Disclosed herein is a protective film forming resin agent to be used for laser processing including a water-soluble resin, and particulates of a metal oxide which are dispersed in an aqueous solution of the resin and a section of which has an elongated shape having a major axis and a minor axis orthogonal to the major axis. The particulates of the metal oxide the section of which has the elongated shape having the major axis and the minor axis orthogonal to the major axis are dispersed in the aqueous solution of the resin. When the aqueous solution is applied to a workpiece to form a protective film on the workpiece and then the workpiece is subjected to laser processing, therefore, absorbance of a laser beam in the protective film is enhanced, so that processing efficiency is enhanced.

Disclosed herein is a protective film forming resin agent to be used for laser processing including a water-soluble resin, and particulates of a metal oxide which are dispersed in an aqueous solution of the resin and a section of which has an elongated shape having a major axis and a minor axis orthogonal to the major axis. The particulates of the metal oxide the section of which has the elongated shape having the major axis and the minor axis orthogonal to the major axis are dispersed in the aqueous solution of the resin. When the aqueous solution is applied to a workpiece to form a protective film on the workpiece and then the workpiece is subjected to laser processing, therefore, absorbance of a laser beam in the protective film is enhanced, so that processing efficiency is enhanced.

An element chip manufacturing method including: preparing a semiconductor substrate including a first layer having a first principal surface, and a second layer having a second principal surface, the first layer provided with element regions, a dicing region, and an alignment mark, wherein the first layer includes a semiconductor layer, and the second layer includes a metal layer adjacent to the semiconductor layer; irradiating a first laser beam absorbed in the metal film and passing through the semiconductor layer, from the second principal surface side to a first region corresponding to the mark; imaging the semiconductor substrate from the second principal surface side with a camera, and then calculating a second region corresponding to the dicing region on the second principal surface; irradiating a second laser beam to the second region from the second principal surface side; and dicing the semiconductor substrate into a plurality of element chips.

An element chip manufacturing method including: preparing a semiconductor substrate including a first layer having a first principal surface, and a second layer having a second principal surface, the first layer provided with element regions, a dicing region, and an alignment mark, wherein the first layer includes a semiconductor layer, and the second layer includes a metal layer adjacent to the semiconductor layer; irradiating a first laser beam absorbed in the metal film and passing through the semiconductor layer, from the second principal surface side to a first region corresponding to the mark; imaging the semiconductor substrate from the second principal surface side with a camera, and then calculating a second region corresponding to the dicing region on the second principal surface; irradiating a second laser beam to the second region from the second principal surface side; and dicing the semiconductor substrate into a plurality of element chips.

A centrifugal blood pump prevents a shaft member from oscillating due to expansion of a pump housing resulting from pressurization of the blood. The centrifugal blood pump is manufactured by assembling a bottom member 21 and a lid member 22, and compressing them in a direction in which the bottom member 21 and the lid member 22 approach each other by a deformation amount along their outer circumferential walls. The lid member and the bottom member are joined while in the compressed state in order to create a preloading force between the shaft member and bearings to resist the expansion due to pressurization of the blood during use.

A centrifugal blood pump prevents a shaft member from oscillating due to expansion of a pump housing resulting from pressurization of the blood. The centrifugal blood pump is manufactured by assembling a bottom member 21 and a lid member 22, and compressing them in a direction in which the bottom member 21 and the lid member 22 approach each other by a deformation amount along their outer circumferential walls. The lid member and the bottom member are joined while in the compressed state in order to create a preloading force between the shaft member and bearings to resist the expansion due to pressurization of the blood during use.

The invention relates to a method for forming a laser-welded connection, in which two parts to be joined (11; 11a, 12; 12a) are connected to one another under the effect of a laser beam (1) in a joining region (30; 30a) to form a weld (2), wherein one part to be joined (11; 11a) consists of a material transparent to laser radiation and the other part to be joined (12; 12a) consists of a material absorbent to laser radiation, and wherein the two parts to be joined (11; 11a, 12; 12a) form a receptacle (25; 25a; 25b) for a component (13; 13a; 13b; 14) separate from the parts to be joined (11; 11a, 12; 12a).

The invention relates to a method for forming a laser-welded connection, in which two parts to be joined (11; 11a, 12; 12a) are connected to one another under the effect of a laser beam (1) in a joining region (30; 30a) to form a weld (2), wherein one part to be joined (11; 11a) consists of a material transparent to laser radiation and the other part to be joined (12; 12a) consists of a material absorbent to laser radiation, and wherein the two parts to be joined (11; 11a, 12; 12a) form a receptacle (25; 25a; 25b) for a component (13; 13a; 13b; 14) separate from the parts to be joined (11; 11a, 12; 12a).

A workpiece-separating device includes: a holding member that detachably holds a workpiece among a layered body in which the workpiece that includes a circuit board and a supporting body that allows laser beams to pass therethrough are layered with each other via a separating layer that peelably alters with absorption of the laser beams; a laser irradiation part that performs irradiation of Gaussian beams pulse-oscillated as the laser beams toward the separating layer through the supporting body of the layered body held by the holding member; and a controlling part that controls an operation of the laser irradiation part, wherein the controlling part controls a distance between centers of the adjacent Gaussian beams of the laser beams pulse-oscillated from the laser irradiation part to be less than three times of a standard deviation when a relationship between a beam diameter and irradiation intensity is assumed as a normal distribution.

A method of making a customized item from a single piece of quartz, the method comprising the steps of providing a piece of quartz of sufficient size and shape to form the item, carving the item out of the single piece of quartz into a desired shape, etching information into the item and applying a coating to the information after the step of etching the information to form the customized item. A customized item is also provided comprising a body formed of a single piece of quartz, the body shaped into a configuration simulating a home or a sports object, and including personalized information etched into the quartz and a coating over the personalized information to enhance visibility.