A laser machining method includes a first piercing process of forming a non-through piercing hole extending from a top surface to a central portion of a workpiece; a workpiece cooling process; a second piercing process of making the piercing hole pierce to a bottom surface of the workpiece; and a workpiece cutting process. The second piercing process includes performing piercing by irradiating the workpiece with a laser beam while changing the output of the laser beam from a second output value to a third output value, which is smaller than the first output value and larger than the second output value, the focal position from a first in-focus position to a second in-focus position having a larger in-focus amount than the first in-focus position, and the depth of focus from a second depth deeper than a first depth to a third depth deeper than the second depth.

A medium, a container, an object-holding container, a marking, device, and a method of manufacturing the container. The medium includes an image of design, and the design includes a light color portion and a dark color portion, the light color portion including a light reflecting layer, and the dark color portion including a light attenuation layer The container includes a laser beam source to emit a laser beam, a forming unit to make the laser beam perform marking on a container that has transparency and is colorless or colored, and an adjuster to adjust a marking condition according to information about a to-lie-contained object stored in the container. The method includes irradiating the container with a laser beam to form a light reflecting layer and a light attenuation layer, and the light reflecting layer and the light attenuation layer includes an aggregate of microstructures.

A medium, a container, an object-holding container, a marking, device, and a method of manufacturing the container. The medium includes an image of design, and the design includes a light color portion and a dark color portion, the light color portion including a light reflecting layer, and the dark color portion including a light attenuation layer The container includes a laser beam source to emit a laser beam, a forming unit to make the laser beam perform marking on a container that has transparency and is colorless or colored, and an adjuster to adjust a marking condition according to information about a to-lie-contained object stored in the container. The method includes irradiating the container with a laser beam to form a light reflecting layer and a light attenuation layer, and the light reflecting layer and the light attenuation layer includes an aggregate of microstructures.

A carrier substrate includes a base layer, an antireflection layer, and an energy absorption layer, wherein the antireflection layer is formed on one surface of the base layer and allows an elastic wave generated by a first laser beam transmitted through an element adhesively bonded to the antireflection layer to be transmitted through the base layer without being reflected towards the element, the first laser beam being applied to the element through a source substrate of the element, and the energy absorption layer is formed between the base layer and the antireflection layer to be aligned with the element, and evaporates upon energy absorption.

A carrier substrate includes a base layer, an antireflection layer, and an energy absorption layer, wherein the antireflection layer is formed on one surface of the base layer and allows an elastic wave generated by a first laser beam transmitted through an element adhesively bonded to the antireflection layer to be transmitted through the base layer without being reflected towards the element, the first laser beam being applied to the element through a source substrate of the element, and the energy absorption layer is formed between the base layer and the antireflection layer to be aligned with the element, and evaporates upon energy absorption.

The present invention provides a single-beam double-physical-effect coordinating and distributing method applicable to uniform laser shock and application thereof, and belongs to the technical field of laser shock effect control. The present invention does not stipulate the specific adjusting and distributing mean, and only provides a coordinating principle and method. The present invention gives a universal and systematic method for setting absorption layer feature parameters applicable to mass laser shock uniform peening under a liquid constraint condition, so as to facilitate the relevant technician to quickly obtain the liquid constraint laser shock processing technology conforming to a distribution proportion of its double physical effects, thereby being beneficial to development and application of the laser shock peening treatment, and therefore having the good actual application value.

A process for growing a substrate (24) as a melt pool (28) solidifies beneath a molten slag layer (30). An energy beam (36) is used to melt a powder (32) or a hollow feed wire (42) with a powdered alloy core (44) under the slag layer. The slag layer is at least partially transparent (37) to the energy beam, and it may be partially optically absorbent or translucent to the energy beam to absorb enough energy to remain molten. As with a conventional ESW process, the slag layer insulates the molten material and shields it from reaction with air. A composition of the powder may be changed across a solidification axis (A) of the resulting component (60) to provide a functionally graded directionally solidified product.

A process for growing a substrate (24) as a melt pool (28) solidifies beneath a molten slag layer (30). An energy beam (36) is used to melt a powder (32) or a hollow feed wire (42) with a powdered alloy core (44) under the slag layer. The slag layer is at least partially transparent (37) to the energy beam, and it may be partially optically absorbent or translucent to the energy beam to absorb enough energy to remain molten. As with a conventional ESW process, the slag layer insulates the molten material and shields it from reaction with air. A composition of the powder may be changed across a solidification axis (A) of the resulting component (60) to provide a functionally graded directionally solidified product.

The present embodiments providing methods, systems and apparatuses of protecting a surface during laser machining. In some embodiments, a method of protecting a surface during laser machining comprises: directing a fluid into a cavity of an object being laser machined, where the fluid does not have laser absorption properties; and directing a plurality of laser pulses at a wall of the object being laser machined, where the laser pulses are configured to form a hole through the wall such that at least one laser pulse passes through the hole and enters the cavity while the fluid is directed into the cavity such that the laser pulse is incident on the fluid and a surface together in order to inhibit backwall damage.

The present embodiments providing methods, systems and apparatuses of protecting a surface during laser machining. In some embodiments, a method of protecting a surface during laser machining comprises: directing a fluid into a cavity of an object being laser machined, where the fluid does not have laser absorption properties; and directing a plurality of laser pulses at a wall of the object being laser machined, where the laser pulses are configured to form a hole through the wall such that at least one laser pulse passes through the hole and enters the cavity while the fluid is directed into the cavity such that the laser pulse is incident on the fluid and a surface together in order to inhibit backwall damage.