An example laser tool is configured to operate within a wellbore of a hydrocarbon-bearing rock formation. The laser tool includes one or more optical transmission media. The one or more optical transmission media are part of an optical path originating at a laser generator configured to generate a laser beam having an axis. The one or more optical transmission media are for passing the laser beam. The laser tool includes an optical element that is part of the optical path. The optical element is for receiving the laser beam from the one or more optical transmission media and for output to the hydrocarbon-bearing rock formation. The laser tool includes a color applicator head for discharging one or more coloring agents to a surface in the wellbore in a path of the laser beam.

Disclosed are methods and coatings for protecting the surface of a non-metallic composite part, comprising applying a protective layer to an exposed surface of the non-metallic composite part, the protective layer comprising: (a) a multilayer having at least a co-cured layer applied to the surface of the non-metallic part and laser-sensitive layer applied to a surface of the co-cured layer, wherein the laser-sensitive layer is selected from a reflective layer, an optical sensor layer or a layer having both reflective and optical sensor properties; or (b) a co-cured coating which comprises a laser-sensitive material incorporated therein to form a laser-sensitive co-cured layer applied to a surface of the non-metallic composite part, wherein the laser-sensitive material is selected from a reflective material, an optical sensor material or a combination thereof, such that the non-metallic composite part will be protected from damage during subsequent laser ablation to remove an outer coating.

Disclosed are methods and coatings for protecting the surface of a non-metallic composite part, comprising applying a protective layer to an exposed surface of the non-metallic composite part, the protective layer comprising: (a) a multilayer having at least a co-cured layer applied to the surface of the non-metallic part and laser-sensitive layer applied to a surface of the co-cured layer, wherein the laser-sensitive layer is selected from a reflective layer, an optical sensor layer or a layer having both reflective and optical sensor properties; or (b) a co-cured coating which comprises a laser-sensitive material incorporated therein to form a laser-sensitive co-cured layer applied to a surface of the non-metallic composite part, wherein the laser-sensitive material is selected from a reflective material, an optical sensor material or a combination thereof, such that the non-metallic composite part will be protected from damage during subsequent laser ablation to remove an outer coating.

The invention relates to a method for forming a laser-welded connection, in which two parts to be joined (11; 11a, 12; 12a) are connected to one another under the effect of a laser beam (1) in a joining region (30; 30a) to form a weld (2), wherein one part to be joined (11; 11a) consists of a material transparent to laser radiation and the other part to be joined (12; 12a) consists of a material absorbent to laser radiation, and wherein the two parts to be joined (11; 11a, 12; 12a) form a receptacle (25; 25a; 25b) for a component (13; 13a; 13b; 14) separate from the parts to be joined (11; 11a, 12; 12a).

The invention relates to a method for forming a laser-welded connection, in which two parts to be joined (11; 11a, 12; 12a) are connected to one another under the effect of a laser beam (1) in a joining region (30; 30a) to form a weld (2), wherein one part to be joined (11; 11a) consists of a material transparent to laser radiation and the other part to be joined (12; 12a) consists of a material absorbent to laser radiation, and wherein the two parts to be joined (11; 11a, 12; 12a) form a receptacle (25; 25a; 25b) for a component (13; 13a; 13b; 14) separate from the parts to be joined (11; 11a, 12; 12a).

A manufacturing method of a processed resin substrate includes: preparing a resin substrate including a resin layer and a metal layer that covers at least a part of one surface of the resin layer; and forming a through hole in the resin substrate by irradiating the resin substrate with pulsed laser light. In the forming of the through hole, an interval of irradiation of the pulsed laser light at each point on the resin substrate is 5 msec or more.

A manufacturing method of a processed resin substrate includes: preparing a resin substrate including a resin layer and a metal layer that covers at least a part of one surface of the resin layer; and forming a through hole in the resin substrate by irradiating the resin substrate with pulsed laser light. In the forming of the through hole, an interval of irradiation of the pulsed laser light at each point on the resin substrate is 5 msec or more.

Compositions and methods useful for the singulation of fragile devices from substrates by the process of plasma singulation are described. Thermal resistant coatings comprising ingredients that exhibit both thermal resistance and water solubility are demonstrated. These ingredients which have high ultraviolet interaction allow laser interaction to create masks for thin and small devices, for example, substrates that are thin to 150 microns or less or have devices present that are measured 1 mm on a side or smaller. Methods are presented which apply the composition to the inorganic substrate whereby an ultraviolet sourced laser interacts with the surface and creates a mask which subsequently is processed in a plasma chamber to separate (singulate) the devices within the substrate and subsequently rinse with water to remove/dissolve the laser interactive and plasma protective layer. Once rinsed and clean, the devices proceed by pick and place tooling to final integration to electronic circuitry. The invention coating is a water rinsable creation that achieves high selectivity for both laser and plasma operations.

Compositions and methods useful for the singulation of fragile devices from substrates by the process of plasma singulation are described. Thermal resistant coatings comprising ingredients that exhibit both thermal resistance and water solubility are demonstrated. These ingredients which have high ultraviolet interaction allow laser interaction to create masks for thin and small devices, for example, substrates that are thin to 150 microns or less or have devices present that are measured 1 mm on a side or smaller. Methods are presented which apply the composition to the inorganic substrate whereby an ultraviolet sourced laser interacts with the surface and creates a mask which subsequently is processed in a plasma chamber to separate (singulate) the devices within the substrate and subsequently rinse with water to remove/dissolve the laser interactive and plasma protective layer. Once rinsed and clean, the devices proceed by pick and place tooling to final integration to electronic circuitry. The invention coating is a water rinsable creation that achieves high selectivity for both laser and plasma operations.

A wafer processing method includes a modified layer forming step of applying a laser beam of a wavelength having transmitting property to a wafer with a focusing point of the laser beam positioned inside the wafer at positions corresponding to division lines, thereby to form modified layers, and a back side grinding step of holding the wafer on a chuck table of a grinding apparatus, grinding a back side of the wafer to thin the wafer, and dividing the wafer into individual device chips from cracks that are generated from the modified layers formed inside the wafer along the division lines to the division lines formed on a front side of the wafer. In the modified layer forming step, in a case where triangular chips each having a surface area smaller than the device chips are to be formed, the application of the laser beam is stopped in a region where the triangular chips are to be formed.