Methods and products formed thereby that include depositing a light-absorbing particle on a substrate and irradiating the particle with a pulsed laser beam to cause an increase in local temperature of a portion of the substrate contacted by and adjacent to the particle, enabling the particle to penetrate and migrate through the substrate to form a pore. The methods may include additional steps of applying a magnetic field gradient to the particle as the particle is irradiated with the laser beam in order to promote the movement of the particle within the substrate or to direct the movement of the particle within the substrate, and/or the step of filling the pore with a material that provides a functional capability independent of the properties of the substrate.

An optical lens for laser marking includes a first lens (L1), a second lens (L2), and a third lens (L3), which are successively coaxially arranged along a transmission direction of incident light, wherein the first lens (L1) and the second lens (L2) are meniscus lenses, and the third lens (L3) is a biconvex lens; wherein the first lens (L1) has a first surface (S1) and a second surface (S2), the second lens (L2) has a third surface (S3) and a fourth surface (S4), the third lens (L3) has a fifth surface (S5) and a sixth surface (S6); the first surface (S1) to the sixth surface (S6) are successively arranged along the transmission direction of the incident light; wherein radii of curvature of the first surface to the sixth surface are −47±5% mm, ∞, −218±5% mm, −81±5% mm, 778±5% mm, and −142±5% mm, respectively; wherein central thicknesses of the first lens, the second lens, and the third lens are 4±5% mm, 15±5% mm, and 18±5% mm, respectively. The optical lens for laser marking not only has high engraving quality, but also has a high engraving speed with a higher efficiency than conventional engraving lens.

An optical lens for laser marking includes a first lens (L1), a second lens (L2), and a third lens (L3), which are successively coaxially arranged along a transmission direction of incident light, wherein the first lens (L1) and the second lens (L2) are meniscus lenses, and the third lens (L3) is a biconvex lens; wherein the first lens (L1) has a first surface (S1) and a second surface (S2), the second lens (L2) has a third surface (S3) and a fourth surface (S4), the third lens (L3) has a fifth surface (S5) and a sixth surface (S6); the first surface (S1) to the sixth surface (S6) are successively arranged along the transmission direction of the incident light; wherein radii of curvature of the first surface to the sixth surface are −47±5% mm, ∞, −218±5% mm, −81±5% mm, 778±5% mm, and −142±5% mm, respectively; wherein central thicknesses of the first lens, the second lens, and the third lens are 4±5% mm, 15±5% mm, and 18±5% mm, respectively. The optical lens for laser marking not only has high engraving quality, but also has a high engraving speed with a higher efficiency than conventional engraving lens.

A metal sheet holding device for manufacturing a pattern mask used in manufacturing processes of a flat panel displays include a first holder and second holder. The first holder includes an adhesive layer contacting edge portions of a metal sheet, and a first frame supporting the metal sheet using the adhesive layer. The second holder includes a second frame below the first frame, a supported plate positioned at the center of the second frame, and an adhered unit positioned between the central portion of a metal sheet and the supported plate. The adhered unit generates an electrostatic force or a magnetic force to hold the central portion of the metal sheet.

A metal sheet holding device for manufacturing a pattern mask used in manufacturing processes of a flat panel displays include a first holder and second holder. The first holder includes an adhesive layer contacting edge portions of a metal sheet, and a first frame supporting the metal sheet using the adhesive layer. The second holder includes a second frame below the first frame, a supported plate positioned at the center of the second frame, and an adhered unit positioned between the central portion of a metal sheet and the supported plate. The adhered unit generates an electrostatic force or a magnetic force to hold the central portion of the metal sheet.

A system for laser bonding of flip chip, and more particularly, to a system for laser bonding of flip chip for bonding a flip chip-type semiconductor chip to a substrate by using a laser beam is provided. According to the system for laser bonding of flip chip of the present disclosure, by performing laser bonding on a substrate while pressurizing semiconductor chips, even semiconductor chips which are bent or likely to bend may be bonded to the substrate without causing poor contact of solder bumps.

A system for laser bonding of flip chip, and more particularly, to a system for laser bonding of flip chip for bonding a flip chip-type semiconductor chip to a substrate by using a laser beam is provided. According to the system for laser bonding of flip chip of the present disclosure, by performing laser bonding on a substrate while pressurizing semiconductor chips, even semiconductor chips which are bent or likely to bend may be bonded to the substrate without causing poor contact of solder bumps.

A method of cutting a substrate includes: forming a first protective layer on a first surface of the substrate; forming a removal area where a portion of the first protective layer is removed by irradiating the first protective layer at the portion of the first protective layer with a first laser beam; and forming a cutting area by removing a portion of the substrate by irradiating the substrate with a second laser beam at the removal area, after irradiating the first protective layer with the first laser beam.

A method of cutting a substrate includes: forming a first protective layer on a first surface of the substrate; forming a removal area where a portion of the first protective layer is removed by irradiating the first protective layer at the portion of the first protective layer with a first laser beam; and forming a cutting area by removing a portion of the substrate by irradiating the substrate with a second laser beam at the removal area, after irradiating the first protective layer with the first laser beam.

A method is provided for producing a glass or glass ceramic article that includes: providing a sheet-like glass or glass ceramic substrate having two opposite faces, which in the visible spectral range from 380 nm to 780 nm exhibits light transmittance of at least 1% for visible light that passes from one face to the opposite face; providing an opaque coating on one face where the coating exhibits light transmittance of not more than 5% in the visible spectral range from 380 nm to 780 nm; and directing a pulsed laser beam onto the opaque coating and locally removing the coating by ablation down to the surface of the glass or glass ceramic article, repeatedly at different locations, thereby producing a pattern of a multitude of openings defining a perforated area in the opaque coating, so that the opaque coating becomes semi-transparent in the area.