Cable foil tape having random or pseudo-random patterns or long pattern lengths of discontinuous metallic shapes and a method for manufacturing such patterned foil tape are provided. In some embodiments, a laser ablation system is used to selectively remove regions or paths in a metallic layer of a foil tape to produce random distributions of randomized shapes, or pseudo-random patterns or long pattern lengths of discontinuous shapes in the metal layer. In some embodiments, the foil tape is double-sided, having a metallic layer on each side of the foil tape, and the laser ablation system is capable of ablating nonconductive pathways into the metallic layer on both sides of the foil tape.

Cable foil tape having random or pseudo-random patterns or long pattern lengths of discontinuous metallic shapes and a method for manufacturing such patterned foil tape are provided. In some embodiments, a laser ablation system is used to selectively remove regions or paths in a metallic layer of a foil tape to produce random distributions of randomized shapes, or pseudo-random patterns or long pattern lengths of discontinuous shapes in the metal layer. In some embodiments, the foil tape is double-sided, having a metallic layer on each side of the foil tape, and the laser ablation system is capable of ablating nonconductive pathways into the metallic layer on both sides of the foil tape.

An example laser tool is configured to operate within a wellbore of a hydrocarbon-bearing rock formation. The laser tool includes one or more optical transmission media. The one or more optical transmission media are part of an optical path originating at a laser generator configured to generate a laser beam having an axis. The one or more optical transmission media are for passing the laser beam. The laser tool includes an optical element that is part of the optical path. The optical element is for receiving the laser beam from the one or more optical transmission media and for output to the hydrocarbon-bearing rock formation. The laser tool includes a color applicator head for discharging one or more coloring agents to a surface in the wellbore in a path of the laser beam.

A method of processing a wafer includes removing a functional layer on projected dicing lines, thereby exposing a substrate, and cutting the wafer along the projected dicing lines where the substrate is exposed, thereby fabricating individual device chips. A laser applying apparatus includes a beam branching unit for branching a laser beam spot into at least two slender spots spaced from each other in a processing direction along the projected dicing lines, and orienting longer sides of the slender spots transversely across the projected dicing lines and shorter sides of the slender spots in the processing direction. A wafer region processed by the laser beams is expanded by moving the at least two slender spots from the beam branching unit in such a manner as to make the longer sides of the slender spots shifted in opposite directions transversely across the projected dicing lines.

A method of processing a wafer includes removing a functional layer on projected dicing lines, thereby exposing a substrate, and cutting the wafer along the projected dicing lines where the substrate is exposed, thereby fabricating individual device chips. A laser applying apparatus includes a beam branching unit for branching a laser beam spot into at least two slender spots spaced from each other in a processing direction along the projected dicing lines, and orienting longer sides of the slender spots transversely across the projected dicing lines and shorter sides of the slender spots in the processing direction. A wafer region processed by the laser beams is expanded by moving the at least two slender spots from the beam branching unit in such a manner as to make the longer sides of the slender spots shifted in opposite directions transversely across the projected dicing lines.

Cable foil tape having random or pseudo-random patterns or long pattern lengths of discontinuous metallic shapes and a method for manufacturing such patterned foil tape are provided. In some embodiments, a laser ablation system is used to selectively remove regions or paths in a metallic layer of a foil tape to produce random distributions of randomized shapes, or pseudo-random patterns or long pattern lengths of discontinuous shapes in the metal layer. In some embodiments, the foil tape is double-sided, having a metallic layer on each side of the foil tape, and the laser ablation system is capable of ablating nonconductive pathways into the metallic layer on both sides of the foil tape.

Cable foil tape having random or pseudo-random patterns or long pattern lengths of discontinuous metallic shapes and a method for manufacturing such patterned foil tape are provided. In some embodiments, a laser ablation system is used to selectively remove regions or paths in a metallic layer of a foil tape to produce random distributions of randomized shapes, or pseudo-random patterns or long pattern lengths of discontinuous shapes in the metal layer. In some embodiments, the foil tape is double-sided, having a metallic layer on each side of the foil tape, and the laser ablation system is capable of ablating nonconductive pathways into the metallic layer on both sides of the foil tape.

A pre-coated steel substrate coated with optionally, an anticorrosion coating and a pre-coating including at least one titanate and at least one nanoparticle, the steel substrate having a reflectance higher or equal to 60% at wavelengths between 6.0 and 15.0 μm.

Methods for laser bonding optical elements to substrates and optical assemblies are disclosed. According to one embodiment, a method of bonding an optical element to a substrate includes disposing at least one optical element onto a surface of the substrate, electrostatically affixing the at least one optical element to the surface of the substrate, and directing a laser beam into the at least one optical element. The laser beam heats an interface between at least one optical element and the substrate to a temperature that is higher than a lowest temperature of the optical element change temperature and the substrate change temperature, thereby forming a bond between at least one optical element and the substrate at a bond area. The laser beam has a fluence that does not modify the substrate at areas of the substrate that are outside of the at least one optical element.

Methods for laser bonding optical elements to substrates and optical assemblies are disclosed. According to one embodiment, a method of bonding an optical element to a substrate includes disposing at least one optical element onto a surface of the substrate, electrostatically affixing the at least one optical element to the surface of the substrate, and directing a laser beam into the at least one optical element. The laser beam heats an interface between at least one optical element and the substrate to a temperature that is higher than a lowest temperature of the optical element change temperature and the substrate change temperature, thereby forming a bond between at least one optical element and the substrate at a bond area. The laser beam has a fluence that does not modify the substrate at areas of the substrate that are outside of the at least one optical element.