy beams are used to selectively fuse a powder to form a workpiece, in the presence of one or more plumes generated by interaction of the one or more energy beams with the powder. The method includes using at least one sensor to generate at least one signal representative of a trajectory of one or more of the plumes.

A method of monitoring an additive manufacturing process in which one or more energy beams are used to selectively fuse a powder to form a workpiece, in the presence of one or more plumes generated by interaction of the one or more energy beams with the powder. The method includes using at least one sensor to generate at least one signal representative of a trajectory of one or more of the plumes.

An optical module for a machine for machining workpieces and/or for producing molded bodies by way of location-selective solidification of material powder into contiguous regions by a laser beam includes a housing for releasably fastening the optical module to the machine and a collimation optics changer releasably arranged in the housing, having at least two collimation optics which can be moved into a beam path of the laser beam for collimating the laser beam. The collimation optics changer has a mechanism for automatically changing the collimation optics.

A processing system includes: a processing apparatus for processing an object; a rotation apparatus for rotating a holding part holding the object; a movement apparatus for moving at least one of the processing apparatus and the holding part; a measurement apparatus for measuring at least a part of the object held by the holding part; and a control apparatus for controlling the movement apparatus and the rotation apparatus based on a measured result by the measurement apparatus to rotate the holding part and to move at least one of the processing apparatus and the holding part

A laser processing system that can effectively blow out a material of a workpiece melted by a laser beam by effectively utilizing an assist gas emitted from a nozzle. The laser processing system comprising a nozzle including an emission opening configured to emit a jet of an assist gas along an optical axis of a laser beam, the nozzle being configured to form a maximum point of velocity of the jet at a position away from the emission opening; a measuring instrument configured to measure a sound generated by the jet impinging on an object; and a position acquisition section configured to acquire information representing the position of the maximum point based on output data of the measuring instrument.

A laser processing system that can effectively blow out a material of a workpiece melted by a laser beam by effectively utilizing an assist gas emitted from a nozzle. The laser processing system comprising a nozzle including an emission opening configured to emit a jet of an assist gas along an optical axis of a laser beam, the nozzle being configured to form a maximum point of velocity of the jet at a position away from the emission opening; a measuring instrument configured to measure a sound generated by the jet impinging on an object; and a position acquisition section configured to acquire information representing the position of the maximum point based on output data of the measuring instrument.