A substrate having a first surface with at least one division line and an opposite second surface is processed by attaching a protective sheeting to the first surface and applying a laser beam to the protective sheeting to form a plurality of alignment marks in the protective sheeting. The substrate has a backside layer on the second surface. A laser beam is applied to the substrate from the side of the first surface. The substrate is transparent to the laser beam and the focal point of the laser beam is located inside the substrate which is closer to the second surface than to the first surface, to form a plurality of alignment marks in the backside layer. Substrate material is removed along the division line from the side of the second surface. The alignment marks are used for aligning the substrate material removing means relative to the division line.

A method for cleaning a graphite-based sample includes (A) providing a graphite-based sample that includes a graphite layer and a non-graphite layer covering the graphite layer; (B) adjusting parameters of a laser beam so that the laser beam has a wavelength ranging from 1000 nm to 1200 nm and a peak power ranging from 0.5 mW to 5 mW; and (C) irradiating the non-graphite layer with the laser beam so that the non-graphite layer absorbs an energy of the laser beam and is removed from the graphite layer. A laser apparatus for cleaning a graphite-based sample is also provided.

A method for cleaning a graphite-based sample includes (A) providing a graphite-based sample that includes a graphite layer and a non-graphite layer covering the graphite layer; (B) adjusting parameters of a laser beam so that the laser beam has a wavelength ranging from 1000 nm to 1200 nm and a peak power ranging from 0.5 mW to 5 mW; and (C) irradiating the non-graphite layer with the laser beam so that the non-graphite layer absorbs an energy of the laser beam and is removed from the graphite layer. A laser apparatus for cleaning a graphite-based sample is also provided.

A manufacturing method of a processed resin substrate includes: preparing a resin substrate including a resin layer and a metal layer that covers at least a part of one surface of the resin layer; and forming a through hole in the resin substrate by irradiating the resin substrate with pulsed laser light. In the forming of the through hole, an interval of irradiation of the pulsed laser light at each point on the resin substrate is 5 msec or more.

A manufacturing method of a processed resin substrate includes: preparing a resin substrate including a resin layer and a metal layer that covers at least a part of one surface of the resin layer; and forming a through hole in the resin substrate by irradiating the resin substrate with pulsed laser light. In the forming of the through hole, an interval of irradiation of the pulsed laser light at each point on the resin substrate is 5 msec or more.

A grain-oriented electrical steel sheet incudes a groove formed on a surface and a solidified alloy layer formed under the groove, wherein the solidified alloy layer includes particles of a certain average diameter.

A pre-coated metallic substrate wherein a bare metallic substrate having a reflectance higher or equal to 60% at all wavelengths between 0.5 and 5.0 μm is coated with a pre-coating including at least one titanate and at least one nanoparticle; a method for the manufacture of this pre-coated metallic substrate; a method for the manufacture of a coated metallic substrate and a coated metallic substrate.

A pre-coated metallic substrate wherein a bare metallic substrate having a reflectance higher or equal to 60% at all wavelengths between 0.5 and 5.0 μm is coated with a pre-coating including at least one titanate and at least one nanoparticle; a method for the manufacture of this pre-coated metallic substrate; a method for the manufacture of a coated metallic substrate and a coated metallic substrate.

A method for processing a transparent workpiece comprises forming an optically modified region in or on a transparent workpiece and forming a contour in the transparent workpiece, the contour comprising a plurality of defects in the transparent workpiece positioned laterally offset from the optically modified region. Forming the contour comprises directing a primary laser beam comprising a quasi-non diffracting beam oriented along a beam pathway onto the transparent workpiece such that a first caustic portion of the primary laser beam is directed into the transparent workpiece, thereby generating an induced absorption within the transparent workpiece to produce a defect within the transparent workpiece and a second caustic portion of the primary laser beam is modified by the optically modified region. Further, translating the transparent workpiece and the primary laser beam relative to each other along a contour line and laterally offset from the optically modified region.

A method for processing a transparent workpiece comprises forming an optically modified region in or on a transparent workpiece and forming a contour in the transparent workpiece, the contour comprising a plurality of defects in the transparent workpiece positioned laterally offset from the optically modified region. Forming the contour comprises directing a primary laser beam comprising a quasi-non diffracting beam oriented along a beam pathway onto the transparent workpiece such that a first caustic portion of the primary laser beam is directed into the transparent workpiece, thereby generating an induced absorption within the transparent workpiece to produce a defect within the transparent workpiece and a second caustic portion of the primary laser beam is modified by the optically modified region. Further, translating the transparent workpiece and the primary laser beam relative to each other along a contour line and laterally offset from the optically modified region.