B23K26/18

DEVICE WITH THREE-DIMENSIONAL OPTOELECTRONIC COMPONENTS FOR LASER CUTTING AND LASER CUTTING METHOD OF SUCH A DEVICE

A device configured for a treatment with a laser, including a support transparent for the laser and at least one optoelectronic circuit including at least one optoelectronic component having a three-dimensional semiconductor element covered with an active layer, the three-dimensional semiconductor element including a base bonded to the support, the device including a region absorbing for the laser resting on the support and surrounding the base.

LASER TREATMENT DEVICE AND LASER TREATMENT METHOD

A device configured for a laser treatment including a substrate transparent for the laser and objects, each object being bonded to the substrate via a photonic crystal.

LASER TREATMENT DEVICE AND LASER TREATMENT METHOD

A device configured for a laser treatment including a substrate transparent for the laser and objects, each object being bonded to the substrate via a photonic crystal.

Method for controlling a fibre drawing facility

The present invention concerns a method of determination of specific points of a rotary fibre forming spinner wheel (10) used in a fibre forming device (1), said method comprising the following steps: obtaining measurements of temperatures of the fibre forming spinner wheel obtained by means of a temperature measuring device (40) adapted to take measurements of temperatures of the spinner wheel at a plurality of angular positions of said measuring device in order to supply data to at least one calculation unit (30, 45) that constructs a curve representing the temperature as a function of the angular position of a temperature measuring device; processing said measurements by effecting a calculation of the second derivative of the curve of the temperature as a function of the angular position by means of a calculation unit (30); searching for at least one specific point for which the second derivative satisfies a predefined condition.

LASER BONDED DEVICES, LASER BONDING TOOLS, AND RELATED METHODS

In one example, a system comprises a laser assisted bonding (LAB) tool. The LAB tool comprises a stage block and a first lateral laser source facing the stage block from a lateral side of the stage block. The stage block is configured to support a substrate and a first electronic component coupled with the substrate, and the first electronic component comprises a first interconnect. The first lateral laser source is configured to emit a first lateral laser beam laterally toward the stage block to induce a first heat on the first interconnect to bond the first interconnect with the substrate. Other examples and related methods are also disclosed herein.

Communication cable including a mosaic tape

Cable foil tape having random or pseudo-random patterns or long pattern lengths of discontinuous metallic shapes and a method for manufacturing such patterned foil tape are provided. In some embodiments, a laser ablation system is used to selectively remove regions or paths in a metallic layer of a foil tape to produce random distributions of randomized shapes, or pseudo-random patterns or long pattern lengths of discontinuous shapes in the metal layer. In some embodiments, the foil tape is double-sided, having a metallic layer on each side of the foil tape, and the laser ablation system is capable of ablating nonconductive pathways into the metallic layer on both sides of the foil tape.

Communication cable including a mosaic tape

Cable foil tape having random or pseudo-random patterns or long pattern lengths of discontinuous metallic shapes and a method for manufacturing such patterned foil tape are provided. In some embodiments, a laser ablation system is used to selectively remove regions or paths in a metallic layer of a foil tape to produce random distributions of randomized shapes, or pseudo-random patterns or long pattern lengths of discontinuous shapes in the metal layer. In some embodiments, the foil tape is double-sided, having a metallic layer on each side of the foil tape, and the laser ablation system is capable of ablating nonconductive pathways into the metallic layer on both sides of the foil tape.

Method of manufacturing protective film agent

A manufacturing method of a protective film agent for laser dicing that includes a solution preparation step of preparing a solution in which at least a water-soluble resin, an organic solvent, and an ultraviolet absorber are mixed; and an ion-exchange treatment step of carrying out ion exchange of sodium ions in the solution by using a cation-exchange resin.

Iron-based sintered body, method for laser-marking the same, and method for manufacturing the same

A method for laser-marking an iron-based sintered body includes a first step of forming with a first laser beam a plurality of dotted recesses with a predetermined depth in an identification mark area of a surface of an iron-based sintered body, and a second step of flattening with a second laser beam the surface within the identification mark area other than the dotted recesses. The first laser beam has an irradiation energy per unit area greater than an irradiation energy per unit area of the second laser beam.

METHOD OF PRINTING LASER MARK AND METHOD OF PRODUCING LASER-MARKED SILICON WAFER
20220331906 · 2022-10-20 · ·

Provided is a laser mark printing method and a method of producing a laser-marked silicon wafer that can reduce the machining strain left around dots constituting a laser mark. In a method of printing a laser mark having a plurality of dots on a silicon wafer, the plurality of dots are formed using laser light having a wavelength in the ultraviolet region.