Embodiments are directed to a method for processing a film, which includes: (A) a step wherein protective films are temporarily bonded to both surfaces of a film that is a material to be processed, thereby obtaining a film to be processed to both surfaces of which the protective films are bonded; and (B) a step wherein the film to be processed to both surfaces of which the protective films are bonded is cut using a laser having a wavelength at which the protective films have an absorbance of 50% or more. Other embodiments are directed to a method for processing a film, which includes: (A) a step wherein protective films are temporarily bonded to both surfaces of a film that is a material to be processed, thereby obtaining a film to be processed to both surfaces of which the protective films are bonded; and (B) a step wherein the film to be processed to both surfaces of which the protective films are bonded is cut using a laser having a wavelength at which the film to be processed has an absorbance of 50% or more and the protective films have an absorbance of 50% or more.

A system and a method for laser-driven propulsion, comprising transferring momentum to a projectile through a low-density material at laser fluences below plasma ablation threshold, the method comprising providing a metal layer having a first surface and a second opposite surface; providing a low density layer having a first surface and a second opposite surface; positioning the low density layer with the first surface thereof in direct contact with the second surface of the metal layer; positioning a projectile on the second surface of the low density layer; and heating the metal layer with laser pulses to temperatures below the liquefaction and ionization thresholds of the metal.

A laser marker includes: a base including: a first guide portion; and a restriction part; a laser oscillator configured to emit laser light, the laser oscillator being removably mounted to the base by sliding in a mounting direction with being placed on the base, the laser oscillator including: a second guide portion extending in the mounting direction, the second guide portion being configured to be engaged with the first guide portion; a contact part configured to be in contact with the restriction part in a case the laser oscillator is mounted to the base; and an expander; and a scanner having an insertion part, the expander being inserted into the insertion part in a case the laser oscillator is mounted to the scanner, and the scanner being configured to scan the laser light emitted from the laser oscillator.

A laser marker includes: a base including: a first guide portion; and a restriction part; a laser oscillator configured to emit laser light, the laser oscillator being removably mounted to the base by sliding in a mounting direction with being placed on the base, the laser oscillator including: a second guide portion extending in the mounting direction, the second guide portion being configured to be engaged with the first guide portion; a contact part configured to be in contact with the restriction part in a case the laser oscillator is mounted to the base; and an expander; and a scanner having an insertion part, the expander being inserted into the insertion part in a case the laser oscillator is mounted to the scanner, and the scanner being configured to scan the laser light emitted from the laser oscillator.

A workpiece processing method includes holding a workpiece unit on a holding table and forming a division start point. The workpiece unit has a workpiece having a front side and a back side, and an additional member formed on the back side of the workpiece. The additional member is different in material from the workpiece. The workpiece unit is held on the holding table with the additional member opposed to the holding table. The division start point is formed by applying a laser beam to the front side of the workpiece with the focal point of the laser beam set inside the workpiece. The laser beam forms a modified layer inside the workpiece and simultaneously forming a division start point inside the additional member due to the leakage of the laser beam from the focal point toward the back side of the workpiece.

A workpiece processing method includes holding a workpiece unit on a holding table and forming a division start point. The workpiece unit has a workpiece having a front side and a back side, and an additional member formed on the back side of the workpiece. The additional member is different in material from the workpiece. The workpiece unit is held on the holding table with the additional member opposed to the holding table. The division start point is formed by applying a laser beam to the front side of the workpiece with the focal point of the laser beam set inside the workpiece. The laser beam forms a modified layer inside the workpiece and simultaneously forming a division start point inside the additional member due to the leakage of the laser beam from the focal point toward the back side of the workpiece.

A laser marking system for marking a predetermined pattern on a workpiece may include a first light source structured to emit first light at a first wavelength; a second light source structured to emit second light at a second wavelength different from the first wavelength and selected to mark a marking surface of the workpiece; beam shaping optics structured to adjust a focal length of the second light; beam steering optics structured to aim the first laser light and the second laser light; a controller configured to control the first light source to emit the first light at the marking surface of the workpiece and control the beam steering optics to aim the second light so as to mark the marking surface of the workpiece and create the first predetermined pattern; and a camera structured to detect first light reflected from the marking surface and record an image.

A laser marking system for marking a predetermined pattern on a workpiece may include a first light source structured to emit first light at a first wavelength; a second light source structured to emit second light at a second wavelength different from the first wavelength and selected to mark a marking surface of the workpiece; beam shaping optics structured to adjust a focal length of the second light; beam steering optics structured to aim the first laser light and the second laser light; a controller configured to control the first light source to emit the first light at the marking surface of the workpiece and control the beam steering optics to aim the second light so as to mark the marking surface of the workpiece and create the first predetermined pattern; and a camera structured to detect first light reflected from the marking surface and record an image.

A method of manufacturing a display device includes attaching a protective film onto a display panel that includes a display area and a pad area, where the protective film includes an adhesive layer and a protective layer disposed on the adhesive layer, half-cutting the protective film along a cutting line between the display area and the pad area such that a total thickness of the protective layer and a partial thickness of the adhesive layer are cut, irradiating a partially cut portion of the adhesive layer with a laser beam along at least a portion of the cutting line, and detaching a portion of the protective film that corresponds to the pad area along the cutting line.

A method of manufacturing a display device includes attaching a protective film onto a display panel that includes a display area and a pad area, where the protective film includes an adhesive layer and a protective layer disposed on the adhesive layer, half-cutting the protective film along a cutting line between the display area and the pad area such that a total thickness of the protective layer and a partial thickness of the adhesive layer are cut, irradiating a partially cut portion of the adhesive layer with a laser beam along at least a portion of the cutting line, and detaching a portion of the protective film that corresponds to the pad area along the cutting line.